JPS63124597A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPS63124597A JPS63124597A JP27114286A JP27114286A JPS63124597A JP S63124597 A JPS63124597 A JP S63124597A JP 27114286 A JP27114286 A JP 27114286A JP 27114286 A JP27114286 A JP 27114286A JP S63124597 A JPS63124597 A JP S63124597A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed wiring
- holes
- wiring board
- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000005530 etching Methods 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 12
- 238000005553 drilling Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 4
- 238000001723 curing Methods 0.000 claims description 2
- 238000000016 photochemical curing Methods 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000009331 sowing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
「産業上の利用分野〕
本発明は印刷配線板の製造方法に関し、特にスルーホー
ルと非スルーホールの混在する印刷配線板の製造方法に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a printed wiring board, and particularly to a method for manufacturing a printed wiring board having a mixture of through holes and non-through holes.
従来、スルーホールと非スルーホールの混在する印刷配
線板を製造するには第2図(a)〜(h)の工程に従っ
て行なわれていた。まず第2図(a)に示す如く、表裏
面に銅箔2の接合された印刷配線基板(以後基板と称す
)1に孔3を穿設する。Conventionally, printed wiring boards having a mixture of through holes and non-through holes have been manufactured according to the steps shown in FIGS. 2(a) to 2(h). First, as shown in FIG. 2(a), a hole 3 is made in a printed wiring board (hereinafter referred to as a board) 1 having copper foil 2 bonded to its front and back surfaces.
次に第2図(b)の如く基板1の全面にめっきを施して
導電層4を被着し、スルーホール3aを形成する。次い
で第2図(c)の如くスルーホール3aの形成された孔
3内に感光性樹脂6を充填し、光硬化させる。次に基板
1の表面の感光性樹脂6を除去した後、第2図(d)の
如く、基板1の表面の一部にエッチングレジスト層7を
形成する。Next, as shown in FIG. 2(b), the entire surface of the substrate 1 is plated to deposit a conductive layer 4, and through holes 3a are formed. Next, as shown in FIG. 2(c), a photosensitive resin 6 is filled into the hole 3 in which the through hole 3a is formed and photocured. Next, after removing the photosensitive resin 6 on the surface of the substrate 1, an etching resist layer 7 is formed on a part of the surface of the substrate 1, as shown in FIG. 2(d).
次いで第2図(e)の如く、エッチングレジス1−層7
を工・ソチングマスクとして基板1の全面にエツチング
を行なった後、第2図(f)の如く、エツチングレジス
ト層6および感光性樹脂5を剥離除去し、所望の回路パ
ターンを形成する。次に基板1の所望の位置に第2図(
g>の如く、非スルーホール5aを穿設する。次いで第
2図(h)の如くソルダーレジスト8を印刷し、最後に
外形枠取り加工を施して、スルーホール3aと非スルー
ホール5aとが混在する印刷配線板を得ていた。Next, as shown in FIG. 2(e), etching resist 1-layer 7 is etched.
After etching is performed on the entire surface of the substrate 1 using the etching mask as a sowing mask, the etching resist layer 6 and the photosensitive resin 5 are peeled off and removed to form a desired circuit pattern, as shown in FIG. 2(f). Next, place the substrate 1 at the desired position (see Fig. 2).
g>, a non-through hole 5a is bored. Next, a solder resist 8 was printed as shown in FIG. 2(h), and finally an outline process was performed to obtain a printed wiring board in which through-holes 3a and non-through-holes 5a coexisted.
上述した従来の印刷配線板の製造方法では、次のような
欠点があった。The conventional printed wiring board manufacturing method described above has the following drawbacks.
(1)近年印刷配線板へのIC,LSI、抵抗。(1) In recent years, ICs, LSIs, and resistors have been applied to printed wiring boards.
