JPS63317291A - Silver alloy filler metal for brazing - Google Patents
Silver alloy filler metal for brazingInfo
- Publication number
- JPS63317291A JPS63317291A JP15169087A JP15169087A JPS63317291A JP S63317291 A JPS63317291 A JP S63317291A JP 15169087 A JP15169087 A JP 15169087A JP 15169087 A JP15169087 A JP 15169087A JP S63317291 A JPS63317291 A JP S63317291A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- filler metal
- alloy
- weight
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 title abstract description 19
- 239000000945 filler Substances 0.000 title abstract description 8
- 229910052751 metal Inorganic materials 0.000 title abstract 7
- 239000002184 metal Substances 0.000 title abstract 7
- 229910001316 Ag alloy Inorganic materials 0.000 title abstract 3
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 12
- 239000000956 alloy Substances 0.000 claims abstract description 12
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 4
- 229910052718 tin Inorganic materials 0.000 claims abstract description 4
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 3
- 229910000679 solder Inorganic materials 0.000 claims description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 2
- 239000011572 manganese Substances 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 abstract description 6
- 238000007747 plating Methods 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 239000002253 acid Substances 0.000 abstract description 2
- 238000007788 roughening Methods 0.000 abstract 2
- 229910017755 Cu-Sn Inorganic materials 0.000 abstract 1
- 229910017927 Cu—Sn Inorganic materials 0.000 abstract 1
- 239000000463 material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、銀ろう合金の改良に関するものである。[Detailed description of the invention] (Industrial application field) The present invention relates to improvements in silver solder alloys.
（従来技術とその問題点）
一般に真空遮断器、電子管、サイリスター、ＩＣパッケ
ージ等におけるろう材用銀ろう合金としては、銀に銅を
７．５〜３５重量％、さらにすず３〜ｌＯ重量％の範囲
で添加した銀−銅−すず合金が主に用いられている。(Prior art and its problems) In general, silver brazing alloys for brazing materials in vacuum circuit breakers, electron tubes, thyristors, IC packages, etc. contain 7.5 to 35% by weight of copper and 3 to 10% by weight of tin. Silver-copper-tin alloys are mainly used.
然し乍ら、このろう材にてろう付を行った場合、ろう付
部のろう表面が荒れ、凹凸が発生するものである。従っ
てこのろう材を用いてろう付を行った部品を酸洗浄した
り、めっき処理したりすると、前記凹凸に洗浄液等が浸
入する。この洗浄液は完全に除去することが困難である
為、凹凸の部分に洗浄液が残存し、その結果残存した洗
浄液等によりろう打部が変色、腐蝕したり、めっきにふ
くれが生じたりする等の欠点があった。However, when brazing is performed using this brazing material, the brazed surface of the brazed portion becomes rough and uneven. Therefore, when parts brazed using this brazing material are acid-cleaned or plated, the cleaning liquid or the like will penetrate into the irregularities. Since this cleaning solution is difficult to remove completely, it may remain on uneven areas, resulting in disadvantages such as discoloration and corrosion of the soldered parts and blistering of the plating due to the remaining cleaning solution. was there.
（発明の目的）
本発明は上記欠点を解消すべくなされたものであり、ろ
う付部のろう表面の荒れが少なく、凹凸の発生も少ない
銀ろう合金を提供せんとするものである。(Object of the Invention) The present invention has been made in order to eliminate the above-mentioned drawbacks, and it is an object of the present invention to provide a silver braze alloy in which the solder surface of the brazed portion has less roughness and less unevenness.
（問題点を解決するための手段）
本発明の限ろう合金は、銅２０〜５０重量％、すず３〜
１２重量％、クロム、パラジウム、マンガンの少なくと
も１１１０．００１〜１．５重量％、残部銀より成るも
のである。(Means for solving the problem) The limited brazing alloy of the present invention contains 20 to 50% by weight of copper and 3 to 50% by weight of tin.
12% by weight, at least 1110.001 to 1.5% by weight of chromium, palladium, manganese, and the balance silver.
本発明の銀ろう合金において、クロム、パラジウム、マ
ンガンの少なくとも１種を銀−銅−すず合金に含有させ
る理由は、ろう付時溶融したろう材の表面張力を小さく
し、それによりろう付部のろう表面の荒れを小さくし、
凹凸の発生を抑制する為である。In the silver brazing alloy of the present invention, the reason why at least one of chromium, palladium, and manganese is contained in the silver-copper-tin alloy is to reduce the surface tension of the melted brazing material during brazing, thereby reducing the Reduces roughness on the wax surface,
This is to suppress the occurrence of unevenness.
