JPS63293894A - Manufacture of printed circuit board - Google Patents
Manufacture of printed circuit boardInfo
- Publication number
- JPS63293894A JPS63293894A JP12928187A JP12928187A JPS63293894A JP S63293894 A JPS63293894 A JP S63293894A JP 12928187 A JP12928187 A JP 12928187A JP 12928187 A JP12928187 A JP 12928187A JP S63293894 A JPS63293894 A JP S63293894A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- adhesive
- metal powder
- copper powder
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 239000000853 adhesive Substances 0.000 claims abstract description 38
- 230000001070 adhesive effect Effects 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 30
- 239000000843 powder Substances 0.000 claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 23
- 229910000679 solder Inorganic materials 0.000 claims abstract description 15
- 239000007788 liquid Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract description 6
- 238000007650 screen-printing Methods 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 229920006332 epoxy adhesive Polymers 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 239000003973 paint Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000001723 curing Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000009835 boiling Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000007750 plasma spraying Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005686 electrostatic field Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は電気及び電子装置に用いられる印刷配線板の製
造方法に関する。更に詳しくは導電性金属粉により導電
パターンを形成する印刷配線板の製造方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing printed wiring boards used in electrical and electronic devices. More specifically, the present invention relates to a method of manufacturing a printed wiring board in which a conductive pattern is formed using conductive metal powder.
［従来の技術］
従来、この種の印刷配線板の製造方法には、■ガラス布
基材、紙基材等の絶縁基板に３５〜７０終讃厚の銅箔を
エポキシ樹脂、フェノール樹脂等の接着剤により接着し
た銅張積層板を出発材料とし、不要な部分をエツチング
などで取去って配線パターンを形成するエツチド・フォ
イル法や。[Prior Art] Conventionally, the manufacturing method of this type of printed wiring board includes: ■ Copper foil with a final thickness of 35 to 70 cm is coated with epoxy resin, phenol resin, etc. on an insulating substrate such as glass cloth base material or paper base material. The etched foil method uses a copper-clad laminate bonded with adhesive as the starting material and removes unnecessary parts by etching to form a wiring pattern.
■絶縁基板の所望の配線部分にのみ選択的にめっきなど
を施して導体配線パターンを形成するアディティブ法や
、
■銅粉にバインダーを加えた導電塗料又は導電ペースト
を基板上に直接印刷し、これを焼成により硬化させる方
法（例えば特開昭５２−９７１Ｈ１特開昭５８−１５４
２９２）や、
■揮発性フラックスにてコートされた銅粉塗料を基板上
の未硬化の接着剤層上に印刷する方法（例えば特開昭５
８−８７３９７）や、■高沸点溶剤に銅微粒子を含ませ
た塗ネ４を塗／σし、高温乾燥により無電解銅めっきを
析出させて導電パターンを形成させる方法（例えば特開
昭５７−１２２５９７）や、
更には■基板上にシャドウィングマスクを設けてこの上
から導電性金属粉を溶射して導電パターンを形成する方
法（例えば特開昭５９−８４５９８、特開昭８ｌ−９１
９９５）等が知られている。■ Additive method, in which a conductive wiring pattern is formed by selectively plating only the desired wiring portions of an insulating substrate, and ■ Conductive paint or conductive paste, which is made by adding a binder to copper powder, is directly printed on the substrate. A method of hardening by firing (for example, JP-A-52-971H1 JP-A-58-154)
292), and (2) a method of printing copper powder paint coated with volatile flux onto an uncured adhesive layer on a substrate (for example, JP-A No. 5
8-87397), or ① a method of applying coating 4 containing fine copper particles in a high boiling point solvent and depositing electroless copper plating by drying at high temperature to form a conductive pattern (for example, JP-A-57- 122597), and furthermore, (1) a method of forming a conductive pattern by providing a shadowing mask on the substrate and spraying conductive metal powder thereon (for example, Japanese Patent Application Laid-Open No. 59-84598, Japanese Patent Application Laid-open No. 81-91).
