JPH0382095A - Connection of semiconductor ic - Google Patents
Connection of semiconductor icInfo
- Publication number
- JPH0382095A JPH0382095A JP21898689A JP21898689A JPH0382095A JP H0382095 A JPH0382095 A JP H0382095A JP 21898689 A JP21898689 A JP 21898689A JP 21898689 A JP21898689 A JP 21898689A JP H0382095 A JPH0382095 A JP H0382095A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- resin
- light
- semiconductor
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 9
- 230000001070 adhesive effect Effects 0.000 claims abstract description 16
- 239000000853 adhesive Substances 0.000 claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 9
- 239000000843 powder Substances 0.000 claims abstract description 6
- 239000002904 solvent Substances 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 230000001678 irradiating effect Effects 0.000 claims abstract description 3
- 239000004020 conductor Substances 0.000 abstract description 5
- 238000007650 screen-printing Methods 0.000 abstract description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010931 gold Substances 0.000 abstract description 2
- 229910052737 gold Inorganic materials 0.000 abstract description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000000758 substrate Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010946 fine silver Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半導体重 に関する。[Detailed description of the invention] [Industrial application field] The present invention Regarding.
Ｃの配線基板への接続方法
従来この種の接続方法としては、第３図に示すように、
絶縁性基板１の導体パターン２上に半田ペースト６をス
クリーン印刷法などにより供給し半導体ＩＣ４を搭載し
リフローして半田を溶融させて行なうのが一般的であっ
た。Method of connecting C to the wiring board Conventionally, this type of connection method is as shown in Fig. 3.
Generally, solder paste 6 is supplied onto conductor pattern 2 of insulating substrate 1 by screen printing or the like, semiconductor IC 4 is mounted, and the solder is melted by reflowing.
上述した従来の半田による接続方法は、半導体ＩＣのリ
ードピッチが０．５ｍｍ以下になると半田ペーストがリ
フローにより溶融したとき、リードとリード間が狭いた
め半田ブリッジが生じ易いという欠点があった。The above-described conventional solder connection method has the disadvantage that when the lead pitch of a semiconductor IC becomes 0.5 mm or less, solder bridges are likely to occur when the solder paste melts due to reflow because the distance between the leads is narrow.
本発明の目的は、リードとリード間のショートを防止出
来る半導体ＩＣの接続方法を提供することにある。An object of the present invention is to provide a method for connecting semiconductor ICs that can prevent short circuits between leads.
本発明の半導体ＩＣリードと配線基板への接続する方法
は、ＩＣ搭載ランド上に感光性樹脂と導電性金属の微粉
からなる導電性のペースト状の接着剤を塗布し、ＩＣを
搭載しキュアを行なう工程と、光を照射して樹脂を感光
させる工程と、感光した部分の樹脂を溶剤にて除去する
工程εを有することを特徴とする。The method of connecting a semiconductor IC lead to a wiring board according to the present invention is to apply a conductive paste adhesive made of photosensitive resin and fine conductive metal powder onto the IC mounting land, mount the IC, and cure it. The method is characterized by comprising a step of exposing the resin to light by irradiating it with light, and a step ε of removing the exposed portion of the resin with a solvent.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の第１の実施例を示す図面で（Ａ）〜（
Ｃ）は側面図、（ａ）〜（ｅ）は断面図である。絶縁性
基板１上に導体パターン２を形成する。FIG. 1 is a drawing showing a first embodiment of the present invention (A) to (
C) is a side view, and (a) to (e) are cross-sectional views. A conductor pattern 2 is formed on an insulating substrate 1.
次に部品を接続すべき導体パターン２上に接着剤３を１
０〜２０μｍの厚さに従来のスクリーン印刷技術を用い
て塗布し半導体ＩＣ４を搭載し１００〜１２０℃の高温
槽内で３０〜６０分キュアを行なう、ここで用いる接着
剤３は感光性樹脂と銀（あるいは金）の微粉を混合した
導電性のペースト状の接着剤である０次に接着剤３上に
光を照射し樹脂を感光させる。この状態を第１図（Ｂ）
。Next, apply 1 layer of adhesive 3 on the conductor pattern 2 where the parts are to be connected.
The adhesive 3 used here is a photosensitive resin and is applied to a thickness of 0 to 20 μm using conventional screen printing technology, mounted with a semiconductor IC 4, and cured for 30 to 60 minutes in a high temperature bath at 100 to 120°C. Light is irradiated onto the zero-order adhesive 3, which is a conductive paste adhesive mixed with fine silver (or gold) powder, to expose the resin. This state is shown in Figure 1 (B).
.
（ｂ）に示す０次に溶剤で感光した部分を溶かした後更
に１４０〜１６０℃で１〜２時間キュアを行ない密着性
を向上させ最終的に第１図（Ｃ）。After dissolving the exposed area with the zero-order solvent shown in (b), it was further cured at 140 to 160°C for 1 to 2 hours to improve adhesion, and finally, as shown in Figure 1 (C).
