JPH0318094A - Method of mounting electronic parts onto printed circuit board - Google Patents
Method of mounting electronic parts onto printed circuit boardInfo
- Publication number
- JPH0318094A JPH0318094A JP15304289A JP15304289A JPH0318094A JP H0318094 A JPH0318094 A JP H0318094A JP 15304289 A JP15304289 A JP 15304289A JP 15304289 A JP15304289 A JP 15304289A JP H0318094 A JPH0318094 A JP H0318094A
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- printed circuit
- circuit board
- metal chips
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 239000004020 conductor Substances 0.000 claims abstract description 23
- 229910000679 solder Inorganic materials 0.000 abstract description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 6
- 238000000206 photolithography Methods 0.000 abstract description 4
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 229910052759 nickel Inorganic materials 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- 229910017052 cobalt Inorganic materials 0.000 abstract 1
- 239000010941 cobalt Substances 0.000 abstract 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 abstract 1
- 239000006071 cream Substances 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔１既 要〕
電子部品のプリント基板への実装方法に関し、微細な端
子間隔を有する電子部品をプリント基板に半田付けして
実装する方法を目的とし、所定のパターンに導体層を形
成したプリント基板面に磁化可能な金属片を混練した樹
脂層を塗布した後、該樹脂層に磁界を印加して前記樹脂
層内の金属片を前記導体層上に選択的に集めた後、該集
結された金属片上に実装すべき電子部品の端子を設置し
た状態で該端子を加熱加圧して、該端子を前記金属片を
介してプリント基板の導体層に接続するようにして構戒
する。[Detailed Description of the Invention] [1 Already Required] Regarding a method for mounting electronic components on a printed circuit board, the present invention aims at a method for mounting electronic components having minute terminal intervals on a printed circuit board by soldering them in a predetermined pattern. After applying a resin layer kneaded with magnetizable metal pieces on the printed circuit board surface on which the conductor layer has been formed, a magnetic field is applied to the resin layer to selectively collect the metal pieces in the resin layer onto the conductor layer. After that, the terminals of the electronic components to be mounted are placed on the assembled metal pieces, and the terminals are heated and pressurized to connect the terminals to the conductor layer of the printed circuit board via the metal pieces. Take precautions.
本発明はプリント基板への電子部品の実装方法に関する
。The present invention relates to a method for mounting electronic components onto a printed circuit board.
プリント基板に半田付けして実装する電子部品の端子間
隔は、最近益々微細化され、このような微細間隔の端子
を有する電子部品をプリント基板に半田付けして実装す
る技術の開発が望まれている。The spacing between the terminals of electronic components that are soldered and mounted on a printed circuit board has recently become increasingly finer, and there is a desire to develop a technology for mounting electronic components that have such finely spaced terminals on a printed circuit board by soldering. There is.
従来、第３図に示すようにピングリッドアレイ型パッケ
ージを有する表面実装型（Ｓｕｒｆａｃｅ Ｍｏｕｎｔ
Ｔｅｃｈｎｏｌｏｇｙ；ＳＭＴ）電子部品１をプリント
基板２に半田付けして実装する場合、プリント基仮２に
導電性ペーストより或るフットプリント３を印刷した後
、スクリーン印刷法を用いて該フットプリント上に半田
クリーム（粉末半田を樹脂ペーストに混練したもの）４
を印刷した後、この半田クリーム上に半田付けすべき電
子部品１の端子５を設置した状態で、該電子部品をプリ
ント基板に接着剤で仮止めする．
次いで該プリント基板をコンベア上に設置し、該コンベ
アを加熱されたガスが噴射された加熱炉内を通過させて
半田クリーム４を溶融させて電子部品の端子５をプリン
ト基板のフットプリント３に接着させて電子部品の端子
をプリント基板のソフトプリントに半田接続している。Conventionally, surface mount type devices have a pin grid array type package as shown in Fig. 3.
Technology (SMT) When mounting an electronic component 1 on a printed circuit board 2 by soldering, a certain footprint 3 is printed on the printed circuit board 2 using conductive paste, and then a screen printing method is used to print a footprint 3 on the printed circuit board 2. Solder cream (powdered solder kneaded into resin paste) 4
After printing, the terminals 5 of the electronic component 1 to be soldered are placed on the solder cream, and the electronic component is temporarily fixed to the printed circuit board with adhesive. Next, the printed circuit board is placed on a conveyor, and the conveyor is passed through a heating furnace in which heated gas is injected to melt the solder cream 4 and bond the terminal 5 of the electronic component to the footprint 3 of the printed circuit board. Then, the terminals of the electronic components are soldered to the soft print on the printed circuit board.
