KR880701463A - 금속패키지 미소회로용 부식저항핀 및 그 핀의 도금방법 - Google Patents

금속패키지 미소회로용 부식저항핀 및 그 핀의 도금방법

Info

Publication number: KR880701463A
Authority: KR; South Korea
Prior art keywords: pin; microcircuit; corrosion; plating method; metal package
Prior art date: 1986-04-21

Application number

KR1019870701200A

Other languages

English (en)

Korean (ko)

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-04-21

Filing date

1987-12-21

Publication date

1988-07-27

1987-12-21 Application filed filed Critical

1988-07-27 Publication of KR880701463A publication Critical patent/KR880701463A/ko

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Lead Frames For Integrated Circuits (AREA)
Connections Arranged To Contact A Plurality Of Conductors (AREA)

KR1019870701200A 1986-04-21 1987-12-21 금속패키지 미소회로용 부식저항핀 및 그 핀의 도금방법 KR880701463A (ko)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US85412386A	1986-04-21	1986-04-21
PCT/US1987/000465 WO1987006765A1 (en)	1986-04-21	1987-03-10	Corrosion resistant pins for metal packaged microcircuits

Publications (1)

Publication Number	Publication Date
KR880701463A true KR880701463A (ko)	1988-07-27

Family

ID=25317791

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1019870701200A KR880701463A (ko)	1986-04-21	1987-12-21	금속패키지 미소회로용 부식저항핀 및 그 핀의 도금방법

Country Status (6)

Country	Link
EP (1)	EP0266368A4 (fi)
JP (1)	JPS63503182A (fi)
KR (1)	KR880701463A (fi)
AU (1)	AU7207087A (fi)
FI (1)	FI875607A (fi)
WO (1)	WO1987006765A1 (fi)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH04264758A (ja) *	1991-02-20	1992-09-21	Nec Corp	半導体チップキャリア
US5243132A (en) *	1992-01-17	1993-09-07	Cooper Industries, Inc.	Drain hole core for explosion-proof drain seal fittings
FR2717981B1 (fr) *	1994-03-24	1996-06-28	Egide Sa	Procédé de fixation hermétique et électriquement isolante d'un conducteur électrique traversant une paroi métallique .
CN104439784A (zh) *	2014-11-17	2015-03-25	中国电子科技集团公司第四十三研究所	一种电子封装用对接式低阻引线及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2291660A (en) *	1939-07-25	1942-08-04	Raytheon Production Corp	Stem for electrical space discharge devices
US2292863A (en) *	1941-08-26	1942-08-11	Gen Electric	Lead-in arrangement
GB567521A (en) *	1942-05-11	1945-02-19	Gen Electric Co Ltd	Improvements in the sealing of electrical conductors through vitreous walls
GB629742A (en) *	1947-11-14	1949-09-27	Gen Electric Co Ltd	Improvements in or relating to method of manufacturing electrical conductors provided with glass beads
FR1280332A (fr) *	1960-02-09	1961-12-29	Texas Instruments Inc	Perfectionnements aux embases pour bornes de connexion
DE1913985A1 (de) *	1969-03-19	1970-10-01	Siemens Ag	Einschmelzungen mit Draehten in Glas fuer Halbleiterbauelemente
US3927841A (en) *	1974-05-09	1975-12-23	Flight Connector Corp	Contact
JPS5250586A (en) *	1975-10-21	1977-04-22	Nec Home Electronics Ltd	Making method for gas-tight terminal
JPS57211255A (en) *	1981-06-22	1982-12-25	Nec Home Electronics Ltd	Manufacture of airtight terminal
JPS59214244A (ja) *	1983-05-20	1984-12-04	Nec Corp	半導体装置
JPS60194547A (ja) *	1984-03-16	1985-10-03	Nec Corp	半導体装置
IL74296A0 (en) *	1984-03-20	1985-05-31	Isotronics Inc	Corrosion resistant microcircuit package

1987
- 1987-03-10 EP EP19870902218 patent/EP0266368A4/en not_active Withdrawn
- 1987-03-10 WO PCT/US1987/000465 patent/WO1987006765A1/en not_active Application Discontinuation
- 1987-03-10 JP JP62502133A patent/JPS63503182A/ja active Pending
- 1987-03-10 AU AU72070/87A patent/AU7207087A/en not_active Abandoned
- 1987-12-18 FI FI875607A patent/FI875607A/fi not_active IP Right Cessation
- 1987-12-21 KR KR1019870701200A patent/KR880701463A/ko not_active Application Discontinuation

Also Published As

Publication number	Publication date
EP0266368A1 (en)	1988-05-11
FI875607A0 (fi)	1987-12-18
EP0266368A4 (en)	1988-11-24
FI875607A (fi)	1987-12-18
AU7207087A (en)	1987-11-24
JPS63503182A (ja)	1988-11-17
WO1987006765A1 (en)	1987-11-05

Legal Events

Date	Code	Title	Description
1993-02-10	WITN	Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid

Publication	Publication Date	Title
IT1247784B (it)	1994-12-30	Composizione e metodo per la riduzione dell'appetito
KR890005857A (ko)	1989-05-17	범프 및 그 형성방법
AR241011A1 (es)	1991-04-30	"un metodo de fundir y refinar material vitreo o lo similar".
KR900016498A (ko)	1990-11-13	피복초경합금 및 그 제조법
NO870893L (no)	1987-09-07	Apparat for behandling av smeltet metall.
KR890701116A (ko)	1989-12-19	궤양 예방용 조성물 및 그 방법
EP0407103A3 (en)	1991-09-11	Method of packaging and powering integrated circuit chips and the chip assembly formed thereby
DK125882A (da)	1982-09-24	Elektroloest guldpletteringsbad samt anvendelse deraf til guldplettering
DE3471697D1 (en)	1988-07-07	An acid bath for electrodeposition of gold or gold alloys, an electroplating method and the use of said bath
EP0406005A3 (en)	1991-09-04	Semiconductor laser and manufacture method therefor
KR850004738A (ko)	1985-07-27	세라믹과 금속과의 접합방법
KR890007185A (ko)	1989-06-19	Ic 수납용 금속케이스 및 제조방법
IT8648695A0 (it)	1986-11-28	Metodo e dispositivo di fabbricazione di getti metallici e relativo prodotto
DE3777618D1 (de)	1992-04-23	Elektroabscheidungsverfahren und waesserige harz-lackzusammensetzung.
BR8605811A (pt)	1988-04-26	Banho de passivacao e emprego
IT1171818B (it)	1987-06-10	Bagno di placcatura chimica di oro e metodo di placcatura chimica di oro
IL84865A0 (en)	1988-06-30	Solutions,creams and immersion baths for gold plating
KR880701463A (ko)	1988-07-27	금속패키지 미소회로용 부식저항핀 및 그 핀의 도금방법
IT8620796A0 (it)	1986-06-16	Processo per la preparazione dell'n-dimetilchitosano e suoi impieghi farmacologici.
PL267892A1 (en)	1988-08-18	Fungicidal specific and the method of manufacturing of new heterocyclic components
EP0447983A3 (en)	1992-03-04	Semiconductor laser chip and method of making the same
GB8921796D0 (en)	1989-11-08	Electroless gold plating bath and method of using the same
ZA879428B (en)	1989-08-30	Gold plating solutions,creams and baths
IT8720360A0 (it)	1987-05-04	Metodo per prevenire l'appannamento di superfici.
FR2626451B1 (fr)	1991-09-27	Fermoir pour bracelet