JPH1013017A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH1013017A JPH1013017A JP18671796A JP18671796A JPH1013017A JP H1013017 A JPH1013017 A JP H1013017A JP 18671796 A JP18671796 A JP 18671796A JP 18671796 A JP18671796 A JP 18671796A JP H1013017 A JPH1013017 A JP H1013017A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- resin
- hole
- conductive connection
- clad laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は感光性樹脂組成物を
採用した非導通接続穴を有し、配線密度を高密度化でき
るプリント配線板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a printed wiring board having a non-conductive connection hole employing a photosensitive resin composition and capable of increasing the wiring density.
【０００２】[0002]
【従来の技術】近年、電子機器の高性能化と経済性向上
のためにプリント配線板の高密度化が進展している。以
下、図３（ａ）〜（ｄ）、図４（ｅ）〜（ｈ）基づき、
従来の穴埋インク（フィラー入り有機酸変性樹脂）１７
とドライフィルム１８を用いたプリント配線板の製造工
程順に示した図面に基づいて説明する。2. Description of the Related Art In recent years, the density of printed wiring boards has been increasing in order to improve the performance and economy of electronic equipment. Hereinafter, based on FIGS. 3A to 3D and FIGS. 4E to 4H,
Conventional hole-filled ink (organic acid-modified resin with filler) 17
The description will be made with reference to the drawings shown in the order of the manufacturing process of the printed wiring board using the dry film 18.
【０００３】先ず、表裏面に銅箔１１が形成されたガラ
スエポキシ樹脂銅張り積層板１３を用い（ａ図）、この
銅張り積層板１３に選択的に貫通穴１４を穿設する（ｂ
図）。次に、電気銅めっき１５により、前記の貫通穴１
４の穴内壁１４Ａと銅張り積層板１３の表裏層全面に電
気銅めっき１５を施し表裏を電気的に導通１６させる
（ｃ図）。次に、高密度仕様対応のために、前記の導通
接続穴１６の穴内が苛性ソーダ（ＮａｏＨ）水溶液で剥
離できる穴埋インク（フィラー入り有機酸変性樹脂）１
７充填・形成し（ｄ図）、熱風乾燥する。次に、市販の
厚み約４０〜５０μｍのドライフィルム１８をラミネー
トする（ｅ図）。更に、前記のドライフィルム１８をラ
ミネートした銅張り積層板１３Ａを露光・現像する（ｆ
図）。次いでエッチング・剥離を行い導体回路１９、導
通接続穴１６を形成するが導通接続穴１６の穴内に導体
１５Ａが残る（ｇ図）。最後に、前記の穴内導体１５Ａ
を自動ＮＣ穴明機を用い２次穴加工を行い、所望の非導
通接続孔２０を有している穴埋フォトテンティング法プ
リント配線板２１ができる（ｈ図）。First, a glass epoxy resin copper-clad laminate 13 having copper foils 11 formed on the front and back surfaces is used (FIG. 1A), and through holes 14 are selectively formed in the copper-clad laminate 13 (b).
Figure). Next, the above-described through-hole 1 is formed by electrolytic copper plating 15.
Electroplated copper 15 is applied to the entire inner surface 14A of the hole 4 and the entire surface of the front and back layers of the copper-clad laminate 13 to make the front and back electrically conductive 16 (FIG. 3C). Next, in order to comply with high-density specifications, a filling ink (organic acid-modified resin containing filler) 1 in which the inside of the conductive connection hole 16 can be peeled off with an aqueous solution of caustic soda (NaoH) 1
7 Fill and form (Fig. D) and dry with hot air. Next, a commercially available dry film 18 having a thickness of about 40 to 50 μm is laminated (FIG. 5E). Further, the copper clad laminate 13A on which the dry film 18 is laminated is exposed and developed (f).
Figure). Then, etching and peeling are performed to form the conductor circuit 19 and the conductive connection hole 16, but the conductor 15A remains in the hole of the conductive connection hole 16 (g diagram). Finally, the above-mentioned conductor 15A in the hole is used.
Is subjected to secondary drilling using an automatic NC drilling machine, and a printed wiring board 21 with a desired non-conduction connection hole 20 is obtained by a hole-filled photo-tenting method (FIG. H).
