JPS63317282A - Gold alloy filler metal for brazing - Google Patents
Gold alloy filler metal for brazingInfo
- Publication number
- JPS63317282A JPS63317282A JP15170587A JP15170587A JPS63317282A JP S63317282 A JPS63317282 A JP S63317282A JP 15170587 A JP15170587 A JP 15170587A JP 15170587 A JP15170587 A JP 15170587A JP S63317282 A JPS63317282 A JP S63317282A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- filler metal
- alloy
- gold
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 22
- 239000002184 metal Substances 0.000 title abstract description 9
- 229910052751 metal Inorganic materials 0.000 title abstract description 9
- 239000000945 filler Substances 0.000 title abstract 7
- 229910001020 Au alloy Inorganic materials 0.000 title abstract 3
- 239000003353 gold alloy Substances 0.000 title 1
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 14
- 239000000956 alloy Substances 0.000 claims abstract description 14
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 6
- 229910052742 iron Inorganic materials 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 13
- 239000010931 gold Substances 0.000 claims description 13
- 229910052737 gold Inorganic materials 0.000 claims description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 abstract description 7
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract description 3
- 239000002253 acid Substances 0.000 abstract description 2
- 238000007788 roughening Methods 0.000 abstract 2
- 229910002482 Cu–Ni Inorganic materials 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 14
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- ZBTDWLVGWJNPQM-UHFFFAOYSA-N [Ni].[Cu].[Au] Chemical compound [Ni].[Cu].[Au] ZBTDWLVGWJNPQM-UHFFFAOYSA-N 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、金ろう合金の改良に関するものである。[Detailed description of the invention] (Industrial application field) The present invention relates to improvements in gold solder alloys.
（従来技術とその問題点）
一般に真空遮断器、電子管、サイリスター、ＩＣパッケ
ージ等におけるろう材用余ろう合金としては、金に銅を
１５〜６２重量％、ニッケル２〜５重量％の範囲で添加
した金−銅一ニッケル合金が主に用いられている。(Prior art and its problems) In general, as surplus brazing alloy for brazing metal in vacuum circuit breakers, electron tubes, thyristors, IC packages, etc., copper is added to gold in a range of 15 to 62% by weight and nickel in a range of 2 to 5% by weight. A gold-copper-nickel alloy is mainly used.
然し乍ら、このろう材にてろう付を行った場合、ろう付
後のろう表面が荒れ、凹凸が発生するものである。従っ
てこのろう材を用いてろう付を行った部品を酸洗浄した
り、めっき処理したりすると、前記凹凸に洗浄液等が浸
入する。この洗浄液は完全に除去することが困難である
為、凹凸の部分に洗浄液が残存し、その結果残存した洗
浄液等によりろう打部が変色、腐蝕したり、めっきにふ
くれが生じたりする等の欠点があった。However, when brazing is performed using this brazing material, the solder surface after brazing becomes rough and uneven. Therefore, when parts brazed using this brazing material are acid-cleaned or plated, cleaning liquid or the like will penetrate into the irregularities. Since it is difficult to completely remove this cleaning solution, the cleaning solution remains on uneven areas, resulting in disadvantages such as discoloration and corrosion of the soldered parts and blistering of the plating due to the remaining cleaning solution. was there.
（発明の目的）
本発明は上記欠点を解消すべくなされたものであり、ろ
う付後のろう表面の荒れが少なく、凹凸の発生も少ない
金ろう合金を提供せんとするものである。(Object of the Invention) The present invention has been made in order to eliminate the above-mentioned drawbacks, and aims to provide a gold solder alloy that has less roughness on the solder surface after brazing and less occurrence of irregularities.
（問題点を解決するための手段）
本発明の金ろう合金は、銅１０〜７０重量％、ニッケル
１〜８重量％、鉄、コバルトの少なくとも１種０．００
１−１．０重量％、残部金より成るものである。(Means for Solving the Problems) The gold brazing alloy of the present invention contains 10 to 70% by weight of copper, 1 to 8% by weight of nickel, and 0.00% of at least one of iron and cobalt.
1-1.0% by weight, the balance being gold.
本発明の金ろう合金において、鉄、コバルトの少なくと
も１種を金−銅−ニッケル合金に含有させる理由は、ろ
う付時溶融したろう材の表面張力を小さくし、それによ
りろう付後のろう表面の荒れを小さくし、凹凸の発生を
抑制する為である。In the gold solder alloy of the present invention, the reason why at least one of iron and cobalt is contained in the gold-copper-nickel alloy is to reduce the surface tension of the solder metal melted during brazing, thereby reducing the surface tension of the solder material after brazing. This is to reduce roughness and suppress the occurrence of unevenness.
そしてそれの含有量を０．００１〜１．０重量％と限定
した理由は、０．００１重量％未満ではろう付後のろう
表面の荒れ及び凹凸の発生を抑制することができず、ま
た１、０重量％を超えると極端にろう流れが悪く、ろう
付強度に悪影否を及ぼすからである。The reason for limiting the content to 0.001 to 1.0% by weight is that if it is less than 0.001% by weight, it is not possible to suppress the occurrence of roughness and unevenness on the solder surface after brazing, and 1. This is because if it exceeds 0% by weight, the flow of the solder will be extremely poor, which will have a negative impact on the brazing strength.
次に本発明の金ろう合金の効果を明瞭ならしめる為にそ
の具体的な実施例と従来例について説明する。Next, in order to clarify the effects of the gold brazing alloy of the present invention, specific examples and conventional examples thereof will be described.
