JPS63317290A - Silver alloy filler metal for brazing - Google Patents
Silver alloy filler metal for brazingInfo
- Publication number
- JPS63317290A JPS63317290A JP15168987A JP15168987A JPS63317290A JP S63317290 A JPS63317290 A JP S63317290A JP 15168987 A JP15168987 A JP 15168987A JP 15168987 A JP15168987 A JP 15168987A JP S63317290 A JPS63317290 A JP S63317290A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- filler metal
- alloy
- silver
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 title abstract description 22
- 239000002184 metal Substances 0.000 title abstract description 8
- 229910052751 metal Inorganic materials 0.000 title abstract description 8
- 239000000945 filler Substances 0.000 title abstract 7
- 229910001316 Ag alloy Inorganic materials 0.000 title abstract 3
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 13
- 239000000956 alloy Substances 0.000 claims abstract description 13
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 6
- 229910052742 iron Inorganic materials 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 229910052718 tin Inorganic materials 0.000 claims abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract description 3
- 239000002253 acid Substances 0.000 abstract description 2
- 238000007788 roughening Methods 0.000 abstract 2
- 229910017755 Cu-Sn Inorganic materials 0.000 abstract 1
- 229910017927 Cu—Sn Inorganic materials 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 13
- 239000000463 material Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000002845 discoloration Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、銀ろう合金の改良に関するものである。[Detailed description of the invention] (Industrial application field) The present invention relates to improvements in silver solder alloys.
（従来技術とその問題点）
一般に真空遮断器、電子管、サイリスター、ＩＣパフケ
ージ等にお−けるろう材用銀ろう合金としては、銀に銅
を７．５〜３５重量％、さらにすず３〜ｌＯ重量％の範
囲で添加した銀−銅一すず合金が主に用いられている。(Prior art and its problems) In general, silver brazing alloys for brazing materials in vacuum circuit breakers, electron tubes, thyristors, IC puff cages, etc. contain 7.5 to 35% by weight of copper and 3 to 1O of tin. A silver-copper-tin alloy added in a range of % by weight is mainly used.
然し乍ら、このろう材にてろう付を行った場合、ろう付
後のろう表面が荒れ、凹凸が発生するものである。従っ
てこのろう材を用いてろう付を行った部品を酸洗浄した
り、めっき処理したりすると、前記凹凸に洗浄液等が浸
入する。この洗浄液は完全に除去することが困難である
為、凹凸の部分に洗浄液が残存し、その結果残存した洗
浄液等によりろう材部が変色、腐蝕したり、めっきにふ
くれが生じたりする等の欠点があった。However, when brazing is performed using this brazing material, the solder surface after brazing becomes rough and uneven. Therefore, when parts brazed using this brazing material are acid-cleaned or plated, the cleaning liquid or the like will penetrate into the irregularities. Since this cleaning solution is difficult to remove completely, it may remain on uneven areas, resulting in disadvantages such as discoloration and corrosion of the brazing metal or blistering of the plating due to the remaining cleaning solution. was there.
（発明の目的）
本発明は上記欠点を解消すべくなされたものであり、ろ
う付後のろう表面の荒れが少な（、凹凸の発生も少ない
銀ろう合金を提供せんとするものである。(Objective of the Invention) The present invention has been made in order to eliminate the above-mentioned drawbacks, and aims to provide a silver solder alloy in which the solder surface after brazing is less rough (and has less unevenness).
（問題点を解決するための手段）
本発明の銀ろう合金は、銅２０〜５０重量％、すず３〜
１２重量％、鉄、ニッケル、コバルトの少なくとも１種
０．００１〜１．０重量％、残部銀より成るものである
。(Means for solving the problem) The silver brazing alloy of the present invention contains 20 to 50% by weight of copper and 3 to 50% by weight of tin.
12% by weight, 0.001 to 1.0% by weight of at least one of iron, nickel, and cobalt, and the balance silver.
本発明の銀ろう合金において、鉄、ニッケル、コバルト
の少なくとも１種を銀−銅一すす合金に含有させる理由
は、ろう付時溶融したろう材の表面張力を小さくし、そ
れによりろう付後のろう表面の荒れを小さくし、凹凸の
発生を抑制する為である。In the silver brazing alloy of the present invention, the reason why at least one of iron, nickel, and cobalt is contained in the silver-copper-soot alloy is to reduce the surface tension of the melted brazing material during brazing, thereby reducing the This is to reduce the roughness of the solder surface and suppress the occurrence of unevenness.