ところで上記した従来の方法では、フットプリント３上
に半田クリーム４を印刷する際、印刷製版を必要とし、
この印刷製版はステンレス製の細線をメッシュ状に加工
戒形したもので、高精度のものが得難く、そのため、０
．５＋＋ｎ程度のピッチで高精度にフットプリント上に
半田クリームを印刷塗布するのは困難である。By the way, in the conventional method described above, when printing the solder cream 4 on the footprint 3, printing plate making is required.
This printing plate is made by processing fine stainless steel wire into a mesh shape, and it is difficult to obtain high precision, so
．． It is difficult to print and apply solder cream on a footprint with high precision at a pitch of about 5++n.
然し、プリント基板に半田付けして実装する電子部品の
端子間の寸法は益々微細化され、最近では端子間のピン
チが０．１〜０．３ｆｉの電子部品をプリント基板に半
田付けして実装する技術が要求さている。However, the dimensions between the terminals of electronic components that are soldered and mounted on a printed circuit board have become increasingly finer, and recently electronic components with a pinch between terminals of 0.1 to 0.3 fi have been soldered and mounted on a printed circuit board. There is a need for technology to do this.
本発明は上記した問題点を解決し、プリント基板にフッ
トプリントを印刷してその上に半田クリームを印刷塗布
する従来の方法に代わって、プリント基板の製造に用い
られているホトリソグラフィ法を用いてエッチングによ
り形成した微細な導゛体層パターン上に電子部品が容易
に半田付けして実装できる方法の提供を目的とする。The present invention solves the above-mentioned problems and uses the photolithography method used for manufacturing printed circuit boards instead of the conventional method of printing a footprint on a printed circuit board and printing and applying solder cream thereon. The purpose of the present invention is to provide a method by which electronic components can be easily soldered and mounted on a fine conductor layer pattern formed by etching.
上記目的を達成する本発明のプリント基板の半田付け方
法は、第１図（ａ）より第１図（ｄｌ迄に示すように、
所定のパターンに形戒した導体層１１を有するプリント
基板１２面に磁化可能な金属片ｌ３を混練した樹脂１ｉ
１４を塗布した後、該樹脂層に磁界を印加して前記樹脂
層内の金属片を前記導体層ｌｌ上に選択的に集めた後、
該集結された金属片上に実装すべき電子部品ｌの端子５
を設置した状態で該端子を加熱加圧して、該端子を前記
金属片を介してプリント基板の導体層に接続するように
して構戒する．
〔作 用〕
本発明の方法は、通常のプリント基板の製造に於いて用
いられているホトリソグラフィにより所定のパターンに
導体層を形或したプリント基板の表面に、表面に半田メ
ッキを施されたニッケル（Ｎｔ）、或いはコバル｝ （
Ｃｏ）等の磁化され易い針状の金属片を混練したエポキ
シ樹脂を塗布し、前記導体層の配置位置に対応した位置
に磁石ｌ５を埋設した樹脂板より戒る金属磁化板１７を
設置し、該磁石の磁界によって前記金属片を導体層上に
集結させる。The printed circuit board soldering method of the present invention that achieves the above object is as shown in FIG. 1(a) to FIG. 1(dl).
A resin 1i in which a magnetizable metal piece l3 is kneaded on a printed circuit board 12 surface having a conductive layer 11 shaped in a predetermined pattern.
After applying No. 14, a magnetic field is applied to the resin layer to selectively collect metal pieces in the resin layer onto the conductor layer ll,
Terminals 5 of electronic components l to be mounted on the assembled metal pieces
With the terminal installed, heat and pressure is applied to the terminal, and the terminal is connected to the conductor layer of the printed circuit board via the metal piece. [Function] The method of the present invention applies solder plating to the surface of a printed circuit board on which a conductive layer has been formed in a predetermined pattern by photolithography, which is used in the production of ordinary printed circuit boards. Nickel (Nt) or Kobal} (
A metal magnetized plate 17 is coated with an epoxy resin kneaded with needle-shaped metal pieces that are easily magnetized such as Co), and a metal magnetized plate 17 is installed at a position corresponding to the placement position of the conductor layer, with magnets 15 embedded therein. The metal pieces are concentrated on the conductor layer by the magnetic field of the magnet.