【０００４】[0004]
【発明が解決しようとする課題】従来のプリント配線板
の製法では、以下のような問題を有していた。先ず、従
来の技術図３、図４の穴埋フォトテンティング製法は、
高密度化にともない、導通接続穴１６と導体回路１９の
クリアランスが小さくなり（ランドレス化）、ランド幅
１５Ａ １００μｍ以下になると感光層レジスト１８Ａ
と導体１５Ａの密着１８Ｃが不足になる（ｆ図）。The conventional method for manufacturing a printed wiring board has the following problems. First, the conventional technology of making a hole-filled photo-tenting shown in FIGS.
With the increase in density, the clearance between the conductive connection hole 16 and the conductor circuit 19 becomes smaller (landless), and when the land width becomes 15 A and 100 μm or less, the photosensitive layer resist 18A
The contact 18C between the conductor and the conductor 15A becomes insufficient (f figure).
【０００５】また、露光後の保護フィルム１８Ｂの剥離
力と現像・エッチング液の吹付けによる衝撃に対して耐
えることができないために、感光層レジスト１８Ａが剥
離してエッチング液が導通接続穴１６の穴内にしみ込む
図６、その導通接続穴１６の穴内壁めっき１６Ａが溶解
１６Ｃされ断線図７になってしまう問題がある（ｆ
図）。Further, since the protective film 18B cannot withstand the peeling force of the exposed protective film 18B and the impact of the developing / etching liquid spray, the photosensitive layer resist 18A is peeled off and the etching liquid flows through the conductive connection hole 16. 6, there is a problem that the plating 16A on the inner wall of the conductive connection hole 16 is melted 16C, resulting in a disconnection diagram 7 (f).
Figure).
【０００６】前記の導通接続穴１６の電気的な接続信頼
性を良好にするために、導通接続穴１６の穴内に穴埋イ
ンク１７（フィラー入り有機酸変性樹脂）をロールコー
ターにより、前記銅張り積層板１３Ａの表裏両全面にも
塗布し、穴埋インク１７を熱風乾燥する際に導通接続穴
１６の穴コーナー部１６Ｂが薄く被覆され欠落１７Ａす
る図５のためエッチング液に耐えられないことにより、
配線密度の高密度変化への対応が困難という問題点を持
っていた（ｇ図）。In order to improve the electrical connection reliability of the conductive connection hole 16, a filling ink 17 (organic acid-modified resin containing filler) is filled in the conductive connection hole 16 by a roll coater. When the ink is applied to both the front and back surfaces of the laminate 13A and the hole filling ink 17 is dried with hot air, the hole corner portion 16B of the conductive connection hole 16 is thinly coated and missing 17A. ,
There was a problem that it was difficult to cope with a high-density change in the wiring density (g diagram).
【０００７】また、前記のプリント配線板の製法では、
エッチング工程後に、導通接続穴１６の穴内に穴埋イン
ク１７を苛性ソーダ（ＮａｏＨ）水溶液により剥離する
ために、めっきのない穴である非導通接続穴２０を形成
することができない課題がある（ｇ図）。In the above-mentioned method for manufacturing a printed wiring board,
After the etching step, the hole-filling ink 17 is peeled off in the hole of the conductive connection hole 16 with an aqueous solution of caustic soda (NaoH), so that there is a problem that the non-conductive connection hole 20 having no plating cannot be formed (FIG. ).
【０００８】更に、上記の非導通接続穴２０を得るため
に、２次穴加工を行っているが上記の穴２０位置精度及
び作業効率が悪いため、問題になっている（ｈ図）。Further, in order to obtain the above-mentioned non-conductive connection hole 20, secondary hole processing is performed, but this is problematic because the position accuracy and work efficiency of the hole 20 are poor (FIG. H).
【０００９】そこで、新たに選択的に穴埋を行う製法例
もあるが、治工具及び作業効率が悪いため、コストアッ
プとなっている。Therefore, there is an example of a manufacturing method in which the hole is newly selectively filled, but the cost is increased due to poor jigs and tools and work efficiency.
