JPS6368651A - Electromagnetic wave shielding polystyrene resin composition - Google Patents
Electromagnetic wave shielding polystyrene resin compositionInfo
- Publication number
- JPS6368651A JPS6368651A JP21068386A JP21068386A JPS6368651A JP S6368651 A JPS6368651 A JP S6368651A JP 21068386 A JP21068386 A JP 21068386A JP 21068386 A JP21068386 A JP 21068386A JP S6368651 A JPS6368651 A JP S6368651A
- Authority
- JP
- Japan
- Prior art keywords
- polystyrene resin
- wave shielding
- electromagnetic wave
- glass fiber
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005990 polystyrene resin Polymers 0.000 title claims abstract description 16
- 239000011342 resin composition Substances 0.000 title claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000003365 glass fiber Substances 0.000 claims abstract description 13
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 10
- 239000010439 graphite Substances 0.000 claims abstract description 9
- 239000006229 carbon black Substances 0.000 claims abstract description 6
- 230000000694 effects Effects 0.000 abstract description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 7
- 238000002156 mixing Methods 0.000 abstract description 7
- 229910052782 aluminium Inorganic materials 0.000 abstract description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 5
- 239000002131 composite material Substances 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052759 nickel Inorganic materials 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 238000007772 electroless plating Methods 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 9
- 239000000835 fiber Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 239000013256 coordination polymer Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000006232 furnace black Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000006231 channel black Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- OPXJEFFTWKGCMW-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Ni].[Cu] OPXJEFFTWKGCMW-UHFFFAOYSA-N 0.000 description 1
- -1 etc. can be used Chemical compound 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000006234 thermal black Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電磁波遮蔽効果の高いポリスチレン樹脂組成物
に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a polystyrene resin composition having a high electromagnetic wave shielding effect.
最近、電子機器の発達によって、電子機器とその周辺の
電磁環境の関連における問題が発生しつつある。これら
の原因としては、超ＬＳＩなどの大規模集積回路技術の
発達によりマイクロコンピュータ−などを内蔵する機器
が増加したこと、及び電子機器筐体が、量産性、経済性
、軽量性の点からプラスチック化していることにより、
電子機器の置かれる電磁環境が多様化したことによるも
のと考えられている。これらの電子機器（コンピュータ
ー、事務機器、家電製品など）は、高集積化により信号
レベルが小さくなり、それだけに雑音の影響を受は易く
なっている。2. Description of the Related Art Recently, with the development of electronic devices, problems related to the electromagnetic environment surrounding the electronic devices are occurring. This is due to the fact that the number of devices with built-in microcomputers has increased due to the development of large-scale integrated circuit technology such as VLSI, and the housing of electronic devices is now made of plastic for reasons of mass production, economy, and light weight. Due to the fact that
This is thought to be due to the diversification of the electromagnetic environment in which electronic devices are placed. These electronic devices (computers, office equipment, home appliances, etc.) have lower signal levels due to higher integration, and are therefore more susceptible to noise.
又反面、これらの機器中の素子や電子回路は、それ自体
発振機能を持っているので外部にノイズを出し、電磁障
害の原因ともなっている。これらの問題の対策としては
、ノイズに対して影響を受けない様な電子回路の改良も
あるが、やはりこれ−らの電子機器を包囲する筐体部分
に電子波遮蔽効果を持たせることが必要とある。On the other hand, since the elements and electronic circuits in these devices themselves have an oscillation function, they emit noise to the outside and cause electromagnetic interference. As a countermeasure to these problems, there is the improvement of electronic circuits that are not affected by noise, but it is still necessary to provide an electronic wave shielding effect to the casing that surrounds these electronic devices. a.
而して、筐体の素材である合成樹脂に電磁波遮蔽性を付
与するために多くの対策がなされている。Therefore, many measures have been taken to provide electromagnetic wave shielding properties to the synthetic resin that is the material of the housing.
これらの対策としては、大きく別けると、プラスチック
成形品表面に、メッキ、塗装、溶射、箔接着等により、
導電性皮膜を後加工でコーティングする方法と、導電性
充填材をプラスチック中に混合し複合材としたものを形
成する方法とがある。Broadly speaking, these countermeasures include plating, painting, thermal spraying, foil adhesion, etc. on the surface of plastic molded products.
There is a method in which a conductive film is coated in a post-processing process, and a method in which a conductive filler is mixed into plastic to form a composite material.
