JPS63188938U - - Google Patents
Info
- Publication number
- JPS63188938U JPS63188938U JP8132087U JP8132087U JPS63188938U JP S63188938 U JPS63188938 U JP S63188938U JP 8132087 U JP8132087 U JP 8132087U JP 8132087 U JP8132087 U JP 8132087U JP S63188938 U JPS63188938 U JP S63188938U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- exposure apparatus
- light source
- shielding plate
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
Description
第1図、第2図は本考案による露光装置の概略
の断面図、第3図は本考案による露光装置にてレ
ジスト露光したウエハーを示す図、第4図a,b
,cは従来の露光装置にてレジスト露光したウエ
ハーを示す図である。
1…光源、2…ブラインド、3…露光用フオト
マスク、4…レンズ、5…レジスト膜、6…ウエ
ハー、7…遮蔽板、7a…開口部、8…ウエハー
ステージ。
1 and 2 are schematic cross-sectional views of the exposure apparatus according to the present invention, FIG. 3 is a diagram showing a wafer subjected to resist exposure using the exposure apparatus according to the present invention, and FIGS. 4 a and b.
, c are diagrams showing wafers subjected to resist exposure using a conventional exposure apparatus. DESCRIPTION OF SYMBOLS 1... Light source, 2... Blind, 3... Photomask for exposure, 4... Lens, 5... Resist film, 6... Wafer, 7... Shielding plate, 7a... Opening, 8... Wafer stage.
Claims (1)
ー搭載用ウエハーステージとの間に、該ウエハー
の口径よりも小さな開口部をもつ遮蔽板を設けた
ことを特徴とする半導体装置用露光装置。 1. An exposure apparatus for semiconductor devices, characterized in that a shielding plate having an opening smaller than the diameter of the wafer is provided between a light source and a wafer stage for mounting a wafer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8132087U JPS63188938U (en) | 1987-05-28 | 1987-05-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8132087U JPS63188938U (en) | 1987-05-28 | 1987-05-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63188938U true JPS63188938U (en) | 1988-12-05 |
Family
ID=30932952
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8132087U Pending JPS63188938U (en) | 1987-05-28 | 1987-05-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63188938U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02278814A (en) * | 1989-04-20 | 1990-11-15 | Fujitsu Ltd | Exposure of wafer |
JP2008258634A (en) * | 2007-04-05 | 2008-10-23 | Asml Netherlands Bv | Lithography device and method for masking substrate |
-
1987
- 1987-05-28 JP JP8132087U patent/JPS63188938U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02278814A (en) * | 1989-04-20 | 1990-11-15 | Fujitsu Ltd | Exposure of wafer |
JP2008258634A (en) * | 2007-04-05 | 2008-10-23 | Asml Netherlands Bv | Lithography device and method for masking substrate |
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