JPS6341238B2 - - Google Patents
Info
- Publication number
- JPS6341238B2 JPS6341238B2 JP55085323A JP8532380A JPS6341238B2 JP S6341238 B2 JPS6341238 B2 JP S6341238B2 JP 55085323 A JP55085323 A JP 55085323A JP 8532380 A JP8532380 A JP 8532380A JP S6341238 B2 JPS6341238 B2 JP S6341238B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring body
- layer
- circuit board
- solder
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 230000001590 oxidative effect Effects 0.000 claims description 2
- 239000010408 film Substances 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000010936 titanium Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8532380A JPS5710998A (en) | 1980-06-24 | 1980-06-24 | Circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8532380A JPS5710998A (en) | 1980-06-24 | 1980-06-24 | Circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5710998A JPS5710998A (en) | 1982-01-20 |
JPS6341238B2 true JPS6341238B2 (de) | 1988-08-16 |
Family
ID=13855407
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8532380A Granted JPS5710998A (en) | 1980-06-24 | 1980-06-24 | Circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5710998A (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6053093A (ja) * | 1983-09-02 | 1985-03-26 | 株式会社日立製作所 | ピングリッドアレイ型半導体パッケージ |
JP2741611B2 (ja) * | 1989-01-12 | 1998-04-22 | 新光電気工業株式会社 | フリップチップボンディング用基板 |
JPH11251484A (ja) * | 1998-03-06 | 1999-09-17 | Mitsui High Tec Inc | チップサイズ型半導体装置 |
WO2000010369A1 (fr) | 1998-08-10 | 2000-02-24 | Fujitsu Limited | Realisation de bossages de soudure, methode de montage d'un dispositif electronique et structure de montage pour ce dispositif |
FR2940521B1 (fr) * | 2008-12-19 | 2011-11-11 | 3D Plus | Procede de fabrication collective de modules electroniques pour montage en surface |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50102265A (de) * | 1974-01-09 | 1975-08-13 |
-
1980
- 1980-06-24 JP JP8532380A patent/JPS5710998A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50102265A (de) * | 1974-01-09 | 1975-08-13 |
Also Published As
Publication number | Publication date |
---|---|
JPS5710998A (en) | 1982-01-20 |
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