コンデンサ等各種部品の実装に、自動実装機が適用され
、その適用比率も年々増加している。この場合スルーホ
ール3aと非スルーホール5aとの相対位置精度は±5
0μ以内と高精度が要求されている。一方スルーホール
3aと非スルーホール5aとを別穿孔によって形成した
場合、製造工程における基板1の伸縮、あるいはスルー
ホール3aと非スルーホール5aのそれぞれの穿孔時に
使用する孔明は機の相対位置のずれ等によりスルーホー
ル3aと非スルーホール5aとの相対孔位置精度が悪く
なる欠点/、I(あった、
り2)またスルーホールとなる孔3の穿孔時には孔明は
機1軸当r7り基板1を2〜3枚重ねる、いわゆる重ね
孔明けが行われている。しかし非スル−ホール5a穿孔
時に、重ね孔明けを行なうとスルーホール3aと非スル
ーホール5aとの相対値:δ精度が著しく悪化するので
重ね孔明けは行なわず、通常1軸当たり1枚で穿孔して
いる。このため作業効率が著しく悪くなり、また当て板
、バ・ツクアップ材、ドリルといった孔明は作業に付随
して用いる材料のコストも高くなり、安価な印刷配線の
製造が困難であった。Automatic mounting machines are being used to mount various parts such as capacitors, and the proportion of their use is increasing year by year. In this case, the relative position accuracy between through hole 3a and non-through hole 5a is ±5
High accuracy within 0μ is required. On the other hand, when the through hole 3a and the non-through hole 5a are formed by separate drilling, the expansion and contraction of the substrate 1 during the manufacturing process, or the holes used when drilling the through hole 3a and the non-through hole 5a, respectively, may be caused by a shift in the relative position of the machine. The disadvantage is that the relative hole position accuracy between the through hole 3a and the non-through hole 5a deteriorates due to such factors. Two or three sheets are stacked, so-called stacked drilling. However, when drilling non-through holes 5a, if overlapping holes are drilled, the relative value δ accuracy between through holes 3a and non-through holes 5a will deteriorate significantly, so overlapping holes are not performed, and normally one hole is drilled per axis. are doing. As a result, work efficiency deteriorated significantly, and the cost of materials used in connection with the drilling work, such as backing plates, back-up materials, and drills, increased, making it difficult to manufacture inexpensive printed wiring.
本発明の目的は、上述した従来の欠点を除去し、スルー
ホールと非スルーホールの両者の相対化位置精度が保証
され部品の自動実装化に対応でき、また作業効率の向上
および材料コストの低減が計れる印刷配線板の製造方法
を提供することにある。The purpose of the present invention is to eliminate the above-mentioned conventional drawbacks, ensure the relative positional accuracy of both through-holes and non-through-holes, support automatic mounting of components, and improve work efficiency and reduce material costs. An object of the present invention is to provide a method for manufacturing a printed wiring board that can be measured.
r問題点を解決するための手段〕
本発明の印刷配線板の製造方法は1両面に銅箔の接合さ
れた印刷配線基板にスルーホール用および非スルーホー
ル用の孔を同時に穿する工程と、全面めっきを施して孔
の内壁面および銅箔面に導電層を形成する工程と、上記
孔間に感光性樹脂を充填する工程と、スルーホール用孔
内の感光性樹脂を選択的に光硬化する工程と、上記感光
性樹脂の未硬化部分を化学的に除去する工程と、上記導
電層の表面の一部にエツチングレジスト層を形成し、こ
のエツチングレジスト層をエツチングマスクして上記導
電層の露出部分を選択的にエツチング除去する工程と、
上記感光性樹脂およびエツチングレジスト層を除去する
工程とを含んで構成される。Means for Solving Problems] The method for manufacturing a printed wiring board of the present invention includes the steps of simultaneously drilling holes for through-holes and non-through-holes in a printed wiring board having copper foil bonded on one side; A process of plating the entire surface to form a conductive layer on the inner wall surface of the hole and the copper foil surface, a process of filling a photosensitive resin between the holes, and a process of selectively photocuring the photosensitive resin inside the hole for the through hole. A step of chemically removing the uncured portion of the photosensitive resin, forming an etching resist layer on a part of the surface of the conductive layer, and using this etching resist layer as an etching mask to remove the uncured portion of the conductive layer. selectively etching away the exposed portion;
The method includes a step of removing the photosensitive resin and the etching resist layer.
〔実施例)
次に、本発明の実施例について図面を参照して説明する
。第1図(a)〜(d)は本発明の一実施例を説明する
ために工程順に示した印刷配線板の断面図である。[Example] Next, an example of the present invention will be described with reference to the drawings. FIGS. 1(a) to 1(d) are cross-sectional views of a printed wiring board shown in the order of steps for explaining an embodiment of the present invention.
