KR880701463A - 금속패키지 미소회로용 부식저항핀 및 그 핀의 도금방법 - Google Patents
금속패키지 미소회로용 부식저항핀 및 그 핀의 도금방법Info
- Publication number
- KR880701463A KR880701463A KR1019870701200A KR870701200A KR880701463A KR 880701463 A KR880701463 A KR 880701463A KR 1019870701200 A KR1019870701200 A KR 1019870701200A KR 870701200 A KR870701200 A KR 870701200A KR 880701463 A KR880701463 A KR 880701463A
- Authority
- KR
- South Korea
- Prior art keywords
- pin
- microcircuit
- corrosion
- plating method
- metal package
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US85412386A | 1986-04-21 | 1986-04-21 | |
PCT/US1987/000465 WO1987006765A1 (en) | 1986-04-21 | 1987-03-10 | Corrosion resistant pins for metal packaged microcircuits |
Publications (1)
Publication Number | Publication Date |
---|---|
KR880701463A true KR880701463A (ko) | 1988-07-27 |
Family
ID=25317791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019870701200A KR880701463A (ko) | 1986-04-21 | 1987-12-21 | 금속패키지 미소회로용 부식저항핀 및 그 핀의 도금방법 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0266368A4 (fi) |
JP (1) | JPS63503182A (fi) |
KR (1) | KR880701463A (fi) |
AU (1) | AU7207087A (fi) |
FI (1) | FI875607A (fi) |
WO (1) | WO1987006765A1 (fi) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04264758A (ja) * | 1991-02-20 | 1992-09-21 | Nec Corp | 半導体チップキャリア |
US5243132A (en) * | 1992-01-17 | 1993-09-07 | Cooper Industries, Inc. | Drain hole core for explosion-proof drain seal fittings |
FR2717981B1 (fr) * | 1994-03-24 | 1996-06-28 | Egide Sa | Procédé de fixation hermétique et électriquement isolante d'un conducteur électrique traversant une paroi métallique . |
CN104439784A (zh) * | 2014-11-17 | 2015-03-25 | 中国电子科技集团公司第四十三研究所 | 一种电子封装用对接式低阻引线及其制备方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2291660A (en) * | 1939-07-25 | 1942-08-04 | Raytheon Production Corp | Stem for electrical space discharge devices |
US2292863A (en) * | 1941-08-26 | 1942-08-11 | Gen Electric | Lead-in arrangement |
GB567521A (en) * | 1942-05-11 | 1945-02-19 | Gen Electric Co Ltd | Improvements in the sealing of electrical conductors through vitreous walls |
GB629742A (en) * | 1947-11-14 | 1949-09-27 | Gen Electric Co Ltd | Improvements in or relating to method of manufacturing electrical conductors provided with glass beads |
FR1280332A (fr) * | 1960-02-09 | 1961-12-29 | Texas Instruments Inc | Perfectionnements aux embases pour bornes de connexion |
DE1913985A1 (de) * | 1969-03-19 | 1970-10-01 | Siemens Ag | Einschmelzungen mit Draehten in Glas fuer Halbleiterbauelemente |
US3927841A (en) * | 1974-05-09 | 1975-12-23 | Flight Connector Corp | Contact |
JPS5250586A (en) * | 1975-10-21 | 1977-04-22 | Nec Home Electronics Ltd | Making method for gas-tight terminal |
JPS57211255A (en) * | 1981-06-22 | 1982-12-25 | Nec Home Electronics Ltd | Manufacture of airtight terminal |
JPS59214244A (ja) * | 1983-05-20 | 1984-12-04 | Nec Corp | 半導体装置 |
JPS60194547A (ja) * | 1984-03-16 | 1985-10-03 | Nec Corp | 半導体装置 |
IL74296A0 (en) * | 1984-03-20 | 1985-05-31 | Isotronics Inc | Corrosion resistant microcircuit package |
-
1987
- 1987-03-10 EP EP19870902218 patent/EP0266368A4/en not_active Withdrawn
- 1987-03-10 WO PCT/US1987/000465 patent/WO1987006765A1/en not_active Application Discontinuation
- 1987-03-10 JP JP62502133A patent/JPS63503182A/ja active Pending
- 1987-03-10 AU AU72070/87A patent/AU7207087A/en not_active Abandoned
- 1987-12-18 FI FI875607A patent/FI875607A/fi not_active IP Right Cessation
- 1987-12-21 KR KR1019870701200A patent/KR880701463A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP0266368A1 (en) | 1988-05-11 |
FI875607A0 (fi) | 1987-12-18 |
EP0266368A4 (en) | 1988-11-24 |
FI875607A (fi) | 1987-12-18 |
AU7207087A (en) | 1987-11-24 |
JPS63503182A (ja) | 1988-11-17 |
WO1987006765A1 (en) | 1987-11-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |