JPS6328096A - Soldering assembly of hybrid integrated circuit - Google Patents
Soldering assembly of hybrid integrated circuitInfo
- Publication number
- JPS6328096A JPS6328096A JP17240986A JP17240986A JPS6328096A JP S6328096 A JPS6328096 A JP S6328096A JP 17240986 A JP17240986 A JP 17240986A JP 17240986 A JP17240986 A JP 17240986A JP S6328096 A JPS6328096 A JP S6328096A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- circuit
- circuit board
- hybrid integrated
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims description 23
- 238000000034 method Methods 0.000 claims description 35
- 239000003302 ferromagnetic material Substances 0.000 claims description 10
- 230000005291 magnetic effect Effects 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
この発明は混成集積回路のはんだ付組立方法に関する。 The present invention relates to a method for soldering and assembling hybrid integrated circuits.
この種の混成集積回路に対する従来のはんだ付組立方法
としては、あらかじめ導体パターン、および導体パター
ン上の部品取付は箇所にはんだクリームが印刷されてい
る回路基板に対し、その基板上の所定位置に各種の回路
部品をレイアウトして仮組立した後に、この状態を保持
したままリフローはんだ付法、あるいはディップはんだ
付法等により回路部品を回路基板上にはんだ付けする方
法が一般に採用されている。
この場合に仮組立状態で回路部品を回路基板上に仮保持
する手段として、従来では接着剤で回路部品を基板上に
固定する仮組立法が一般に採用されている。しかしなが
らかかる接着剤による仮組立方法では、仮組立工程の工
数が増す他に、接着剤による固着が強力過ぎるとはんだ
付工程におけるはんだの表面張力による部品のセルフア
ライメント効果を損なう恐れがあるし、また仮組立後は
手直しで部品を交換したり１部品の取付は位置を修正す
る必要が生じた場合には既に部品が基板上に接着されて
いるので作業が極めて困難となる等の難点がある。In the conventional soldering assembly method for this type of hybrid integrated circuit, the conductor pattern and the components on the conductor pattern are attached to a circuit board on which solder cream is printed. A commonly used method is to lay out and temporarily assemble the circuit components, and then solder the circuit components onto the circuit board while maintaining this state using reflow soldering, dip soldering, or the like. In this case, as a means for temporarily holding the circuit components on the circuit board in a temporarily assembled state, a temporary assembly method in which the circuit components are fixed onto the circuit board with an adhesive has been generally employed. However, with such temporary assembly methods using adhesives, in addition to increasing the number of steps in the temporary assembly process, if the adhesive is too strong, there is a risk that the self-alignment effect of the parts due to the surface tension of the solder during the soldering process will be impaired. After temporary assembly, if it becomes necessary to replace parts or correct the position of a single part, the work is extremely difficult because the parts are already glued onto the board.
この発明は上記の点にかんがみなされたものであり、前
記従来方法の難点を解消して組立工数の低減化、および
製品の品質向上が図れるようにした混成集積回路のはん
だ付組立方法を提供することを目的とする。The present invention has been made in consideration of the above points, and provides a method for soldering and assembling a hybrid integrated circuit, which eliminates the drawbacks of the conventional methods, reduces assembly man-hours, and improves product quality. The purpose is to
上記目的を達成するために、この発明は混成集積回路を
構成する各種回路部品のうち、少なくとも一部に強磁性
材を使用した回路部品に付いては、これら回路部品を前
記の仮組立状態で磁石による磁力で回路基板上の所定位
１に吸引保持し、この状態でリフロー法、ないしディッ
プ法等によりはんだ付を行うようにしたものである。In order to achieve the above object, the present invention provides a method for assembling circuit components in which ferromagnetic material is used in at least a portion of various circuit components constituting a hybrid integrated circuit. The circuit board is attracted and held at a predetermined position 1 on the circuit board by the magnetic force of a magnet, and soldering is performed in this state by a reflow method, a dip method, or the like.