995) etc. are known.
［発明が解決しようとする問題点］
しかし、■及び（ののエツチングによる方法は、玉程数
が多いため、製造時間が長く、また湿式であるため有害
な廃液処理に留意しなければならない問題点があった。[Problems to be solved by the invention] However, the etching methods (1) and (2) require a long production time because of the large number of beads, and are wet, so care must be taken to dispose of harmful waste liquid. There was a point.
また、■の導電塗料又は導電ペーストを用いる方法は、
導電塗料等の硬化に高温度の焼成を要するため、耐熱性
のセラミック基板を用いたハイブリッドＩＣ等に用途が
限定される問題点があった。またこの方法で低温処理す
ると、低い配線抵抗値を安定して得ることが困難な欠点
があった。In addition, the method using conductive paint or conductive paste (■)
Since high-temperature baking is required to harden conductive paints, etc., there is a problem in that the application is limited to hybrid ICs using heat-resistant ceramic substrates. Furthermore, when low-temperature processing is performed using this method, there is a drawback that it is difficult to stably obtain a low wiring resistance value.
また、に）の泥状の銅粉塗料を用いる方法は、所望の配
線部分以外の部位に銅粉塗料が付着するのを防止するた
めに作業が煩雑になる問題点があった。In addition, the method using muddy copper powder paint in (2) has the problem that the work is complicated in order to prevent the copper powder paint from adhering to areas other than the desired wiring portions.
また、■の高沸点溶剤に銅微粒子を含ませた塗料を用い
る方法は、無電解銅めっきを析出させる工程があるため
、■と同様の問題点があった。Furthermore, method (1) using a paint containing fine copper particles in a high-boiling solvent has the same problems as (2) because it involves a step of depositing electroless copper plating.
更に、■の金属粉を溶射して導電パターンを形成する方
法は、プラズマ溶射装置などの特殊でかつ高価な装置を
必要とし、また基板が大きくなると、溶射時間が長くな
る問題点があり、更に配線部分以外の面積に比べて配線
部分の面積が少ないため、基板全面に溶射された金属の
うち利用される金属の比率が少なく、電力効率が低い欠
点があった。Furthermore, the method (3) of thermally spraying metal powder to form a conductive pattern requires special and expensive equipment such as plasma spraying equipment, and also has the problem that the thermal spraying time becomes longer as the substrate becomes larger. Since the area of the wiring part is smaller than the area of the wiring part, the proportion of metal used in the metal sprayed on the entire surface of the board is small, resulting in low power efficiency.
本発明の目的は、高価な装置を必要とせず、乾式１程に
よるため公害問題を惹起せず、作業性が良好で量産に適
し低コストに製造し得る印刷配線板の製造方法を提供す
ることにある。An object of the present invention is to provide a method for manufacturing a printed wiring board that does not require expensive equipment, does not cause pollution problems because it is a dry process, has good workability, is suitable for mass production, and can be manufactured at low cost. It is in.
［問題点を解決するための手段］
上記目的を達成するための本発明の構成を第１図に基づ
いて説明する。[Means for Solving the Problems] The configuration of the present invention for achieving the above object will be explained based on FIG. 1.
本発明の印刷配線板の製造方法は、電気絶縁基板上に接
着剤により電気回路のパターンを形成する接着剤パター
ン形成工程１と、この接着剤が未硬化の状態で基板に導
電性金属粉を接触させて接着剤に金属粉を付着させる金
属粉付着工程２と。The method for manufacturing a printed wiring board of the present invention includes an adhesive pattern forming step 1 in which an electrical circuit pattern is formed using an adhesive on an electrically insulating substrate, and a conductive metal powder is applied to the substrate while the adhesive is uncured. Metal powder adhesion step 2 of adhering metal powder to the adhesive by contacting it.