（ｃ）の状態で成る。It consists of state (c).
第２図は本発明の第２の実施例の断面図である。第１の
実施例の後リード部にエポキシ樹脂５を塗布し１５０℃
２Ｈキユアを行なう。この実施例ではリード部に樹脂を
塗布するこεによりＩＣリードの密着性が向上する。FIG. 2 is a sectional view of a second embodiment of the invention. After the first example, epoxy resin 5 was applied to the lead part and heated to 150°C.
Perform 2H cure. In this embodiment, the adhesion of the IC leads is improved by applying resin to the lead portions.
以上説明したように本発明は、感光性樹脂と導電性の金
属微粉を混合した接着剤を塗布し、不必要部分の接着剤
を光を照射し感光させ溶剤で除去するのでリードピッチ
が０．５ｍｍ以下の表面実相用ＩＣでも容易に接続が出
来６と同時に、半田寸法などのようなブリッジによるシ
ョートの発生もなく確実な接続が可能となった。As explained above, in the present invention, an adhesive made of a mixture of photosensitive resin and conductive metal powder is applied, and unnecessary parts of the adhesive are exposed to light and removed with a solvent, so that the lead pitch can be reduced to 0. It is possible to easily connect even an IC with a surface area of 5 mm or less, and at the same time, a reliable connection is possible without the occurrence of short circuits due to bridges such as those caused by solder dimensions.
第１図（Ａ）〜（Ｃ）、（ａ）〜（ｃ）は、本発明の第
１の実施例の工程を示す側面図及び断面図、第２図は、
本発明の第２の実施例の断面図、第３図は従来方法の断
面図である。
１・・・絶縁性基板、２・・・導体パターン、３・・・
導電性接着剤、４・・・半導体ＩＣｌ３・・・エポキシ
樹脂、６・・・半田ペースト、
７・・・リード。FIGS. 1(A) to (C) and (a) to (c) are side views and cross-sectional views showing the steps of the first embodiment of the present invention, and FIG.
A sectional view of the second embodiment of the present invention, and FIG. 3 is a sectional view of the conventional method. 1... Insulating substrate, 2... Conductor pattern, 3...
Conductive adhesive, 4... Semiconductor ICl3... Epoxy resin, 6... Solder paste, 7... Lead.
Claims (1)
において、ＩＣ搭載ランド上に感光性樹脂中に導電性金
属の微粉を混合したペースト状の接着剤を塗布し、ＩＣ
を搭載しキュアを行なう工程と、光を照射し樹脂を感光
させる工程と、感光した部分の樹脂を溶剤で除去する工
程とを含むことを特徴とする半導体ＩＣの接続方法。In a method for connecting IC leads to a board with a wiring pattern, a paste-like adhesive made of a photosensitive resin mixed with fine conductive metal powder is applied to the IC mounting land, and the IC
1. A method for connecting a semiconductor IC, comprising: a step of mounting and curing the resin; a step of exposing the resin by irradiating light; and a step of removing the exposed resin with a solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1218986A JP2800294B2 (en) | 1989-08-24 | 1989-08-24 | Connection method of semiconductor IC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1218986A JP2800294B2 (en) | 1989-08-24 | 1989-08-24 | Connection method of semiconductor IC |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0382095A true JPH0382095A (en) | 1991-04-08 |
| JP2800294B2 JP2800294B2 (en) | 1998-09-21 |
Family
ID=16728479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1218986A Expired - Lifetime JP2800294B2 (en) | 1989-08-24 | 1989-08-24 | Connection method of semiconductor IC |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2800294B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05235243A (en) * | 1991-12-11 | 1993-09-10 | Internatl Business Mach Corp <Ibm> | Electronic package assembly and manufacture therefor |
| US5469333A (en) * | 1993-05-05 | 1995-11-21 | International Business Machines Corporation | Electronic package assembly with protective encapsulant material on opposing sides not having conductive leads |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61234091A (en) * | 1985-04-10 | 1986-10-18 | 松下電器産業株式会社 | Electric connection |
-
1989
- 1989-08-24 JP JP1218986A patent/JP2800294B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61234091A (en) * | 1985-04-10 | 1986-10-18 | 松下電器産業株式会社 | Electric connection |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05235243A (en) * | 1991-12-11 | 1993-09-10 | Internatl Business Mach Corp <Ibm> | Electronic package assembly and manufacture therefor |
| US5414928A (en) * | 1991-12-11 | 1995-05-16 | International Business Machines Corporation | Method of making an electronic package assembly with protective encapsulant material |
| US5469333A (en) * | 1993-05-05 | 1995-11-21 | International Business Machines Corporation | Electronic package assembly with protective encapsulant material on opposing sides not having conductive leads |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2800294B2 (en) | 1998-09-21 |
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