JPS63503182A - 金属容器収納微小回路用耐蝕性ピン - Google Patents

金属容器収納微小回路用耐蝕性ピン

Info

Publication number: JPS63503182A
Authority: JP; Japan
Prior art keywords: pin; microcircuit; boss; housed; metal container
Prior art date: 1986-04-21
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP62502133A

Other languages

English (en)

Japanese (ja)

Inventor

シェラー，ジェレミー・ディー

ベイアード，フィリップス

Original Assignee

イージス・インコーポレーテッド

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-04-21

Filing date

1987-03-10

Publication date

1988-11-17

1987-03-10 Application filed by イージス・インコーポレーテッド filed Critical イージス・インコーポレーテッド

1988-11-17 Publication of JPS63503182A publication Critical patent/JPS63503182A/ja

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Lead Frames For Integrated Circuits (AREA)
Connections Arranged To Contact A Plurality Of Conductors (AREA)

JP62502133A 1986-04-21 1987-03-10 金属容器収納微小回路用耐蝕性ピン Pending JPS63503182A (ja)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US85412386A	1986-04-21	1986-04-21
US854,123		1986-04-21

Publications (1)

Publication Number	Publication Date
JPS63503182A true JPS63503182A (ja)	1988-11-17

Family

ID=25317791

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP62502133A Pending JPS63503182A (ja)	1986-04-21	1987-03-10	金属容器収納微小回路用耐蝕性ピン

Country Status (6)

Country	Link
EP (1)	EP0266368A4 (fi)
JP (1)	JPS63503182A (fi)
KR (1)	KR880701463A (fi)
AU (1)	AU7207087A (fi)
FI (1)	FI875607A (fi)
WO (1)	WO1987006765A1 (fi)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH04264758A (ja) *	1991-02-20	1992-09-21	Nec Corp	半導体チップキャリア
US5243132A (en) *	1992-01-17	1993-09-07	Cooper Industries, Inc.	Drain hole core for explosion-proof drain seal fittings
FR2717981B1 (fr) *	1994-03-24	1996-06-28	Egide Sa	Procédé de fixation hermétique et électriquement isolante d'un conducteur électrique traversant une paroi métallique .
CN104439784A (zh) *	2014-11-17	2015-03-25	中国电子科技集团公司第四十三研究所	一种电子封装用对接式低阻引线及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2291660A (en) *	1939-07-25	1942-08-04	Raytheon Production Corp	Stem for electrical space discharge devices
US2292863A (en) *	1941-08-26	1942-08-11	Gen Electric	Lead-in arrangement
GB567521A (en) *	1942-05-11	1945-02-19	Gen Electric Co Ltd	Improvements in the sealing of electrical conductors through vitreous walls
GB629742A (en) *	1947-11-14	1949-09-27	Gen Electric Co Ltd	Improvements in or relating to method of manufacturing electrical conductors provided with glass beads
FR1280332A (fr) *	1960-02-09	1961-12-29	Texas Instruments Inc	Perfectionnements aux embases pour bornes de connexion
DE1913985A1 (de) *	1969-03-19	1970-10-01	Siemens Ag	Einschmelzungen mit Draehten in Glas fuer Halbleiterbauelemente
US3927841A (en) *	1974-05-09	1975-12-23	Flight Connector Corp	Contact
JPS5250586A (en) *	1975-10-21	1977-04-22	Nec Home Electronics Ltd	Making method for gas-tight terminal
JPS57211255A (en) *	1981-06-22	1982-12-25	Nec Home Electronics Ltd	Manufacture of airtight terminal
JPS59214244A (ja) *	1983-05-20	1984-12-04	Nec Corp	半導体装置
JPS60194547A (ja) *	1984-03-16	1985-10-03	Nec Corp	半導体装置
IL74296A0 (en) *	1984-03-20	1985-05-31	Isotronics Inc	Corrosion resistant microcircuit package

1987
- 1987-03-10 EP EP19870902218 patent/EP0266368A4/en not_active Withdrawn
- 1987-03-10 WO PCT/US1987/000465 patent/WO1987006765A1/en not_active Application Discontinuation
- 1987-03-10 JP JP62502133A patent/JPS63503182A/ja active Pending
- 1987-03-10 AU AU72070/87A patent/AU7207087A/en not_active Abandoned
- 1987-12-18 FI FI875607A patent/FI875607A/fi not_active IP Right Cessation
- 1987-12-21 KR KR1019870701200A patent/KR880701463A/ko not_active Application Discontinuation

Also Published As

Publication number	Publication date
EP0266368A1 (en)	1988-05-11
KR880701463A (ko)	1988-07-27
FI875607A0 (fi)	1987-12-18
EP0266368A4 (en)	1988-11-24
FI875607A (fi)	1987-12-18
AU7207087A (en)	1987-11-24
WO1987006765A1 (en)	1987-11-05

Publication	Publication Date	Title
US4331258A (en)	1982-05-25	Sealing cover for an hermetically sealed container
US4640436A (en)	1987-02-03	Hermetic sealing cover and a method of producing the same
JP3266545B2 (ja)	2002-03-18	リードフレーム及び電気メッキ方法
US4678358A (en)	1987-07-07	Glass compression seals using low temperature glass
US6932644B1 (en)	2005-08-23	Dissimilar metal hermetic connector
US7566592B2 (en)	2009-07-28	Method and process of manufacturing robust high temperature solder joints
JPS63503182A (ja)	1988-11-17	金属容器収納微小回路用耐蝕性ピン
EP0157685A1 (en)	1985-10-09	Corrosion resistant microcircuit package
US4590672A (en)	1986-05-27	Package for electronic device and method for producing same
JP6971077B2 (ja)	2021-11-24	端子および該端子の取り付け方法、この端子を用いた端子−筐体接合体
JPS60241244A (ja)	1985-11-30	ピングリッドアレイ型半導体装置の製造方法
JPS5837952B2 (ja)	1983-08-19	気密端子の製造方法
JP2008124163A (ja)	2008-05-29	気密端子およびその製造方法
JPS5828859A (ja)	1983-02-19	リ−ドレスガラス封止ダイオ−ド
JPS6316581A (ja)	1988-01-23	気密ガラス端子
JPS6367761A (ja)	1988-03-26	気密ガラス端子
JPS603144A (ja)	1985-01-09	半導体パツケ−ジのリ−ド処理方法
JPH01223755A (ja)	1989-09-06	半導体装置用リードフレーム
WO1989003123A1 (en)	1989-04-06	Microcircuit package with corrosion resistant pins and methof of making
JP2000180283A (ja)	2000-06-30	半導体圧力センサ
SU707457A1 (ru)	1981-06-15	Корпус микросхемы
JPS6030118A (ja)	1985-02-15	電解コンデンサ
JPS62142336A (ja)	1987-06-25	リ−ドレスガラス封止ダイオ−ド
JPS6092636A (ja)	1985-05-24	半導体装置の製造方法
JPS6223846B2 (fi)	1987-05-26