JPS5710998A - Circuit board - Google Patents
Circuit boardInfo
- Publication number
- JPS5710998A JPS5710998A JP8532380A JP8532380A JPS5710998A JP S5710998 A JPS5710998 A JP S5710998A JP 8532380 A JP8532380 A JP 8532380A JP 8532380 A JP8532380 A JP 8532380A JP S5710998 A JPS5710998 A JP S5710998A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- board
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8532380A JPS5710998A (en) | 1980-06-24 | 1980-06-24 | Circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8532380A JPS5710998A (en) | 1980-06-24 | 1980-06-24 | Circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5710998A true JPS5710998A (en) | 1982-01-20 |
JPS6341238B2 JPS6341238B2 (en) | 1988-08-16 |
Family
ID=13855407
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8532380A Granted JPS5710998A (en) | 1980-06-24 | 1980-06-24 | Circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5710998A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6053093A (en) * | 1983-09-02 | 1985-03-26 | 株式会社日立製作所 | Circuit board |
JPH02185053A (en) * | 1989-01-12 | 1990-07-19 | Shinko Electric Ind Co Ltd | Substrate for flip chip bonding |
JPH11251484A (en) * | 1998-03-06 | 1999-09-17 | Mitsui High Tec Inc | Chip-sized semiconductor device |
US6461953B1 (en) | 1998-08-10 | 2002-10-08 | Fujitsu Limited | Solder bump forming method, electronic component mounting method, and electronic component mounting structure |
JP2012513109A (en) * | 2008-12-19 | 2012-06-07 | トロワデー、プリュ | Wafer scale manufacturing method for surface mount electronic module |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50102265A (en) * | 1974-01-09 | 1975-08-13 |
-
1980
- 1980-06-24 JP JP8532380A patent/JPS5710998A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50102265A (en) * | 1974-01-09 | 1975-08-13 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6053093A (en) * | 1983-09-02 | 1985-03-26 | 株式会社日立製作所 | Circuit board |
JPH0465536B2 (en) * | 1983-09-02 | 1992-10-20 | Hitachi Ltd | |
JPH02185053A (en) * | 1989-01-12 | 1990-07-19 | Shinko Electric Ind Co Ltd | Substrate for flip chip bonding |
JPH11251484A (en) * | 1998-03-06 | 1999-09-17 | Mitsui High Tec Inc | Chip-sized semiconductor device |
US6461953B1 (en) | 1998-08-10 | 2002-10-08 | Fujitsu Limited | Solder bump forming method, electronic component mounting method, and electronic component mounting structure |
JP2012513109A (en) * | 2008-12-19 | 2012-06-07 | トロワデー、プリュ | Wafer scale manufacturing method for surface mount electronic module |
Also Published As
Publication number | Publication date |
---|---|
JPS6341238B2 (en) | 1988-08-16 |
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