JPS63317286A - Silver alloy filler metal for brazing - Google Patents
Silver alloy filler metal for brazingInfo
- Publication number
- JPS63317286A JPS63317286A JP15168587A JP15168587A JPS63317286A JP S63317286 A JPS63317286 A JP S63317286A JP 15168587 A JP15168587 A JP 15168587A JP 15168587 A JP15168587 A JP 15168587A JP S63317286 A JPS63317286 A JP S63317286A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- filler metal
- alloy
- silver
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 title abstract description 18
- 239000002184 metal Substances 0.000 title abstract description 9
- 229910052751 metal Inorganic materials 0.000 title abstract description 9
- 239000000945 filler Substances 0.000 title abstract 7
- 229910001316 Ag alloy Inorganic materials 0.000 title abstract 3
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 11
- 239000000956 alloy Substances 0.000 claims abstract description 11
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 229910052738 indium Inorganic materials 0.000 claims abstract description 4
- 229910052742 iron Inorganic materials 0.000 claims abstract description 4
- 229910000679 solder Inorganic materials 0.000 claims description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 abstract description 6
- 229910000846 In alloy Inorganic materials 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract description 3
- 239000002253 acid Substances 0.000 abstract description 2
- 238000007788 roughening Methods 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- DICWILYNZSJYMQ-UHFFFAOYSA-N [In].[Cu].[Ag] Chemical compound [In].[Cu].[Ag] DICWILYNZSJYMQ-UHFFFAOYSA-N 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、銀ろう合金の改良に関するものである。[Detailed description of the invention] (Industrial application field) The present invention relates to improvements in silver solder alloys.
（従来技術とその問題点）
一般に真空遮断器、電子管、サイリスター、ＩＣパッケ
ージ等におけるろう材用限ろう合金としては、銀に銅を
７．５〜３５重量％さらにインジウム３〜１５重量％の
範囲で添加した銀−銅一インジウム合金が主に用いられ
ている。(Prior art and its problems) In general, a limited brazing alloy for use in vacuum circuit breakers, electron tubes, thyristors, IC packages, etc. contains silver, copper in an amount of 7.5 to 35% by weight, and indium in a range of 3 to 15% by weight. A silver-copper-indium alloy is mainly used.
然し乍ら、このろう材にてろう付を行った場合、ろう付
部のろう表面が荒れ、凹凸が発生するものである。従っ
てこのろう材を用いてろう付を行った部品を酸洗浄した
り、めっき処理したりすると、前記凹凸に洗浄液等が浸
入する。この洗浄液は完全に除去することが困難である
為、凹凸の部分に洗浄液が残存し、その結果残存した洗
浄液等によりろう打部が変色、腐蝕したり、めっきにふ
くれが生じたりする等の欠点があった。However, when brazing is performed using this brazing material, the brazed surface of the brazed portion becomes rough and uneven. Therefore, when parts brazed using this brazing material are acid-cleaned or plated, the cleaning liquid or the like will penetrate into the irregularities. Since this cleaning solution is difficult to remove completely, it may remain on uneven areas, resulting in disadvantages such as discoloration and corrosion of the soldered parts and blistering of the plating due to the remaining cleaning solution. was there.
（発明の目的）
本発明は上記欠点を解消すべくなされたものであり、ろ
う付部のろう表面の荒れが少なく、凹凸の発生も少ない
銀ろう合金を提供せんとするものである。(Object of the Invention) The present invention has been made in order to eliminate the above-mentioned drawbacks, and it is an object of the present invention to provide a silver braze alloy in which the solder surface of the brazed portion has less roughness and less unevenness.
（問題点を解決するための手段）
本発明の銀ろう合金は、銅２０〜５５重量％、インジウ
ム３〜１５重量％及び鉄、ニッケル、コバルトの少なく
とも１種０．００１〜１．０重量％、残部銀より成るも
のである。(Means for Solving the Problems) The silver brazing alloy of the present invention comprises 20 to 55% by weight of copper, 3 to 15% by weight of indium, and 0.001 to 1.0% by weight of at least one of iron, nickel, and cobalt. , the remainder consisting of silver.
