JPS6239557B2 - - Google Patents
Info
- Publication number
- JPS6239557B2 JPS6239557B2 JP54018476A JP1847679A JPS6239557B2 JP S6239557 B2 JPS6239557 B2 JP S6239557B2 JP 54018476 A JP54018476 A JP 54018476A JP 1847679 A JP1847679 A JP 1847679A JP S6239557 B2 JPS6239557 B2 JP S6239557B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating resin
- flexible insulating
- varnish
- flexible
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 42
- 239000011347 resin Substances 0.000 claims description 42
- 239000002966 varnish Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 14
- 239000011888 foil Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 7
- 239000004642 Polyimide Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
本発明は可撓性配線体用基板を製造する方法に
関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a flexible wiring body substrate.
銅箔などの金属箔にポリイミド樹脂などの可撓
性絶縁樹脂のワニスを塗布し、固化させてなる可
撓性配線体用基板を用いたフレキシブル・プリン
ト基板およびテープキヤリアにおいては、第１図
に示すように、配線体のリード１を電気素子２の
電極３等に接続する位置にある可撓性絶縁樹脂フ
イルム４を除去して、該フイルムに接続用等の穴
５を設ける必要がある。従来、この接続用等の穴
の形成方法としては、可撓性絶縁樹脂にホトレジ
ストを塗布し、穴等のパターンを焼き付け、現像
した後、可撓性絶縁樹脂をエツチングする方法
と、可撓性絶縁樹脂上に金属薄膜をマスク蒸着
し、この金属薄膜を保護膜として可撓性絶縁樹脂
をエツチングする方法とがあつた。しかし、これ
らの方法では、可撓性絶縁樹脂のエツチングに多
くの時間が必要であり、特に、一般に使用されて
いるポリイミド樹脂は、25μｍをエツチングする
のに約１時間が必要である。このことは基板の生
産性の低下、生産設備の増大の原因となつてお
り、ひいては基板の製造コストを上昇させてい
た。 Figure 1 shows flexible printed circuit boards and tape carriers that use flexible wiring boards made by coating metal foil such as copper foil with a varnish of flexible insulating resin such as polyimide resin and solidifying it. As shown, it is necessary to remove the flexible insulating resin film 4 located at the position where the lead 1 of the wiring body is connected to the electrode 3 of the electric element 2, etc., and provide a hole 5 for connection etc. in the film. Conventionally, the methods for forming holes for connections, etc. have been to apply photoresist to a flexible insulating resin, bake a pattern such as holes, develop it, and then etch the flexible insulating resin. There is a method in which a thin metal film is deposited on an insulating resin using a mask, and the flexible insulating resin is etched using this thin metal film as a protective film. However, these methods require a lot of time to etch the flexible insulating resin, and in particular, the commonly used polyimide resin requires about 1 hour to etch 25 μm. This causes a decrease in substrate productivity and an increase in production equipment, which in turn increases the cost of manufacturing substrates.
本発明の目的は、上記した従来技術の欠点をな
くし、接続用等の穴を有する可撓性配線体用基板
を、エツチングすることなしに製造する方法を提
供するにある。上記目的を達成するため、本発明
は、可撓性絶縁樹脂のワニスを塗布する前の工程
で、該可撓性絶縁樹脂のワニスとは溶け合わない
他のレジンによるレジン膜を、金属箔上に所定の
形状に形成し、可撓性絶縁樹脂のワニスを固化さ
せ、フイルムとした後、前記レジン膜を除去する
ことにより、可撓性絶縁樹脂フイルムに前記所定
の形状の穴を有する可撓性配線体用基板を製造す
るものである。 SUMMARY OF THE INVENTION An object of the present invention is to eliminate the drawbacks of the prior art described above and to provide a method for manufacturing a flexible wiring body substrate having holes for connection, etc., without etching. In order to achieve the above object, the present invention applies a resin film made of another resin that does not melt with the flexible insulating resin varnish on the metal foil in a step before applying the flexible insulating resin varnish. After forming the flexible insulating resin film into a predetermined shape and solidifying the flexible insulating resin varnish to form a film, the resin film is removed to form a flexible insulating resin film having holes in the predetermined shape. This is to manufacture a substrate for a sexual wiring body.