第１図および第２図はりフローはんだ付法で行うこの発
明の異なる実施例を示す混成集積回路のはんだ付組立工
程の状態図を示すものである。まず第１図において、１
は自動組立ラインに組み込まれたりフローベルト、２は
このりフローベルト１の上に載置されたりフロー用トレ
ーであり、このトレー２は強磁性体で作られて、その上
面には所定ピッチ間隔置きに回路基板を保持するストッ
パ２ａが設けである。ここでリフロー用トレー２の一端
には永久磁石３がその磁極面をトレー２に吸着させて配
備しである。一方、トレー２の上には仮組立工程で回路
基板４が搭載され、さらにこの基板４上の所定位置に次
記した各種回路部品５〜９がレイアウトして組み込まれ
ている。ここで前記各回路部品の一例を示すと、部品５
はリードフレームに強磁性材である鉄−ニッケル系合金
を使用したフラットパッケージＩＣ１部品６は電極に鉄
系材料を使用したモールドクンタルコンデンサ、部品７
は同じく鉄系材料の電極を備えたミニモールドトランジ
スタ、部品８は鉄系材料のｔ掻を備えたメルフ抵抗、部
品９は鉄−ニッケル系合金のリード線であり、これらの
少なくとも一部に強磁性材を使用して構成された各回路
部品５〜９は前記した磁石３の磁気力により回路基板４
の上の所定位置に吸引保持されている。なお１０はあら
かじめ基板側に印刷されたはんだクリームである。なお
前記した永久磁石３の代わりに電磁石を採用することも
可能である。
上記により混成集積回路の仮組立が行われると、次にリ
フローはんだ付工程に移り、リフロー熱源の加熱により
はんだが熔融して各回路部品が回路基板上にはんだ付さ
れることになる。この場合にあらかじめ■■石３の磁気
力を適宜調整してお（ことにより、リフロー工程で溶融
したはんだの表面張力により各回路部品５〜９はセルフ
アライメントされて回路基板４上の所定位置にはんだ付
されることになる。なおリフロー熱源としては従来より
知られているホットプレート方式、ヒータブロック加熱
方式、赤外線加熱方式、蒸気加熱方式等がそのまま採用
できる他、トレー２をはんだの付かない強磁性体で作る
ことによりディップはんだ付法を採用することも可能で
ある。
上記した混成集積回路のはんだ付組立方法によれば、従
来方法のように接着剤を使用すること無しに各種部品を
回路基板上に仮保持することができ、したがって仮組立
工数が低減できるとともに、はんだ付工程における溶融
はんだの表面張力によるセルフアライメント効果を阻害
することも無くて製品の品質向上が図れるようになる。
さらに仮組立後の部品の交換２組み込み位置の変更等も
自由に手直しできるなどの利点も得られるようになる。
次に第２図に別な実施例を示す、この実施例では回路基
板４の上下両面に回路部品を実装してリフロー法により
はんだ付けする例であり、特に強磁性材を使用した回路
部品１１．１２等に付いてはこれら回路部品が基板４の
下面側にレイアウトされ、仮組立状態では各部品１１．
１２がこれに対応して基板４の上面側に個々に配備した
小形磁石３の磁気力により吸引保持されている。なお符
号１３．１４は非磁性材よりなるセラミックコンデンサ
等の回路部品であり、これら部品は従来方法と同様に接
着剤で仮固定されている。また図中１５は回路基板４を
支持する治具、 １６はリフロー炉である。
この実施例では、まず仮組立工程で治具１５に支持され
た回路基板４に前記方法により各種回路部品を組み込ん
で仮保持した後に、治具１５とともに混成集積回路の仮
組立体をリフロー炉１６内に引き入れ、ここで加熱操作
してリフローはんだ付を行う、なおリフロー炉の加熱方
式には赤外線加熱あるいは雰囲気加熱方式等が採用され
る。FIGS. 1 and 2 are state diagrams of a soldering assembly process of a hybrid integrated circuit showing different embodiments of the present invention carried out by the beam flow soldering method. First, in Figure 1, 1
is a flow belt that is incorporated into an automatic assembly line, and 2 is a flow tray that is placed on top of the flow belt 1. This tray 2 is made of ferromagnetic material, and its upper surface is marked with a predetermined pitch interval. A stopper 2a is provided to hold the circuit board in place. Here, a permanent magnet 3 is disposed at one end of the reflow tray 2 with its magnetic pole surface attracted to the tray 2. On the other hand, a circuit board 4 is mounted on the tray 2 in a temporary assembly process, and various circuit components 5 to 9 described below are laid out and assembled at predetermined positions on the board 4. Here, an example of each of the circuit components is shown as component 5.