この接着剤を硬化させて金属粉を基板上に固着する接着
剤硬化工程３と、基板を溶融半田液に浸して金属粉に半
田を付着させて導電パターンを形成する金属粉への半！
ｌ付着工程４とを含むものである。Adhesive curing step 3, in which the adhesive is cured and the metal powder is fixed on the board, and the board is immersed in molten solder liquid, and the solder is attached to the metal powder to form a conductive pattern.
1 adhesion step 4.
電気絶縁基板は、印刷配線基板として多用されるガラス
布基材、紙ノフ材等の基板が用いられる。As the electrically insulating substrate, a substrate made of a glass cloth base material, a paper nof material, etc., which is often used as a printed wiring board, is used.
ノλ板の部品取付用の孔は、本発明の製造に先立って明
けてもおいてもよいし、基板に導電パターンが形成され
た後に明けてもよい。The holes for attaching components in the λ plate may be made prior to manufacturing the present invention, or may be made after the conductive pattern is formed on the substrate.
接着剤は、常温硬化性樹脂接着剤でもよいが。The adhesive may be a resin adhesive that cures at room temperature.
導電性金属粉の均一な付着のためにフェノール、エポキ
シ、ポリエステル、ポリウレタン、ポリブタジェン、ア
クリルなどの熱硬化、光硬化性樹脂接着剤がよい、接着
剤は所望のパターンを形成するために適度の粘度に調整
される。Heat-curing and photo-curing resin adhesives such as phenol, epoxy, polyester, polyurethane, polybutadiene, and acrylic are recommended for uniform adhesion of conductive metal powder.Adhesives must have an appropriate viscosity to form the desired pattern. is adjusted to
接着剤によるパターンの形成は、スクリーン印刷方法や
、インクジェットプリンタのように接着剤を粒子状にし
、これを帯電させてノズルから１個ずつ接着剤粒子を飛
出させ、それを静電界で制御して所望の配線パターンを
接着剤で描く方法を採用してもよい。Patterns can be formed using adhesives using screen printing methods or inkjet printers, in which adhesive particles are made into particles, which are charged and released one by one from a nozzle, and which are controlled using an electrostatic field. Alternatively, a method may be adopted in which the desired wiring pattern is drawn using an adhesive.
未硬化の状態の接着剤に導電性金属粉を付着させるには
、絶縁基板の上方から金属粉を均一に散布してもよいし
、又は金属粉を気流により浮遊させた空間に基板を通過
させて金属粉を付着ぎせてもよい、接着剤でパターンの
形成されない基板上に積った金属粉は振動等の簡単な方
法により除去できるが、残存するものは接着剤の硬化後
に取除いてもよい。To attach conductive metal powder to an uncured adhesive, the metal powder can be uniformly sprinkled from above the insulating substrate, or the metal powder can be passed through the substrate into a space where it is suspended by an air current. The metal powder that has accumulated on the substrate on which no pattern is formed with the adhesive can be removed by simple methods such as vibration, but the remaining metal powder may be removed after the adhesive has hardened. good.
導電性金属粉は入手が容易な銅粉が好ましいが、銀粉等
でもよい、銅粉を用いた場合には１次工程の半田のぬれ
性を高めるために、熱や光によって接着剤を完全に硬化
させた後に、希硫酸で酸洗いして酸化物を除去するか、
フラックスを塗布しておくと、その表面が活性化すると
よい。The conductive metal powder is preferably copper powder, which is easily available, but silver powder may also be used. If copper powder is used, the adhesive must be completely removed by heat or light in order to improve the wettability of the solder in the first step. After curing, remove oxides by pickling with dilute sulfuric acid, or
Applying flux will activate the surface.
なお、半田のぬれ性のよい金属粉を用いる場合には、特
にその表面の活性化処理を施さなくてもよい。Note that when a metal powder with good solder wettability is used, it is not necessary to specifically activate the surface of the metal powder.