次に、本発明の実施例を第２図により説明す
る。まず、第２図ａに示すごとく、銅箔などの金
属箔６上に、可撓性絶縁樹脂のワニスと溶け合わ
ないレジンによるレジン膜７を、接続用等の穴と
同一形状に、印刷などの方法により形成する。次
に、第２図ｂに示すごとく、ポリイミドなどの可
撓性絶縁樹脂のワニスを塗布し、固化させること
によつて、可撓性絶縁樹脂フイルム４を形成す
る。接続用等の穴の位置に形成した前記レジン膜
７の厚さを可撓性絶縁樹脂フイルムの厚さとほぼ
同一とすることにより、レジン膜７の上には可撓
性絶縁樹脂のワニスを塗布させないで、金属箔の
露出している面のみに塗布することが可能であ
る。さらに、可撓性絶縁樹脂フイルム４を形成し
た後、レジン膜７を溶媒中で溶解、膨潤、剥離す
るなどの方法で除去することにより、第２図ｃに
示すごとく、接続用等の穴５を有する可撓性配線
体用基板を製造することができる。 Next, an embodiment of the present invention will be described with reference to FIG. First, as shown in FIG. 2a, a resin film 7 made of a resin that does not melt with the flexible insulating resin varnish is printed on a metal foil 6 such as copper foil in the same shape as the connection hole, etc. Formed by the method of Next, as shown in FIG. 2b, a flexible insulating resin film 4 is formed by applying and solidifying a varnish of flexible insulating resin such as polyimide. By making the thickness of the resin film 7 formed at the positions of holes for connection etc. almost the same as the thickness of the flexible insulating resin film, a flexible insulating resin varnish is applied on the resin film 7. It is possible to apply only to the exposed surface of the metal foil. Furthermore, after forming the flexible insulating resin film 4, the resin film 7 is removed by dissolving it in a solvent, swelling it, peeling it off, etc., thereby forming holes 5 for connection, etc., as shown in FIG. 2c. A flexible wiring body substrate having the following can be manufactured.
ここで、使用する金属箔としては、銅箔が一般
的であるが、銅合金箔、アルミニウムおよびその
合金箔などでもよい。また、可撓性絶縁樹脂とし
ては、ポリイミドのほか、ポリアミドイミド、ポ
リエステル、ポリパラバン酸など、可撓性絶縁樹
脂であれば、特に制限はない。また、接続用等の
穴を形成するために用いられるレジンは、前記可
撓性絶縁樹脂のワニスと溶け合わないものなら
ば、特に制限はないが、形成された膜の前記ワニ
スとの濡れ性が小さくて、ワニスを塗布したとき
ワニスをはじくものならば、さらに好都合であ
る。従つて、例えば塩化ビニール、ポリエチレ
ン、ポリプロピレン、ポリアミド、ポリエステ
ル、フエノキシなどの熱可塑性樹脂、シリコー
ン、ポリエステル、ポリウレタン、エポキシ、ア
クリル、メタクリルなどの熱硬化性樹脂が用いら
れる。 Here, the metal foil used is generally copper foil, but copper alloy foil, aluminum and its alloy foil, etc. may also be used. Further, the flexible insulating resin is not particularly limited as long as it is a flexible insulating resin such as polyimide, polyamideimide, polyester, and polyparabanic acid. There are no particular restrictions on the resin used to form the holes for connection, etc., as long as it does not dissolve with the varnish of the flexible insulating resin, but the wettability of the formed film with the varnish is not particularly limited. It is even more convenient if the material is small and can repel varnish when applied. Therefore, for example, thermoplastic resins such as vinyl chloride, polyethylene, polypropylene, polyamide, polyester, and phenoxy, and thermosetting resins such as silicone, polyester, polyurethane, epoxy, acrylic, and methacrylic are used.
以下、本発明に従つて基板を実際に製造した例
を詳述する。厚さ35μｍの銅箔上に、電気素子接
続用等の穴に相当する位置に、付加反応型シリコ
ーンゴムをスクリーン印刷法で、接続用等の穴の
形状に印刷し、加熱硬化させた。厚さは20μm10
とした。ついで、ポリイミドワニスを20μｍの厚
さに塗布し、ピーク温度220℃に設定したトンネ
ル加熱炉を５分間通した後、１，１，１−トリク
ロロエタン中に浸漬し、シリコーンゴムを膨潤、
剥離させた。そのあと、ピーク温度400℃に設定
したトンネル加熱炉を５分間通し、ポリイミドを
完全に硬化させた。なお、ワニスを塗布する銅の
表面は、ワニスと銅との接着性を向上させるため
の酸化処理を行つてある。このようにして、ポリ
イミド被膜に電気素子接続用等の穴を有する銅箔
付きポリイミド基板を作成することができた。さ
らに、一般的なホトエツチング法により、この基
板の銅箔を所定の形状にエツチングして配線体を
形成し、フレキシブル基板とした。 Hereinafter, an example in which a substrate was actually manufactured according to the present invention will be described in detail. On a 35 μm thick copper foil, addition reaction silicone rubber was printed in the shape of a connection hole by screen printing at a position corresponding to a hole for connecting an electric element, etc., and was cured by heating. Thickness is 20μm 10
And so. Next, polyimide varnish was applied to a thickness of 20 μm, passed through a tunnel heating furnace set at a peak temperature of 220°C for 5 minutes, and then immersed in 1,1,1-trichloroethane to swell the silicone rubber.