Part 6 is a flat package IC whose lead frame is made of iron-nickel alloy, which is a ferromagnetic material. Part 6 is a molded Kuntal capacitor whose electrodes are made of iron material. Part 7
Component 8 is a mini-molded transistor with electrodes made of iron-based material, component 8 is a Melf resistor with a trough made of iron-based material, and component 9 is a lead wire made of iron-nickel alloy. Each circuit component 5 to 9 constructed using a magnetic material is attached to the circuit board 4 by the magnetic force of the magnet 3 described above.
is held in place by suction. Note that 10 is solder cream printed on the board side in advance. Note that it is also possible to employ an electromagnet instead of the permanent magnet 3 described above. Once the hybrid integrated circuit has been temporarily assembled as described above, the process moves to a reflow soldering process, in which the solder is melted by heating from a reflow heat source and each circuit component is soldered onto the circuit board. In this case, the magnetic force of the stone 3 should be adjusted appropriately in advance (by this, each circuit component 5 to 9 will be self-aligned to a predetermined position on the circuit board 4 due to the surface tension of the solder melted in the reflow process). As a reflow heat source, the conventionally known hot plate method, heater block heating method, infrared heating method, steam heating method, etc. can be used as is. It is also possible to use the dip soldering method by making it with a magnetic material. According to the above-mentioned soldering assembly method for hybrid integrated circuits, various components can be assembled into circuits without using adhesives as in the conventional method. It can be temporarily held on the board, which reduces the number of temporary assembly steps, and also improves the quality of the product without impeding the self-alignment effect caused by the surface tension of the molten solder during the soldering process. It also has the advantage of being able to freely modify parts such as replacing parts 2 and changing the assembly position after temporary assembly. Next, another embodiment is shown in Fig. 2. In this embodiment, the upper and lower parts of the circuit board 4 are This is an example in which circuit components are mounted on both sides and soldered using the reflow method. Especially for circuit components 11, 12, etc. that use ferromagnetic materials, these circuit components are laid out on the bottom side of the board 4, and temporarily assembled. Each part is in condition 11.
12 are attracted and held by the magnetic force of small magnets 3 individually arranged on the upper surface side of the substrate 4. Note that reference numerals 13 and 14 indicate circuit components such as ceramic capacitors made of non-magnetic materials, and these components are temporarily fixed with adhesive as in the conventional method. Further, in the figure, 15 is a jig for supporting the circuit board 4, and 16 is a reflow oven. In this embodiment, first, in the temporary assembly process, various circuit components are assembled and temporarily held in the circuit board 4 supported by the jig 15 by the method described above, and then the temporary assembly of the hybrid integrated circuit is assembled together with the jig 15 in the reflow oven 16. The reflow soldering is carried out by heating the solder in the reflow oven.Infrared heating or atmosphere heating is used as the heating method for the reflow oven.