［作 川］
絶縁基板上の接着剤が硬化すると、金属粉が基板に堅牢
に固着する。この基板を溶融半田槽の中を通すと、溶融
半［■が金属粉を核として付着し。[Sakukawa] When the adhesive on the insulating substrate hardens, the metal powder firmly adheres to the substrate. When this board is passed through a molten solder bath, the molten solder [■] adheres to the metal powder as a nucleus.
しかも半）１１の表面張力の（動きで導線状に程良くつ
ながり、所望の導電パターンが基板上に形成される。Furthermore, due to the movement of the surface tension of 11, the conductive pattern is properly connected in the form of a conductive wire, and a desired conductive pattern is formed on the substrate.
［実施例］ 次に本発明の実施例を図面に基づいて詳しく説明する。[Example] Next, embodiments of the present invention will be described in detail based on the drawings.
第２図（ａ）に示すように、ガラス布基材の電気絶縁基
板１０の上面にスクリーン印刷でエポキシ樹脂接着剤１
１により電気回路のパターンを形成する。この接着剤１
１が未硬化の状態で基板１０の上方から銅粉１２を均一
に散布して接着剤１１に銅粉１２を付着させる。基板ｌ
Ｏを振動させ接着剤の付いていない箇所の銅粉を基板か
ら取除く 。As shown in FIG. 2(a), an epoxy resin adhesive 1 is applied by screen printing on the top surface of an electrically insulating substrate 10 made of a glass cloth base material.
1 to form an electric circuit pattern. This adhesive 1
Copper powder 12 is uniformly sprinkled from above the substrate 10 while the adhesive 1 is in an uncured state to adhere the copper powder 12 to the adhesive 11. board l
Vibrate the O to remove the copper powder from the parts where the adhesive is not attached.
次いで基板１０を加熱して接着剤１１を硬化させ銅粉１
２を基板上に固着する（第２図（ｂ））、硬化が十分に
行われたところで基板上に固着した銅粉１２を希硫酸で
酸洗いして酸化物を除去する。Next, the substrate 10 is heated to harden the adhesive 11 and the copper powder 1
After sufficient curing, the copper powder 12 fixed on the substrate is pickled with dilute sulfuric acid to remove oxides.
更に基板を水洗し乾燥した後、溶融半田槽１３の中に浸
し、銅粉上に半田１４を付着させる（第２図（Ｃ））と
、ノ＾板上には導電パターン１５が形成される（第２図
（ｄ））。Further, after washing the board with water and drying it, it is immersed in a molten solder tank 13 and solder 14 is attached to the copper powder (FIG. 2(C)), thereby forming a conductive pattern 15 on the board. (Figure 2(d)).
［発明の効果］
以上述べたように、本発明によれば、プラズマ溶射装置
のような特殊で高価な装置がなくても、また銅塩化物等
の有害物の処理を必要とすることなく、少ない工程で短
い時間でしかも大きなサイズの印刷配線板であっても低
コストに製造できる。このため１本発明の製造方法は、
作業効率が良く量産に適する。[Effects of the Invention] As described above, according to the present invention, there is no need for special and expensive equipment such as plasma spraying equipment, and there is no need to treat harmful substances such as copper chloride. Printed wiring boards can be manufactured in a short time with fewer steps and at low cost even if they are large in size. For this reason, 1 the manufacturing method of the present invention is as follows:
Good work efficiency and suitable for mass production.
また本発明の製造方法は、接着剤の粘度を適度に調整で
きるため、所望のパターンを正確かつ簡便に形成でき、
また焼成工程を要しないため、絶縁基板は必ずしも耐熱
性でなくてもよい。In addition, since the manufacturing method of the present invention allows the viscosity of the adhesive to be adjusted appropriately, a desired pattern can be formed accurately and easily.
Furthermore, since a firing process is not required, the insulating substrate does not necessarily have to be heat resistant.