（実施例）
下記の表の左欄に示す実施例と従来例の金ろうを水素雰
囲気中で、ＩＣパッケージ用アルミナにＭｏ−Ｍｎをメ
タライズし、さらにその上にニッケルめっきを５μ施し
、その部分に鉄−ニッケル４２重量％から成るリードフ
レームのろう付を行い、ろう付後のろう表面の凹凸（溝
）の個数及び凹凸（溝）の深さを測定したところ下記の
表の右欄に示すような結果を得た。(Example) The gold solders of the example and conventional example shown in the left column of the table below were metallized with Mo-Mn on alumina for IC packages in a hydrogen atmosphere, and then 5 μm of nickel was plated on top of that, and the parts were A lead frame made of 42% iron and nickel by weight was brazed to the surface of the solder, and the number of unevenness (grooves) and the depth of the unevenness (grooves) on the soldering surface after brazing were measured, and the results are shown in the right column of the table below. I got similar results.
（以下余白）
上記の表の右欄の数値で明らかなように本発明の金ろう
合金は、従来の金ろう合金に比較して凹凸（溝）の発生
数が少なく、また凹凸（溝）の深さが浅いものである。(Left below) As is clear from the numbers in the right column of the table above, the gold solder alloy of the present invention has fewer unevenness (grooves) than conventional gold solder alloys, and also has fewer unevenness (grooves). The depth is shallow.
（発明の効果）
以上詳記した通り本発明による金ろう合金は、ろう付後
のろう表面の荒れが少なく、凹凸の発生も少なく、従っ
てろう付を行った部品を酸洗浄したり、めっき処理した
りしてもろう表面の凹凸に浸入する洗浄液等の量が少な
く、その結果それらを除去後の残存量も少なく、それだ
けろう何部の変色、腐蝕を抑制することができるという
優れた効果がある。(Effects of the Invention) As detailed above, the gold brazing alloy according to the present invention has less roughness on the solder surface after brazing and less occurrence of unevenness, so brazed parts can be cleaned with acid or subjected to plating treatment. The amount of cleaning liquid, etc. that enters into the unevenness of the wax surface is small, and as a result, the amount remaining after removal is also small, which has the excellent effect of suppressing discoloration and corrosion of some parts of the wax. be.
Claims (1)
ルトの少なくとも１種０．００１〜１．０重量％、残部
金より成る金ろう合金。A gold brazing alloy comprising 10 to 70% by weight of copper, 1 to 8% by weight of nickel, 0.001 to 1.0% by weight of at least one of iron and cobalt, and the balance gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15170587A JPS63317282A (en) | 1987-06-18 | 1987-06-18 | Gold alloy filler metal for brazing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15170587A JPS63317282A (en) | 1987-06-18 | 1987-06-18 | Gold alloy filler metal for brazing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63317282A true JPS63317282A (en) | 1988-12-26 |
Family
ID=15524465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15170587A Pending JPS63317282A (en) | 1987-06-18 | 1987-06-18 | Gold alloy filler metal for brazing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63317282A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1770178A1 (en) * | 2005-09-28 | 2007-04-04 | General Electric Company | Gold/nickel/copper brazing alloys for brazing wc-co to titanium alloys |
-
1987
- 1987-06-18 JP JP15170587A patent/JPS63317282A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1770178A1 (en) * | 2005-09-28 | 2007-04-04 | General Electric Company | Gold/nickel/copper brazing alloys for brazing wc-co to titanium alloys |
| JP2007090430A (en) * | 2005-09-28 | 2007-04-12 | General Electric Co <Ge> | GOLD/NICKEL/COPPER BRAZING ALLOY FOR BRAZING WC-Co TO TITANIUM ALLOY |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100562790B1 (en) | Copper alloy and copper alloy thin sheet | |
| JPS6247117B2 (en) | ||
| JPS63317282A (en) | Gold alloy filler metal for brazing | |
| JPS63313692A (en) | Gold alloy filler metal for brazing | |
| JPS63317276A (en) | Gold alloy filler metal for brazing | |
| JPS63317283A (en) | Gold alloy filler metal for brazing | |
| JPS63317284A (en) | Gold alloy filler metal for brazing | |
| JPS63317290A (en) | Silver alloy filler metal for brazing | |
| JPS63317289A (en) | Silver alloy filler metal for brazing | |
| JPS63317281A (en) | Gold alloy filler metal for brazing | |
| JPS63317286A (en) | Silver alloy filler metal for brazing | |
| JPS63317278A (en) | Gold alloy filler metal for brazing | |
| JPS63317279A (en) | Gold alloy filler metal for brazing | |
| JPS63313693A (en) | Silver alloy filler metal for brazing | |
| JPS63317277A (en) | Gold alloy filler metal for brazing | |
| JPS63317291A (en) | Silver alloy filler metal for brazing | |
| JPS63313690A (en) | Gold alloy filler metal for brazing | |
| JPS63313694A (en) | Silver alloy filler metal for brazing | |
| JPS63317287A (en) | Silver alloy filler metal for brazing | |
| JPS63317288A (en) | Silver alloy filler metal for brazing | |
| JP2007111715A (en) | Solder alloy | |
| JPS63313695A (en) | Silver alloy filler metal for brazing | |
| JPS63317273A (en) | Gold alloy filler metal for brazing | |
| JPS6236798B2 (en) | ||
| JPS5865597A (en) | Ag alloy brazing filler metal having excellent surface characteristic of brazed part |