そしてその含有量を０．００１−１．５重量％と限定し
た理由は、０．００１重量％未満ではろう付後のろう表
面の荒れ及び凹凸の発生を抑制することができず、また
１、５重量％を超えると極端にろう流れが悪くなり、ろ
う付強度に悪影響を及ぼすからである。The reason for limiting the content to 0.001-1.5% by weight is that if it is less than 0.001% by weight, it is not possible to suppress the occurrence of roughness and unevenness on the solder surface after brazing, and 1. This is because if it exceeds 5% by weight, the flow of the solder will be extremely poor and the brazing strength will be adversely affected.
次に本発明の限ろう合金の効果を明瞭ならしめる為にそ
の具体的な実施例と従来例について説明する。Next, in order to clarify the effects of the filler alloy of the present invention, specific examples and conventional examples thereof will be explained.
（実施例）
下記の表の左欄に示す実施例と従来例の銀ろうを水素雰
囲気中で、ＩＣパフケージ用アルミナにＭｏ−Ｍｎをメ
タライズし、さらにその上にニッケルめっきを５μ施し
、その部分に鉄−エソケル４２重量％から成るリードフ
レームのろう付を行い、ろう付後のろう表面の凹凸（溝
）の個数及び凹凸（溝）の深さを測定したところ下記の
表の右欄に示すような結果を得た。(Example) Mo-Mn was metallized on alumina for an IC puff cage using the silver solders of the example and conventional example shown in the left column of the table below in a hydrogen atmosphere, and then 5 μm of nickel plating was applied on top of the alumina. A lead frame made of 42% iron-Esokel was brazed to the surface of the solder, and the number of unevenness (grooves) and the depth of the unevenness (grooves) on the soldering surface after brazing were measured, and the results are shown in the right column of the table below. I got similar results.
上記の表の右欄の数値で明らかなように本発明の銀ろう
合金は、従来の限ろう合金に比較して凹凸（溝）の発生
数が少なく、また凹凸（溝）の深さが浅いものである。As is clear from the numbers in the right column of the table above, the silver solder alloy of the present invention has fewer irregularities (grooves) than conventional solder alloys, and the depth of the irregularities (grooves) is shallower. It is something.
（発明の効果）
以上詳記した通り本発明による限ろう合金は、ろう付後
のろう表面の荒れが少なく、凹凸の発生も少なく、従っ
てろう付を行った部品を酸洗浄したり、めっき処理した
りしてもろう表面の凹凸に浸入する洗浄液等の量が少な
く、その結果それらを除去後の残存量も少なく、それだ
けろう打部の変色、腐蝕を抑制することができるという
優れた効果がある。(Effects of the Invention) As detailed above, the brazing alloy according to the present invention has less roughness on the brazed surface after brazing and less occurrence of unevenness, and therefore, the brazed parts can be cleaned with acid or subjected to plating treatment. The amount of cleaning liquid that penetrates into the unevenness of the solder surface is small, and as a result, the amount remaining after removal is also small, which has the excellent effect of suppressing discoloration and corrosion of the soldered part. be.
Claims (1)
ラジウム、マンガンの少なくとも１種０．００１〜１．
５重量％、残部銀より成る銀ろう合金。20 to 50% by weight of copper, 3 to 12% by weight of tin, and 0.001 to 1% of at least one of chromium, palladium, and manganese.
Silver solder alloy consisting of 5% by weight, balance silver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15169087A JPS63317291A (en) | 1987-06-18 | 1987-06-18 | Silver alloy filler metal for brazing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15169087A JPS63317291A (en) | 1987-06-18 | 1987-06-18 | Silver alloy filler metal for brazing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63317291A true JPS63317291A (en) | 1988-12-26 |
Family
ID=15524133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15169087A Pending JPS63317291A (en) | 1987-06-18 | 1987-06-18 | Silver alloy filler metal for brazing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63317291A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008041350A1 (en) * | 2006-09-29 | 2008-04-10 | Kabushiki Kaisha Toshiba | Joint with first and second members with a joining layer located therebetween containing sn metal and another metallic material; methods for forming the same joint |
-
1987
- 1987-06-18 JP JP15169087A patent/JPS63317291A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008041350A1 (en) * | 2006-09-29 | 2008-04-10 | Kabushiki Kaisha Toshiba | Joint with first and second members with a joining layer located therebetween containing sn metal and another metallic material; methods for forming the same joint |
| US8763884B2 (en) | 2006-09-29 | 2014-07-01 | Kabushiki Kaisha Toshiba | Joint with first and second members with a joining layer located therebetween containing Sn metal and another metallic material; methods for forming the same joint |
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