更に金属粉の上に半（０層が形成されるため、安定して
低い配線抵抗値が得られる等の優れた効果がある。Furthermore, since a half layer is formed on the metal powder, there are excellent effects such as stable and low wiring resistance values.
第１図は本発明の製造方法によるＬ程図。
第２図は本発明実施例の製造方法を示す印刷配線板の要
部断面図。
ｌＯ：電気絶縁基板、ｌｌ：接着剤、１２：銅粉（金属
粉）、１３：溶融′１′：ｎｌ槽、ｌ ４ ： ”Ｆ−
１１１゜１５：導電パターン。
ＩＳ Ａ？ 出願人 マクロ・エンジニアリング株式会
社代理人弁理士 須 １１１１０パブ−１゜（ｄ）
第２図FIG. 1 is a diagram showing the L process according to the manufacturing method of the present invention. FIG. 2 is a sectional view of a main part of a printed wiring board showing a manufacturing method according to an embodiment of the present invention. lO: Electrical insulating substrate, l: Adhesive, 12: Copper powder (metal powder), 13: Melting '1': nl tank, l4: "F-
111°15: Conductive pattern. IS A? Applicant Macro Engineering Co., Ltd. Representative Patent Attorney Su 11110 Pub-1゜(d) Figure 2
Claims (1)
を形成し、前記接着剤が未硬化の状態で前記基板に導電
性金属粉を接触させて前記接着剤に前記金属粉を付着さ
せ、前記接着剤を硬化させて前記金属粉を前記基板上に
固着し、前記基板を溶融半田液に浸して前記金属粉に半
田を付着させて導電パターンを形成する印刷配線板の製
造方法。 ２）接着剤は熱硬化性樹脂接着剤である特許請求の範囲
第１項に記載の印刷配線板の製造方法。 ３）導電性金属粉は銅粉である特許請求の範囲第１項に
記載の印刷配線板の製造方法。[Scope of Claims] 1) An electric circuit pattern is formed on an electrically insulating substrate using an adhesive, and conductive metal powder is brought into contact with the substrate while the adhesive is uncured, so that the metal powder is applied to the adhesive. A printed wiring board, in which a conductive pattern is formed by attaching powder, curing the adhesive to fix the metal powder on the substrate, and immersing the substrate in molten solder liquid to attach solder to the metal powder. Production method. 2) The method for manufacturing a printed wiring board according to claim 1, wherein the adhesive is a thermosetting resin adhesive. 3) The method for manufacturing a printed wiring board according to claim 1, wherein the conductive metal powder is copper powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12928187A JPS63293894A (en) | 1987-05-26 | 1987-05-26 | Manufacture of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12928187A JPS63293894A (en) | 1987-05-26 | 1987-05-26 | Manufacture of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63293894A true JPS63293894A (en) | 1988-11-30 |
Family
ID=15005703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12928187A Pending JPS63293894A (en) | 1987-05-26 | 1987-05-26 | Manufacture of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63293894A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5068714A (en) * | 1989-04-05 | 1991-11-26 | Robert Bosch Gmbh | Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5710290A (en) * | 1980-06-23 | 1982-01-19 | Clarion Co Ltd | Method of forming wiring conductor for printed circuit board |
| JPS60245193A (en) * | 1984-05-18 | 1985-12-04 | アルプス電気株式会社 | Method of forming circuit of circuit board |
-
1987
- 1987-05-26 JP JP12928187A patent/JPS63293894A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5710290A (en) * | 1980-06-23 | 1982-01-19 | Clarion Co Ltd | Method of forming wiring conductor for printed circuit board |
| JPS60245193A (en) * | 1984-05-18 | 1985-12-04 | アルプス電気株式会社 | Method of forming circuit of circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5068714A (en) * | 1989-04-05 | 1991-11-26 | Robert Bosch Gmbh | Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made |
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