そしてその含有量を０．００１〜１．０量％と限定した
理由は、０．００１重量％未満ではろう付後のろう表面
の荒れ及び凹凸の発生を抑制することができず、また１
、０重量％を超えると極端にろう流れが悪くなりろう付
強度に悪影響を及ぼすからである。The reason for limiting the content to 0.001 to 1.0% by weight is that if it is less than 0.001% by weight, it is not possible to suppress the occurrence of roughness and unevenness on the solder surface after brazing.
This is because if it exceeds 0% by weight, the flow of the solder will be extremely poor and the brazing strength will be adversely affected.
次に本発明の銀ろう合金の効果を明瞭ならしめる為にそ
の具体的な実施例と従来例について説明する。Next, in order to clarify the effects of the silver solder alloy of the present invention, specific examples and conventional examples thereof will be explained.
（実施例）
下記の表の左欄に示す実施例と従来例の銀ろうを水素雰
囲気中で、ＩＣパッケージ用アルミナにＭｏ−Ｍｎをメ
タライズし、さらにその上にニッケルめっきを５μ施し
、その部分に鉄−ニッケル４２重量％から成るリードフ
レームのろう付を行い、ろう付後のろう表面の凹凸（溝
）の個数及び凹凸（溝）の深さを測定したところ下記の
表の右欄に示すような結果を得た。(Example) Silver solders of the example and conventional example shown in the left column of the table below were metallized with Mo-Mn on alumina for IC packages in a hydrogen atmosphere, and then 5μ of nickel was plated on top of that. A lead frame made of 42% iron and nickel by weight was brazed on the surface of the solder, and the number of unevenness (grooves) and the depth of the unevenness (grooves) on the soldering surface after brazing were measured, and the results are shown in the right column of the table below. I got similar results.
（以下余白）
上記の表の右欄の数値で明らかなように本発明の銀ろう
合金は、従来の銀ろう合金に比較して凹凸（溝）の発生
数が少なく、また凹凸＜ ｔａ ＞の深さが浅いもので
ある。(Margin below) As is clear from the numbers in the right column of the table above, the silver solder alloy of the present invention has fewer irregularities (grooves) than conventional silver solder alloys, and also has fewer irregularities <ta>. The depth is shallow.
（発明の効果）
以上詳記した通り本発明による銀ろう合金は、ろう付後
のろう表面の荒れが少なく、凹凸の発生も少な（、従っ
てろう付を行った部品を酸洗浄したり、めっき処理した
りしてもろう表面の凹凸に浸入する洗浄液等の量が少な
く、その結果それらを除去後の残存量も少なく、それだ
けろう打部の変色、腐蝕を抑制することができるという
優れた効果がある。(Effects of the Invention) As detailed above, the silver brazing alloy according to the present invention has less roughness on the solder surface after brazing and less occurrence of unevenness (therefore, it is possible to clean the brazed parts with acid or to remove the plating). Even after treatment, the amount of cleaning liquid that enters into the unevenness of the wax surface is small, and as a result, the amount remaining after removal is also small, which has the excellent effect of suppressing discoloration and corrosion of the waxed part. There is.
Claims (1)
ル、コバルトの少なくとも１種０．００１〜１．０重量
％、残部銀より成る銀ろう合金。A silver braze alloy comprising 20 to 50% by weight of copper, 3 to 12% by weight of tin, 0.001 to 1.0% by weight of at least one of iron, nickel, and cobalt, and the balance silver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15168987A JPS63317290A (en) | 1987-06-18 | 1987-06-18 | Silver alloy filler metal for brazing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15168987A JPS63317290A (en) | 1987-06-18 | 1987-06-18 | Silver alloy filler metal for brazing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63317290A true JPS63317290A (en) | 1988-12-26 |
Family
ID=15524111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15168987A Pending JPS63317290A (en) | 1987-06-18 | 1987-06-18 | Silver alloy filler metal for brazing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63317290A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104625471A (en) * | 2014-12-18 | 2015-05-20 | 郴州市金贵银业股份有限公司 | Cadmium-free silver filler metal for vacuum electron brazing and preparation method thereof |
-
1987
- 1987-06-18 JP JP15168987A patent/JPS63317290A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104625471A (en) * | 2014-12-18 | 2015-05-20 | 郴州市金贵银业股份有限公司 | Cadmium-free silver filler metal for vacuum electron brazing and preparation method thereof |
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