このような樹脂層を低温で加熱して該樹脂層を半硬化状
態にして、この集結された金属片上に実装すべき電子部
品の端子を設置し、この端子を加熱圧着することで、該
端子か金属片を介してプリント基板の導体層パターンに
接続され、微細な端子間隔を有する電子部品が容易にプ
リント基板に半田付けされる。The resin layer is heated at a low temperature to make the resin layer into a semi-hardened state, and the terminals of the electronic components to be mounted are placed on the assembled metal pieces, and the terminals are heat-pressed and bonded. The electronic components are connected to the conductor layer pattern of the printed circuit board through the metal piece, and electronic components having minute terminal intervals can be easily soldered to the printed circuit board.
以下、図面を用いて本発明の一実施例に付き詳細に説明
する。Hereinafter, one embodiment of the present invention will be described in detail using the drawings.
第１図（ａ）より第１図（ｄ）迄は、本発明の方法の一
実施例の説明図である。FIG. 1(a) to FIG. 1(d) are explanatory diagrams of one embodiment of the method of the present invention.
第１図（ａｌに示すように、通常のプリント基板の導体
層パターンの製造に用いられるホトリソグラフィ法を用
いて、所定のパターンに形成した導体層１１を有するプ
リント基板１２上に、針状で表面に半田メッキを施した
長さがｌＯ〜２０Ｉ！ｍのＮｉ、或いはＣｏの金属片１
３が混合され、有機溶媒に混練されたエポキシ、或いは
ポリスチレンより或る樹脂層１４をスキージ等を用いて
所定の厚さに印刷塗布する。As shown in FIG. 1 (al), a needle-shaped needle is placed on a printed circuit board 12 having a conductor layer 11 formed in a predetermined pattern using the photolithography method used for manufacturing the conductor layer pattern of ordinary printed circuit boards. A Ni or Co metal piece 1 with a length of 1O to 20I!m with solder plating on the surface.
A resin layer 14 made of epoxy or polystyrene kneaded in an organic solvent is printed to a predetermined thickness using a squeegee or the like.
次いで第２図に示すように、該プリント基板の所定のパ
ターンの導体層に対応した位置に、永久磁石１５を樹脂
１６に埋設した金属磁化板１７を前記プリント基板１２
上に設置する。Next, as shown in FIG. 2, a metal magnetized plate 17 with a permanent magnet 15 embedded in resin 16 is attached to the printed circuit board 12 at a position corresponding to the conductor layer of a predetermined pattern on the printed circuit board.
Place it on top.
このようにすると第１図（ｂ）に示すように、前記磁石
の磁界により前記樹脂層ｌ４内の金属片ｌ３を導体層１
１上に集結させることができる。In this way, as shown in FIG. 1(b), the magnetic field of the magnet moves the metal piece l3 in the resin layer l4 to the conductor layer 1.
can be concentrated on one.
次いで該プリント基板を低温で加熱し、前記したエポキ
シ樹脂層を半硬化状態にする。Next, the printed circuit board is heated at a low temperature to bring the epoxy resin layer into a semi-cured state.
次いで第１図（Ｃｌに示すように、該集結された金属片
１３上に実装すべき電子部品１の端子５を設置する。Next, as shown in FIG. 1 (Cl), the terminals 5 of the electronic component 1 to be mounted are placed on the assembled metal pieces 13.
更に第ｌ図（ｄ）に示すように、 該端子をボンディン
グ装置を用いて加熱しながら加圧すると、前記端子５が
樹脂層１４内に埋まり、樹脂層内の導体層上に集結され
た金属片１３を介してプリント基板１２に形成された導
体層１１上の半田層を溶融して該導体層１１と接続され
る。Further, as shown in FIG. 1(d), when the terminal is heated and pressurized using a bonding device, the terminal 5 is buried in the resin layer 14, and the metal concentrated on the conductor layer in the resin layer is removed. The solder layer on the conductor layer 11 formed on the printed circuit board 12 is melted and connected to the conductor layer 11 via the piece 13 .
このようにすれば、微細な端子間隔を有する電子部品も
容易にプリント基板に実装できる。In this way, even electronic components having minute terminal spacing can be easily mounted on the printed circuit board.