Peeled off. Thereafter, the polyimide was completely cured by passing it through a tunnel heating furnace set at a peak temperature of 400°C for 5 minutes. Note that the surface of the copper to which the varnish is applied is subjected to oxidation treatment to improve the adhesion between the varnish and the copper. In this way, a polyimide substrate with a copper foil having holes for connecting electrical elements etc. in the polyimide film was able to be produced. Furthermore, the copper foil of this board was etched into a predetermined shape by a general photo-etching method to form a wiring body, thereby making a flexible board.
以上説明したように、本発明による可撓性配線
体用基板の製造方法は、従来のポリイミドフイル
ムをエツチングする方法に比べて、(イ)基板製作時
間を大幅に短縮できる、(ロ)高価なホトマスク、エ
ツチング用薬品に比べて安価なスクリーン、樹脂
でよい、等の特長があり、また、従来の、接着剤
を塗布したポリイミドフイルムを金型を用いてパ
ンチングした後、銅箔とラミネートする方法に比
べて、(ハ)高価な金型を用いない、(ニ)接着剤を用い
ないため、基板の耐熱性が高い、等の特長があ
る。従つて、特に多品種少量生産に好適な方法で
あり、本発明の効果は顕著である。 As explained above, compared to the conventional method of etching a polyimide film, the method for manufacturing a flexible wiring board according to the present invention can (a) significantly shorten the board manufacturing time, and (b) avoid expensive etching. It has features such as being able to use screens and resins, which are cheaper than photomasks and etching chemicals, and it is also a conventional method in which polyimide film coated with adhesive is punched using a mold and then laminated with copper foil. Compared to , it has the following advantages: (c) it does not use an expensive mold, and (d) it does not use adhesive, so the substrate has high heat resistance. Therefore, this method is particularly suitable for high-mix, low-volume production, and the effects of the present invention are remarkable.
第１図は可撓性配線体に電気素子を接続した状
態を示す断面図、第２図ａ，ｂ，ｃは本発明によ
る可撓性配線体用基板の製造工程における各工程
の基板を示す断面図である。
符号の説明、１……配線体のリード、２……電
気素子、３……電極、４……可撓性絶縁樹脂フイ
ルム、５……穴、６……金属箔、７……レジン
膜。
Fig. 1 is a sectional view showing a state in which an electric element is connected to a flexible wiring body, and Fig. 2 a, b, and c show the substrate at each step in the manufacturing process of a substrate for a flexible wiring body according to the present invention. FIG. Explanation of symbols: 1... Lead of wiring body, 2... Electric element, 3... Electrode, 4... Flexible insulating resin film, 5... Hole, 6... Metal foil, 7... Resin film.
Claims (1)
ることにより可撓性配線体用基板を製造する方法
において、可撓性絶縁樹脂のワニスを塗布する前
の工程で、該可撓性絶縁樹脂のワニスとは溶け合
わない他のレジンによるレジン膜を金属箔上に所
定の形状に形成し、次に金属箔上に前記可撓性絶
縁樹脂のワニスを塗布し、該ワニスを固化させ、
フイルムとした後、前記レジン膜を除去すること
により、可撓性絶縁樹脂フイルムに前記所定形状
の穴を有する可撓性配線体用基板を製造すること
を特徴とする可撓性配線体用基板の製造方法。1. In a method for manufacturing a substrate for a flexible wiring body by applying a flexible insulating resin varnish on a metal foil, in a step before applying the flexible insulating resin varnish, the flexible insulating A resin film made of another resin that does not melt with the resin varnish is formed in a predetermined shape on the metal foil, then the flexible insulating resin varnish is applied on the metal foil, and the varnish is solidified,
A substrate for a flexible wiring body, characterized in that a substrate for a flexible wiring body having holes of the predetermined shape in a flexible insulating resin film is manufactured by removing the resin film after forming the film. manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1847679A JPS55111195A (en) | 1979-02-21 | 1979-02-21 | Method of fabricating flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1847679A JPS55111195A (en) | 1979-02-21 | 1979-02-21 | Method of fabricating flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55111195A JPS55111195A (en) | 1980-08-27 |
| JPS6239557B2 true JPS6239557B2 (en) | 1987-08-24 |
Family
ID=11972686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1847679A Granted JPS55111195A (en) | 1979-02-21 | 1979-02-21 | Method of fabricating flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55111195A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0438757U (en) * | 1990-07-31 | 1992-04-02 |
-
1979
- 1979-02-21 JP JP1847679A patent/JPS55111195A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0438757U (en) * | 1990-07-31 | 1992-04-02 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55111195A (en) | 1980-08-27 |
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