まず、第1図(a)の如く、表丸両面に銅箔2の接合さ
れた印刷配線基板1にスルーホール用の孔3および非ス
ルーホール用の孔5をNC孔明は機により同時に穿孔す
る。次に第1図(b)の如く、印刷配線基板1に無電解
鋼めっきおよび電解銅めっきを施して、導電層4を被着
し、スルーホール3aを形成する。次いで導電層4を被
着したスルーホール3aおよび非スルーホール用の孔5
内に、第1図(C)の如く、紫外線硬化型の感光性樹脂
6を例えばロールコータ−(図示省略)を用いて充填す
る。次に第1図(d)の如く、印刷配線基板1の両面に
マスク9を介して1〜2J/、2の紫外線を照射して、
スルーホール3a内の感光性樹脂6を選択的に光硬化さ
せる。次に第1図(e)の如く、感光性樹脂6の未硬化
部分に、有機ン容剤、例えば1,1.1−1−リクロロ
エタシをスプレーして未硬化の感光性樹脂を溶解除去す
る。さらに基板1の表裏面の感光性樹脂6を研磨・除去
した後、第1図(f)の如くスクリーン印剛性、あるい
は、ドライフィルム、液体フォトレジストを使用したフ
ォト印刷法で基板1の表裏面にエツチングレジスト層7
を形成する。次いで第1図(g>の如く、エツチングレ
ジスト層7をエツチングマスクとして導電層4の露出部
分をエツチング除去して所望の回路パターンを形成する
と同時に、孔5内壁の銅めつきの導電層4をもエツチン
グ除去して非スルーホール5aを形成する。First, as shown in Fig. 1(a), the NC drilling machine simultaneously drills holes 3 for through holes and holes 5 for non-through holes in a printed wiring board 1 with copper foil 2 bonded to both sides of the round surface. . Next, as shown in FIG. 1(b), the printed wiring board 1 is subjected to electroless steel plating and electrolytic copper plating to coat the conductive layer 4 and form the through holes 3a. Next, a through hole 3a with a conductive layer 4 and a hole 5 for a non-through hole is formed.
As shown in FIG. 1(C), an ultraviolet curing type photosensitive resin 6 is filled into the inside using, for example, a roll coater (not shown). Next, as shown in FIG. 1(d), both sides of the printed wiring board 1 are irradiated with 1 to 2 J/.2 ultraviolet rays through a mask 9.
The photosensitive resin 6 in the through hole 3a is selectively photocured. Next, as shown in FIG. 1(e), an organic solvent such as 1,1.1-1-lichloroethane is sprayed onto the uncured portion of the photosensitive resin 6 to dissolve and remove the uncured photosensitive resin. . Furthermore, after polishing and removing the photosensitive resin 6 on the front and back surfaces of the substrate 1, as shown in FIG. Etching resist layer 7
form. Next, as shown in FIG. 1 (g), using the etching resist layer 7 as an etching mask, the exposed portion of the conductive layer 4 is etched away to form a desired circuit pattern, and at the same time, the copper-plated conductive layer 4 on the inner wall of the hole 5 is also removed. Non-through holes 5a are formed by etching and removing.
次いで第1図(h)の如くエツチングレジスト層7およ
び感光性樹脂6を水酸化ナトリウム水溶液で剥離除去し
た後、第1図(i)の如くソルダーレジスト8を回路パ
ターン上に印刷し、最後に所定の外形枠取り加工を施し
て、非スルーホール5aとスルーホール3aとが混在す
る印刷配線板分身た。Next, as shown in FIG. 1(h), after removing and removing the etching resist layer 7 and photosensitive resin 6 with an aqueous sodium hydroxide solution, a solder resist 8 is printed on the circuit pattern as shown in FIG. 1(i), and finally, A predetermined outer frame cutting process was performed to create a printed wiring board in which non-through holes 5a and through holes 3a coexist.
以上、説明したような本発明には次の効果がある。 The present invention as described above has the following effects.
(1)スルーホールと非スル−ボールとが同時穿孔によ
り形成できるため、両者の相対孔位置精度が保証され、
部品の自動実装化に対応した印刷配線板が製造できる。(1) Since through-holes and non-through-balls can be formed by simultaneous drilling, the relative positional accuracy of both holes is guaranteed.