【００１０】[0010]
【課題を解決するための手段】本発明の目的はこのよう
な従来の欠点を解決した製造方法を提供することにあ
る。従来の穴埋フォトテンティング製法は導通接続穴１
６の穴コーナー部１６Ｂの電気接続の信頼性に課題あ
り、また、エッチング工程後に剥離されているため非導
通接続穴２０が形成できないために、自動穴明機を用い
２次穴加工が必須になっている。SUMMARY OF THE INVENTION It is an object of the present invention to provide a manufacturing method which solves such conventional disadvantages. The conventional hole-filled photo-tenting method uses a conductive connection hole 1
There is a problem in the reliability of the electrical connection of the hole corner portion 16B of No. 6, and since the non-conductive connection hole 20 cannot be formed because it has been peeled off after the etching step, the secondary drilling using an automatic drilling machine is indispensable. Has become.
【００１１】しかし、本発明は前記の課題を解決するた
めに、感光性樹脂組成物７を用いることにより、以下の
ように課題を解決できる。本発明は、先ず、貫通穴４の
穴内壁１４Ａ及び表裏の銅箔１両面が電気銅めっき５に
よりなる銅張り積層板３Ａに感光性樹脂組成物７を用い
て、表裏両全面にロールコーターを用い規定塗膜７Ａを
塗布し、併わせて前記の導通接続穴６の穴内壁６Ａにも
充填し、更に、これを乾燥し、感光性樹脂組成物７層上
に回路形成ネガマスクを用いＵＶ露光を行ない、露光部
と未露光部とに焼付する。However, the present invention can solve the above problem by using the photosensitive resin composition 7 as follows. The present invention first uses a photosensitive resin composition 7 on a hole inner wall 14A of the through hole 4 and a copper-clad laminate 3A in which both surfaces of the copper foil 1 on both surfaces are formed by electro-copper plating 5, and applies a roll coater on both surfaces. A prescribed coating film 7A is applied, and is also filled in the inner wall 6A of the conductive connection hole 6 as described above, and further dried, and is exposed on the photosensitive resin composition 7 layer using a circuit-forming negative mask by UV exposure. And printing on exposed and unexposed areas.
【００１２】次いで、現像工程において、露光された感
光性樹脂組成物７は導通接続穴６の穴内壁６Ａを保護
し、未露光部となった感光性組成物７は除去される。Next, in the developing step, the exposed photosensitive resin composition 7 protects the inner wall 6A of the conductive connection hole 6, and the unexposed portion of the photosensitive composition 7 is removed.
【００１３】最後に、エッチング・剥離工程により、非
導通接続穴１０と配線密度の高密度化ができるプリント
配線板９ができることを特徴とする。Finally, a feature is that the printed wiring board 9 capable of increasing the wiring density with the non-conductive connection holes 10 is formed by the etching / peeling step.
【００１４】従って、本発明の製法は感光性樹脂組成物
７を用いて、非導通接続穴１０を有する高密度回路が形
成できるプリント配線板９を提供するものである。Accordingly, the manufacturing method of the present invention is to provide a printed wiring board 9 which can form a high-density circuit having a non-conductive connection hole 10 by using the photosensitive resin composition 7.
【００１５】[0015]
【発明の実施の形態】本発明の実施例を示す図面に基づ
いて詳細に説明する。図１（ａ）〜（ｆ）は本発明によ
るプリント配線板の実施例を製造工程順に示す断面図で
ある。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described in detail with reference to the drawings. 1A to 1F are sectional views showing an embodiment of a printed wiring board according to the present invention in the order of manufacturing steps.
【００１６】まず、図１（ａ）に示すように表裏両面に
銅箔１を形成している厚さ約１．０mmは例えば、ガラス
基材にエポキシ樹脂を含浸して積層接着した銅箔からな
る銅張り積層板３である。このような銅張り積層板３と
しては、フェノール樹脂、エポキシ樹脂、アリルフタレ
ート樹脂、ポリイシド樹脂、メラミン樹脂、エポキシ変
成ポリイミド樹脂、不飽和ポリエステル樹脂等の熱硬化
性樹脂を、ガラス繊維、パルプ、リンター、ナイロン、
ポリエステルなどの有機天然または合成繊維等の絶縁基
板２に含浸させ、加熱加圧した合成樹脂積層板が表裏両
銅箔１からなる銅張り積層板３など挙げられ、本発明は
そのいずれに限定されるものではない。First, as shown in FIG. 1 (a), a copper foil 1 having a thickness of about 1.0 mm in which copper foil 1 is formed on both front and back surfaces is made of, for example, a copper foil obtained by impregnating a glass base material with an epoxy resin and laminating and bonding. Copper-clad laminate 3. As such a copper-clad laminate 3, a thermosetting resin such as a phenol resin, an epoxy resin, an allyl phthalate resin, a polyside resin, a melamine resin, an epoxy-modified polyimide resin, and an unsaturated polyester resin is used. ,Nylon,
A synthetic resin laminate impregnated in an insulating substrate 2 such as an organic natural or synthetic fiber such as polyester and heated and pressed is exemplified by a copper-clad laminate 3 composed of both front and back copper foils 1, and the present invention is not limited to any of these. Not something.