しかし、前者の方法では、落下衝撃、経時変化、熱ショ
ック等により導電性皮膜が剥離・脱落する恐れがあり、
電磁波遮蔽効果が低下するのみなちす、剥離片が電子回
路上に落下し機器の破損、感電、火災等を引き起こす恐
れがある。However, with the former method, there is a risk that the conductive film will peel off or fall off due to drop impact, aging, thermal shock, etc.
Not only will the electromagnetic wave shielding effect be reduced, but peeled pieces may fall onto electronic circuits, causing equipment damage, electric shock, fire, etc.
一方、後者の方法では、導電性充填材として、黒鉛、カ
ーボンブラック、カーボンファイバー、銀粉、銅粉、ニ
ッケル粉、ステンレス粉、ステンレス繊維、アルミニウ
ムフレーク、アルミニウムリボン、アルミニウム繊維、
黄銅繊維、アルミニウム被覆ガラス繊維、ニッケル被覆
ガラス繊維等が検討されているが、十分な電磁波遮蔽性
を得るまで混入率を増大させると、成形品の機械強度が
低下する場合が多く、又合成樹脂に均一に混合して十分
な電磁波遮蔽効果を持たせることは容易ではない。On the other hand, in the latter method, the conductive fillers include graphite, carbon black, carbon fiber, silver powder, copper powder, nickel powder, stainless steel powder, stainless steel fiber, aluminum flake, aluminum ribbon, aluminum fiber,
Brass fibers, aluminum-coated glass fibers, nickel-coated glass fibers, etc. are being considered, but if the mixing rate is increased until sufficient electromagnetic wave shielding properties are achieved, the mechanical strength of the molded product often decreases, and synthetic resins It is not easy to mix them uniformly to provide a sufficient electromagnetic shielding effect.
それ故、最近は少量で効果の得られるステンレス、黄銅
、銅等の繊維が主として検討されているが、これら金属
繊維を配合したものは、成形時の繊維の配向による抵抗
値のばらつきや成形性の悪化をもたらす。Therefore, recently, fibers made of stainless steel, brass, copper, etc., which are effective in small amounts, have been mainly studied, but products containing these metal fibers have problems with variations in resistance value due to fiber orientation during molding, and moldability. resulting in deterioration of
本発明は、斯かる従来技術の欠点を払拭した、広い周波
数帯域で電磁波遮蔽効果を有する組成物を得ることを目
的とする。The present invention aims to eliminate the drawbacks of the prior art and to obtain a composition that has an electromagnetic wave shielding effect over a wide frequency band.
本発明者らは鋭意研究の結果、ポリスチレン樹脂に高導
電性ガラス繊維、カーボンブランク及び黒鉛を混入して
複合化することにより上記目的を達成した。As a result of intensive research, the present inventors achieved the above object by mixing highly conductive glass fiber, carbon blank, and graphite into polystyrene resin to form a composite.
而して、本発明は、ポリスチレン樹脂１００重量部に対
して、高導電性ガラス繊維３０〜１５０重量部、カーボ
ンブラック５〜２０重量部及び黒鉛５〜２０重量部を配
合してなる電磁波遮蔽用ポリスチレン樹脂組成物である
。Accordingly, the present invention provides an electromagnetic wave shielding material comprising 30 to 150 parts by weight of highly conductive glass fiber, 5 to 20 parts by weight of carbon black, and 5 to 20 parts by weight of graphite to 100 parts by weight of polystyrene resin. It is a polystyrene resin composition.
本発明で使用するポリスチレン樹脂としては、ＣＰタイ
プ、ＨＩタイプ、ＭＩタイプの何れでもよいが、特に高
流動性のものが好ましい。The polystyrene resin used in the present invention may be of the CP type, HI type, or MI type, but those with high fluidity are particularly preferred.
本発明で使用する高導電性ガラス繊維とは、ガラス繊維
表面に無電解メッキ、蒸着等により銅、アルミニウム、
ニッケル等の単体または複合物を被覆したものであるが
、配合量が前記の範囲を超えると押出作業性が低下し、
又この範囲未満では十分を電磁波遮蔽性が得られない。The highly conductive glass fiber used in the present invention is made by electroless plating, vapor deposition, etc. on the surface of the glass fiber.
It is coated with a single substance or a composite material such as nickel, but if the blending amount exceeds the above range, extrusion workability will decrease.