Printed wiring boards compatible with automatic component mounting can be manufactured.
(2)作業効率の向上および材料コストの低減が計れ、
安価な印刷配線板の製造ができる。(2) Improve work efficiency and reduce material costs,
It is possible to manufacture inexpensive printed wiring boards.
第1図(a)〜(i)は本発明の一実施例を説明するた
めに工程順に示した印刷配線板の断面図、第2図は(a
)〜(h)は従来の印刷配線板の製造方法を説明するな
めに工程順に示した印刷配線板の断面図である。
1・・・印刷配線板、2・・・銅箔、3・・・(スルー
ホール用の)孔、3a・・・スルーホール、4・・・導
電層、5・・・(非スルーホール用の〉孔、5a・・・
非スルーホール、6・・・感光性樹脂、7・・・エツチ
ングレジスト層、8・・・ソルダーレジスト、9・・・
マスク。
fi−イ 1ff1
1f51 図1(a) to 1(i) are cross-sectional views of a printed wiring board shown in the order of steps for explaining one embodiment of the present invention, and FIG.
) to (h) are cross-sectional views of a printed wiring board shown in order of process for explaining a conventional method of manufacturing a printed wiring board. DESCRIPTION OF SYMBOLS 1... Printed wiring board, 2... Copper foil, 3... Hole (for through hole), 3a... Through hole, 4... Conductive layer, 5... (For non-through hole) > hole, 5a...
Non-through hole, 6... Photosensitive resin, 7... Etching resist layer, 8... Solder resist, 9...
mask. fi-i 1ff1 1f51 diagram
Claims (1)
用および非スルーホール用の孔を同時に穿設する工程と
、前記印刷配線基板の全面にめっきを施して孔の内壁面
および銅箔面に導電層を形成する工程と、前記孔内に感
光性樹脂を充填する工程と、スルーホール用孔内の前記
感光性樹脂を選択的に光硬化する工程と、前記感光性樹
脂の未硬化部分を化学的に除去する工程と、前記導電層
の表面の一部にエッチングレジスト層を形成し、該エッ
チングレジスト層をエッチングマスクとして前記導電層
の露出部分を選択的にエッチング除去する工程と、前記
感光性樹脂およびエッチングレジスト層を除去する工程
とを含むことを特徴とする印刷配線板の製造方法。A process of simultaneously drilling holes for through holes and non-through holes in a printed wiring board with copper foil bonded on both sides, and plating the entire surface of the printed wiring board to coat the inner wall surface of the hole and the copper foil surface. a step of forming a conductive layer, a step of filling the hole with a photosensitive resin, a step of selectively photocuring the photosensitive resin in the hole for the through hole, and a step of curing the uncured portion of the photosensitive resin. a step of chemically removing the conductive layer; a step of forming an etching resist layer on a part of the surface of the conductive layer and selectively etching away the exposed portion of the conductive layer using the etching resist layer as an etching mask; 1. A method for producing a printed wiring board, the method comprising: removing a synthetic resin and an etching resist layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27114286A JPS63124597A (en) | 1986-11-14 | 1986-11-14 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27114286A JPS63124597A (en) | 1986-11-14 | 1986-11-14 | Manufacture of printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63124597A true JPS63124597A (en) | 1988-05-28 |
Family
ID=17495905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27114286A Pending JPS63124597A (en) | 1986-11-14 | 1986-11-14 | Manufacture of printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63124597A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6427325B1 (en) | 1998-09-01 | 2002-08-06 | International Business Machines Corporation | Flowable compositions and use in filling vias and plated through-holes |
JP2007176077A (en) * | 2005-12-28 | 2007-07-12 | Fujifilm Corp | Process for producing wiring board, liquid ejection head and image forming apparatus |
-
1986
- 1986-11-14 JP JP27114286A patent/JPS63124597A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6427325B1 (en) | 1998-09-01 | 2002-08-06 | International Business Machines Corporation | Flowable compositions and use in filling vias and plated through-holes |
US6794040B2 (en) | 1998-09-01 | 2004-09-21 | International Business Machines Corporation | Flowable compositions and use in filling vias and plated through-holes |
JP2007176077A (en) * | 2005-12-28 | 2007-07-12 | Fujifilm Corp | Process for producing wiring board, liquid ejection head and image forming apparatus |
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