【００１７】次に、図１（ｂ）に示すように選択的に例
えばφ０．１mmマイクロドリルを使い貫通穴４を穿設
（自動数値制御４軸穴明機・ＮＤ−４Ｋ１８／ＡＢＣ１
０Ｐ．）する。前記の銅張り積層板３に貫通穴４をあけ
る方法は、レーザー光、ドリル、プラズマ、溶融法、プ
レスなど公知の方法を、銅張り積層板３の種類と目的と
する穴径に応じて適用できる。Next, as shown in FIG. 1 (b), a through hole 4 is selectively drilled using, for example, a φ0.1 mm micro drill (automatic numerical control 4-axis drilling machine / ND-4K18 / ABC1).
0P. ). A known method such as laser light, drilling, plasma, melting, and pressing is applied to the copper-clad laminate 3 according to the type of the copper-clad laminate 3 and the target hole diameter. it can.
【００１８】次に、図１（ｃ）に示すように貫通穴４の
穴内壁４Ａ及び表裏両面層に均一な膜厚２０〜２５μｍ
電気銅めっき５を形成する。このようなめっき方法は、
化学めっき法、無電解めっき法、化学めっきと電気銅め
っきの併用法など公知のめっき法が挙げられ、本発明は
そのいずれに限定されるものではない。Next, as shown in FIG. 1 (c), a uniform film thickness of 20 to 25 μm is formed on the inner wall 4A of the through hole 4 and on both the front and back surfaces.
An electrolytic copper plating 5 is formed. Such plating method,
Known plating methods such as a chemical plating method, an electroless plating method, and a combined method of chemical plating and electrolytic copper plating are exemplified, and the present invention is not limited to any of them.
【００１９】次に、図１（ｄ）に示すように感光性樹脂
組成物７（希アルカリ現像タイプ液状フォトエッチング
レジスト）を例えばロールコーターにより導通接続穴６
の穴内壁６Ａ及び銅張り積層板３Ａ上全面にも１０〜１
５μｍ膜厚７Ａを形成し、約８０℃、１０〜１５分の予
備乾燥する。このような塗布方法としては、ローラーコ
ート法、ディップコート法、スプレーコート法、スピナ
ーコート法、カーテンコータ法、スクリーン印刷法など
公知の塗布法が挙げられその目的に応じて上記のいずれ
を適用することができる。Next, as shown in FIG. 1 (d), a photosensitive resin composition 7 (dilute alkali developing type liquid photo-etching resist) is applied to the conductive connection holes 6 by a roll coater, for example.
The hole inner wall 6A and the entire surface on the copper-clad laminate 3A are also 10-1.
A 5 .mu.m thick film 7A is formed and pre-dried at about 80.degree. C. for 10 to 15 minutes. Examples of such a coating method include known coating methods such as a roller coating method, a dip coating method, a spray coating method, a spinner coating method, a curtain coater method, and a screen printing method, and any of the above methods is applied depending on the purpose. be able to.
【００２０】また、感光性樹脂組成物７の主な成分は、
無機フィラー（タルク）、変性エポキシ樹脂、芳香族炭
化水素、カルビトールアセテナ、アクリル酸エステル、
芳香族カルボニル化合物、フタロシアニンブルー等によ
りなる。The main components of the photosensitive resin composition 7 are as follows:
Inorganic filler (talc), modified epoxy resin, aromatic hydrocarbon, carbitol acetate, acrylate,
It is made of an aromatic carbonyl compound, phthalocyanine blue or the like.