以上述べたようにこの発明によれば、少なくとも一部に
強磁性材を使用した回路部品に付いては、これら回路部
品を前記の仮組立状態で磁石による磁力で回路基板上の
所定位置に吸引保持し、この状態ではんだ付を行うこと
により、従来の方法のように接着剤を用いずに磁気力で
回路部品を基板上の所定位置に仮保持することができ、
したがって工程上の制約緩和、仮組立工数の低減化とと
もに、溶融はんだの表面張力による部品のセルフアライ
メント効果も充分に発揮させることができる等、製品の
品質向上１コストダウンに大いに寄与する実益が得られ
る。As described above, according to the present invention, for circuit components that use ferromagnetic material at least in part, these circuit components are attracted to a predetermined position on the circuit board by the magnetic force of the magnet in the temporarily assembled state. By holding the board in place and soldering it in this state, the circuit components can be temporarily held in place on the board using magnetic force without using adhesives like in conventional methods.
Therefore, in addition to easing process constraints and reducing the number of temporary assembly steps, it is also possible to fully utilize the self-alignment effect of parts due to the surface tension of molten solder, resulting in practical benefits that greatly contribute to improving product quality and reducing costs. It will be done.
Claims (1)
仮組立し、しかる後に各回路部品を一括して回路基板に
はんだ付けする混成集積回路のはんだ付組立方法におい
て、少なくとも一部に強磁性材を使用した回路部品に付
いては、これら回路部品を前記の仮組立状態で磁石によ
る磁力で回路基板上の所定位置に吸引保持し、この状態
ではんだ付を行うことを特徴とする混成集積回路のはん
だ付組立方法。 ２）特許請求の範囲第１項記載のはんだ付組立方法にお
いて、回路基板と回路部品との仮組立体を搭載するトレ
イを強磁性体と成し、かつ該トレイに取付けた磁石の磁
力により仮組立状態で強磁性材使用の回路部品を回路基
板上の所定位置に吸引保持することを特徴とする混成集
積回路のはんだ付組立方法。 ３）特許請求の範囲第１項記載のはんだ付組立方法にお
いて、仮組立状態で回路基板の下面側に組込まれる強磁
性材使用の回路部品を回路基板の上面側に配置した磁石
により所定位置に吸引保持することを特徴とする混成集
積回路のはんだ付組立方法。[Scope of Claims] 1) A method of soldering and assembling a hybrid integrated circuit, in which various circuit components are installed and temporarily assembled at predetermined positions on a circuit board, and then each circuit component is soldered to the circuit board all at once, For circuit components that use ferromagnetic material at least in part, these circuit components should be attracted and held in a predetermined position on the circuit board by the magnetic force of a magnet in the above-mentioned temporarily assembled state, and soldering should be performed in this state. A method for soldering and assembling a hybrid integrated circuit, characterized by: 2) In the soldering assembly method described in claim 1, the tray on which the temporary assembly of the circuit board and circuit components is mounted is made of a ferromagnetic material, and the temporary assembly is made of a ferromagnetic material by the magnetic force of the magnet attached to the tray. A method for soldering and assembling a hybrid integrated circuit characterized by attracting and holding circuit components using ferromagnetic material in a predetermined position on a circuit board in an assembled state. 3) In the soldering assembly method as set forth in claim 1, circuit components made of ferromagnetic material to be assembled on the bottom side of a circuit board in a temporarily assembled state are held in a predetermined position by a magnet placed on the top side of the circuit board. A method for soldering and assembling a hybrid integrated circuit characterized by suction and holding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17240986A JPS6328096A (en) | 1986-07-22 | 1986-07-22 | Soldering assembly of hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17240986A JPS6328096A (en) | 1986-07-22 | 1986-07-22 | Soldering assembly of hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6328096A true JPS6328096A (en) | 1988-02-05 |
Family
ID=15941420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17240986A Pending JPS6328096A (en) | 1986-07-22 | 1986-07-22 | Soldering assembly of hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6328096A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011109065A (en) * | 2009-10-22 | 2011-06-02 | Tdk Corp | Electronic component and method of manufacturing the electronic component |
-
1986
- 1986-07-22 JP JP17240986A patent/JPS6328096A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011109065A (en) * | 2009-10-22 | 2011-06-02 | Tdk Corp | Electronic component and method of manufacturing the electronic component |
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