なお、本実施例の他にボンディング装置を用いずに上記
電子部品を治具等を用いてプリント基板に加圧しながら
加熱空気が噴射されている加熱炉内を通過させて電子部
品の端子を導体層に接続させても良い。In addition, in addition to this embodiment, without using a bonding device, the above-mentioned electronic component is passed through a heating furnace in which heated air is injected while pressurizing the printed circuit board using a jig or the like to connect the terminal of the electronic component to a conductor. It may be connected to layers.
また前記金属片は針状に加工する必要はなく微小な金属
片の形状であれば良い。Further, the metal piece does not need to be processed into a needle shape, and may be in the shape of a minute metal piece.
また前記金属磁化板は、永久磁石の代わりに磁化し易い
フエライトのような金属片にコイルを巻きつけたものを
樹脂に埋設し、このコイルに通電するようにしても良い
。Furthermore, instead of a permanent magnet, the metal magnetized plate may include a coil wound around a metal piece such as ferrite which is easily magnetized, which is embedded in a resin, and the coil is energized.
以上の説明から明らかなように本発明によれば微細な端
子間隔を有する電子部品が容易にプリント基板に半田付
けされて実装できる効果がある。As is clear from the above description, the present invention has the effect that electronic components having minute terminal intervals can be easily soldered and mounted on a printed circuit board.
第１図（ａｌより第１図ｆｄｌ迄は、本発明の方法の一
実施例の説明図、
第２図は本発明の方法に用いる金属磁化板の平面図、
第３図は従来の半田付け方法の説明図である。
図において、
ｌは電子部品、５は端子、１１は導体層、ｌ２はプリン
ト基板、１３は金属片、１４は樹脂層、ｌ５は永久磁石
、１６は樹脂板、ｌ７は金属磁化板を示す。
＋ｄ＋
＋＊’Ｒ ｆＩ７ ｉｉ −＝ 一突’ｋ４１ｊ ／ｌ
ＴＬｐｆｉ Ｉ！１第１図Figure 1 (al to Figure 1 fdl is an explanatory diagram of an embodiment of the method of the present invention, Figure 2 is a plan view of a metal magnetized plate used in the method of the present invention, Figure 3 is a conventional soldering method) It is an explanatory diagram of the method. In the figure, l is an electronic component, 5 is a terminal, 11 is a conductor layer, l2 is a printed circuit board, 13 is a metal piece, 14 is a resin layer, l5 is a permanent magnet, 16 is a resin plate, l7 indicates a metal magnetized plate. +d+ +*'R fI7 ii -= Hitko'k41j /l
TLpfi I! 1Figure 1
Claims (1)
基板（１２）面に磁化可能な金属片（１３）を混練した
樹脂層（１４）を塗布した後、該樹脂層に磁界を印加し
て前記樹脂層内の金属片を前記導体層上に選択的に集め
た後、該集結された金属片上に実装すべき電子部品（１
）の端子（５）を設置した状態で該端子を加熱加圧して
、該端子を前記金属片を介してプリント基板の導体層に
接続するようにしたことを特徴とするプリント基板への
電子部品実装方法。After applying a resin layer (14) kneaded with magnetizable metal pieces (13) to the surface of a printed circuit board (12) on which a conductor layer (11) is formed in a predetermined pattern, a magnetic field is applied to the resin layer to After selectively collecting the metal pieces in the resin layer on the conductor layer, an electronic component (1
) An electronic component for a printed circuit board, characterized in that the terminal (5) is heated and pressurized in a state where the terminal is installed, and the terminal is connected to a conductor layer of the printed circuit board via the metal piece. How to implement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15304289A JPH0318094A (en) | 1989-06-14 | 1989-06-14 | Method of mounting electronic parts onto printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15304289A JPH0318094A (en) | 1989-06-14 | 1989-06-14 | Method of mounting electronic parts onto printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0318094A true JPH0318094A (en) | 1991-01-25 |
Family
ID=15553701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15304289A Pending JPH0318094A (en) | 1989-06-14 | 1989-06-14 | Method of mounting electronic parts onto printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0318094A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0687137A3 (en) * | 1994-06-08 | 1996-09-11 | At & T Corp | Solder medium for circuit interconnection |
-
1989
- 1989-06-14 JP JP15304289A patent/JPH0318094A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0687137A3 (en) * | 1994-06-08 | 1996-09-11 | At & T Corp | Solder medium for circuit interconnection |
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