Further, below this range, sufficient electromagnetic wave shielding properties cannot be obtained.
本発明で使用するカーボンブランクとしては、サーマル
ブラック、チャンネルブラック、アセチレンブラック、
ケッチェンブラック、ファーネスブラック等が使用でき
、特にファーネスブラックが好ましいが、配合量が前記
の範囲を超えると押出作業性が低下し、又この範囲未満
では十分を電磁波遮蔽性が得られない。Carbon blanks used in the present invention include thermal black, channel black, acetylene black,
Ketjen black, furnace black, etc. can be used, and furnace black is particularly preferred; however, if the blending amount exceeds the above range, extrusion workability will be reduced, and if it is below this range, sufficient electromagnetic wave shielding properties will not be obtained.
本発明で使用する黒鉛としては、天然、人工のいずれで
も、又鱗片状、土塊状のいずれでも使用でき、特に天然
鱗片状黒鉛が好ましいが、配合量が前記の範囲を超える
と押出作業性が低下し、又この範囲未満では十分を電磁
波遮蔽性が得られない。The graphite used in the present invention may be either natural or artificial, and may be in the form of flakes or lumps. Natural flaky graphite is particularly preferred, but if the blending amount exceeds the above range, extrusion workability may deteriorate. Moreover, below this range, sufficient electromagnetic wave shielding performance cannot be obtained.
以上に述べた各成分の混合は、種々の方法によって行う
ことが出来るが、通常のベント式押出機又は類似の装置
を使用し、ポリスチレン樹脂の融点より５〜５０℃高い
温度で溶融混練する方法が適当である。The above-mentioned components can be mixed by various methods, including melt-kneading at a temperature of 5 to 50°C higher than the melting point of the polystyrene resin using a normal vented extruder or similar equipment. is appropriate.
本発明のポリスチレン樹脂組成物は、通常の添加剤、例
えば、酸化、熱、紫外線等による劣化に対する安定剤若
しくは防止剤、可塑剤、難燃剤、帯電防止剤、滑剤等を
、本発明の組成物の物性に悪影響を与えない範囲で、一
種又は二種以上添加することが出来る。The polystyrene resin composition of the present invention contains conventional additives such as stabilizers or inhibitors against deterioration due to oxidation, heat, ultraviolet rays, etc., plasticizers, flame retardants, antistatic agents, lubricants, etc. One or more types can be added as long as they do not adversely affect the physical properties of the material.
本発明のポリスチレン樹脂組成物は、高導電性ガラス繊
維、カーボンブラック及び黒鉛の相乗作用により、広い
周波数帯域で電磁波遮蔽効果を有するものである。従っ
て本発明のポリスチレン樹脂組成物は、電子機器を包囲
する筐体部分の材料として極めて有用である。The polystyrene resin composition of the present invention has an electromagnetic wave shielding effect in a wide frequency band due to the synergistic effect of highly conductive glass fiber, carbon black, and graphite. Therefore, the polystyrene resin composition of the present invention is extremely useful as a material for a housing portion surrounding an electronic device.
〔実施例〕 以下、実施例により本発明を説明する。〔Example〕 The present invention will be explained below with reference to Examples.
尚、実施例中「部」は、重量部を表す。又物性試験は、
下記の方法で行った。In addition, "parts" in the examples represent parts by weight. In addition, the physical property test is
This was done using the following method.