本発明の譲ろう合金において、鉄、ニッケル、コバルト
の少なくとも１種を銀−銅一インジウム合金に含有させ
る理由は、ろう付時溶融したろう材の表面張力を小さく
し、それによりろう付部のろう表面の荒れを小さくし、
凹凸の発生を抑制する為である。In the brazing alloy of the present invention, the reason why at least one of iron, nickel, and cobalt is contained in the silver-copper-indium alloy is to reduce the surface tension of the melted brazing material during brazing, thereby reducing the Reduces roughness on the wax surface,
This is to suppress the occurrence of unevenness.
そしてそれの含有量を０．００１〜１．０量％と限定し
た理由は、０．００１重量％未満ではろう付後のろう表
面の荒れ及び凹凸の発生を抑制することができず、また
１、０重量％を超えると極端にろう流れが悪くなり、ろ
う付強度に悪影響を及ぼすからである。又、ろう成分の
偏析を生じるからである。The reason for limiting the content to 0.001 to 1.0% by weight is that if it is less than 0.001% by weight, it is not possible to suppress the occurrence of roughness and unevenness on the solder surface after brazing. This is because if the content exceeds 0% by weight, the flow of the solder will be extremely poor and the brazing strength will be adversely affected. Moreover, this is because segregation of wax components occurs.
次に本発明の銀ろう合金の効果を明瞭ならしめる為にそ
の具体的な実施例と従来例について説明する。Next, in order to clarify the effects of the silver solder alloy of the present invention, specific examples and conventional examples thereof will be explained.
（実施例）
下記の表の左欄に示す実施例と従来例の銀ろうを水素雰
囲気中で、ＩＣパッケージ用アルミナにＭｏ−Ｍｎをメ
タライズし、さらにその上にニッケルめっきを５μ施し
、その部分に鉄−ニッケル４２重量％から成るリードフ
レームのろう付を行い、ろう付後のろう表面の凹凸（溝
）の個数及び凹凸１）の深さを測定したところ下記の表
の右欄に示すような結果を得た。(Example) Silver solders of the example and conventional example shown in the left column of the table below were metallized with Mo-Mn on alumina for IC packages in a hydrogen atmosphere, and then 5μ of nickel was plated on top of that. A lead frame made of 42% iron-nickel by weight was brazed on the surface of the solder, and the number of unevenness (grooves) and the depth of the unevenness 1) on the soldering surface after brazing were measured, as shown in the right column of the table below. I got good results.
上記の表の右欄の数値で明らかなように本発明の銀ろう
合金は、従来の限ろう合金に比較して凹凸（溝）の発生
数が少なく、また凹凸（溝）の深さが浅いものである。As is clear from the numbers in the right column of the table above, the silver solder alloy of the present invention has fewer irregularities (grooves) than conventional solder alloys, and the depth of the irregularities (grooves) is shallower. It is something.
（発明の効果）
以上詳記した通り本発明による銀ろう合金は、ろう付後
のろう表面の荒れが少なく、凹凸の発生も少なく、従っ
てろう付を行った部品を酸洗浄したり、めっき処理した
りしてもろう表面の凹凸に浸入する洗浄液等の量が少な
く、その結果それらを除去後の残存量も少なく、それだ
けろう材部の変色、腐蝕を抑制することができるという
優れた効果がある。(Effects of the Invention) As detailed above, the silver brazing alloy according to the present invention has less roughness on the solder surface after brazing and less occurrence of unevenness, and therefore, the soldered parts can be cleaned with acid or subjected to plating treatment. The amount of cleaning liquid that penetrates into the unevenness of the solder metal surface is small, and as a result, the amount remaining after removal is also small, which has the excellent effect of suppressing discoloration and corrosion of the solder metal part. be.
Claims (1)
、ニッケル、コバルトの少なくとも１種０．００１〜１
．０重量％、残部銀より成る銀ろう合金。20-55% by weight of copper, 3-15% by weight of indium, and 0.001-1% of at least one of iron, nickel, and cobalt
．． Silver solder alloy consisting of 0% by weight, balance silver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15168587A JPS63317286A (en) | 1987-06-18 | 1987-06-18 | Silver alloy filler metal for brazing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15168587A JPS63317286A (en) | 1987-06-18 | 1987-06-18 | Silver alloy filler metal for brazing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63317286A true JPS63317286A (en) | 1988-12-26 |
Family
ID=15524019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15168587A Pending JPS63317286A (en) | 1987-06-18 | 1987-06-18 | Silver alloy filler metal for brazing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63317286A (en) |
-
1987
- 1987-06-18 JP JP15168587A patent/JPS63317286A/en active Pending
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