（１） 引張強度：ＡＳＴＭ Ｄ６３８（２）
引張伸び：ＡＳＴＭ Ｄ６３８（３）引張弾性率：Ａ
ＳＴＭ Ｄ６３８（４）曲げ強度：ＡＳＴＭ Ｄ７
９０（５）曲げ弾性率：ＡＳＴＭ Ｄ７９０（６）
アイゾツト衝撃強度；ＡＳＴＭ Ｄ２５６（７）熱
変形温度：ＡＳＴＭ Ｄ６４Ｂ（８）体積固有抵抗：
ＡＳＴＭ Ｄ２５７（９）電磁シールド性：アドバン
テスト法実施例１
ポリスチレン樹脂（出光石油化学株式会社製出光スチロ
ールＨＦｌ０）１００部、繊維長３〜６鶴、比抵抗値１
０づ〜１０−ＳΩ・口のニッケルー銅−ニッケル三層被
覆ガラス繊維（旭ファイバーグラス株式会社製、エミテ
フク）１０６部、天然鱗片状黒鉛粉（日本黒鉛株式会社
製、特ＣＰ）１５部及び高導電性ファーネスブラック（
キャボフト コーポレーション社製、パルカンＸＣ−７
２）１５部を車軸ベント式押出機を用い、シリンダ一温
度２３０℃で溶融混練してストランド状に押出した後、
水浴で冷却しベレット状に切断後、乾燥してポリスチレ
ン樹脂組成物を得た。このペレットを樹脂温度２１０℃
、金型温度５０℃、射出及び保圧時間１０秒、冷却時間
２０秒、射出圧力８００〜１０００ ｋｇ／ｃｍ”の条
件で射出成形して試験片を得、物性試験に供した。(1) Tensile strength: ASTM D638 (2)
Tensile elongation: ASTM D638 (3) Tensile modulus: A
STM D638 (4) Bending strength: ASTM D7
90(5) Flexural modulus: ASTM D790(6)
Izot impact strength: ASTM D256 (7) Heat distortion temperature: ASTM D64B (8) Volume resistivity:
ASTM D257 (9) Electromagnetic shielding property: Advantest method Example 1 100 parts of polystyrene resin (Idemitsu Styrene HFl0 manufactured by Idemitsu Petrochemical Co., Ltd.), fiber length 3 to 6 strands, specific resistance value 1
106 parts of nickel-copper-nickel three-layer coated glass fiber (manufactured by Asahi Fiberglass Co., Ltd., Emitefuku), 15 parts of natural flaky graphite powder (manufactured by Nippon Graphite Co., Ltd., special CP) and high Conductive Furnace Black (
Manufactured by Caboft Corporation, Palkan XC-7
2) After melting and kneading 15 parts using an axle vent extruder at a cylinder temperature of 230°C and extruding it into a strand,
The mixture was cooled in a water bath, cut into pellets, and dried to obtain a polystyrene resin composition. This pellet was heated to a resin temperature of 210°C.
A test piece was obtained by injection molding under the following conditions: a mold temperature of 50° C., an injection and pressure holding time of 10 seconds, a cooling time of 20 seconds, and an injection pressure of 800 to 1000 kg/cm'', which were subjected to physical property tests.
その結果は、第１表に記載した通りであった。The results were as listed in Table 1.
実施例２〜３
第１表に記載した如くに、構成成分の配合比率を変えた
以外は、実施例１と同様に実施した。Examples 2 to 3 The same procedure as in Example 1 was carried out except that the blending ratio of the constituent components was changed as shown in Table 1.
その結果は第１表に記載した通りであった。The results were as listed in Table 1.
Claims (1)
性ガラス繊維３０〜１５０重量部、カーボンブラック５
〜２０重量部及び黒鉛５〜２０重量部を配合してなる電
磁波遮蔽用ポリスチレン樹脂組成物(1) 100 parts by weight of polystyrene resin, 30 to 150 parts by weight of highly conductive glass fiber, 5 parts by weight of carbon black
Polystyrene resin composition for electromagnetic wave shielding comprising ~20 parts by weight and 5 to 20 parts by weight of graphite
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21068386A JPS6368651A (en) | 1986-09-09 | 1986-09-09 | Electromagnetic wave shielding polystyrene resin composition |
| DE19873700178 DE3700178A1 (en) | 1986-03-31 | 1987-01-05 | ELECTROMAGNETIC SHAFT SHIELDING THERMOPLASTIC RESIN |
| FR878700039A FR2596403B1 (en) | 1986-03-31 | 1987-01-06 | COMPOSITION BASED ON A THERMOPLASTIC RESIN PROTECTING AGAINST ELECTROMAGNETIC WAVES |
| US07/300,210 US5004561A (en) | 1986-03-31 | 1989-01-23 | Electromagnetic wave-shielding thermoplastic resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21068386A JPS6368651A (en) | 1986-09-09 | 1986-09-09 | Electromagnetic wave shielding polystyrene resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6368651A true JPS6368651A (en) | 1988-03-28 |
Family
ID=16593378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21068386A Pending JPS6368651A (en) | 1986-03-31 | 1986-09-09 | Electromagnetic wave shielding polystyrene resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6368651A (en) |
-
1986
- 1986-09-09 JP JP21068386A patent/JPS6368651A/en active Pending
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