【００２１】更に、図１（ｅ）に示すように上記の塗膜
７Ａ上に回路形成ネガマスクを用い、ＵＶ露光を行い露
光部と未露光部とする。Further, as shown in FIG. 1 (e), UV exposure is performed on the coating film 7A using a circuit-forming negative mask to make an exposed portion and an unexposed portion.
【００２２】次いで現像で、例えば、露光された感光性
樹脂組成物７は導通接続穴６の穴コーナー部６Ｂを保護
し、未露光部となった感光性樹脂組成物７の塗膜７Ａと
充填７は無水炭酸ソーダ（１wt％−Ｎａ2Ｃｏ3）水溶液
で除去される。このような現像方法としては、アルカリ
現像（現像液、１．０wt％、Ｎａ2Ｃｏ3水溶液、液温３
０℃以下、スプレー圧０．５〜１．０kg／cm2、現像時
間２０〜４０秒）タイプと溶剤（１，１，１トリクロロ
エタン）タイプなど公知の現像法等が挙げられるが、本
発明ではアルカリ現像タイプが良好である。Next, in the development, for example, the exposed photosensitive resin composition 7 protects the hole corner 6B of the conductive connection hole 6 and fills with the coating 7A of the unexposed photosensitive resin composition 7. 7 is removed with an anhydrous sodium carbonate (1 wt% -Na 2 Co 3 ) aqueous solution. As such a developing method, an alkali developing (developing solution, 1.0 wt%, Na 2 Co 3 aqueous solution, liquid temperature 3
Known development methods such as 0 ° C. or lower, a spray pressure of 0.5 to 1.0 kg / cm 2 , and a development time of 20 to 40 seconds) and a solvent (1,1,1 trichloroethane) type are known. Alkaline development type is good.
【００２３】最後に、図１（ｆ）に示すようにエッチン
グ（塩化第２鉄液、塩化第２銅液）、剥離（苛性ソーダ
水溶液）工程で非導通接続穴１０が形成でき、配線密度
の高いランドレス化、高密度プリント配線板９の製造方
法が得られる。Finally, as shown in FIG. 1 (f), the non-conductive connection hole 10 can be formed in the etching (ferric chloride solution, cupric chloride solution) and stripping (caustic soda aqueous solution) process, and the wiring density is high. A method for producing a landless, high-density printed wiring board 9 is obtained.
【００２４】[0024]
【発明の効果】以上説明したように、本発明によれば、
感光性樹脂組成物を用い、非導通接続穴または導通接続
穴の穴コーナー部の必須膜厚を保護でき、高密度化が形
成可能な製法のため、以下に記載するような特有な効果
を奏する。As described above, according to the present invention,
The photosensitive resin composition can be used to protect the essential film thickness at the corners of the non-conductive connection holes or the conductive connection holes, and for a production method capable of forming a high density, the following specific effects are exhibited. .
【００２５】（１）本発明によれば、本発明の感光性樹
脂組成物は従来の穴埋フォトテンティング法における導
通接続穴上のドライフィルムの密着不足及び導通接続穴
の穴コーナ部へのエッチング液のしみ込み防止で断線を
なくしたことにより、導通接続穴の穴コーナー部は電気
的に高い接続信頼性が得られ導通断線を防止できた。(1) According to the present invention, the photosensitive resin composition of the present invention is insufficiently adhered to a dry film on a conductive connection hole in a conventional hole-filling photo-tenting method, and the conductive resin composition adheres to a hole corner of the conductive connection hole. Since the disconnection was eliminated by preventing the penetration of the etching solution, the hole corner portion of the conductive connection hole was electrically high in connection reliability and the conductive disconnection could be prevented.
【００２６】（２）本発明によれば、従来は回路幅は
０．１mm、間隔は０．１mmであったが、本発明の結果と
して、回路幅は０．０５mm、間隔は０．０５mmと向上
し、ランドレス化が可能となり、産業上寄与する効果は
極めて大きい。(2) According to the present invention, the circuit width is conventionally 0.1 mm and the interval is 0.1 mm, but as a result of the present invention, the circuit width is 0.05 mm and the interval is 0.05 mm. Thus, it is possible to improve the quality of the image, and the effect of contributing to the industry is extremely large.
【００２７】（３）本発明によれば、感光性樹脂組成物
を用いた希アルカリ性現像フォトエッチングレジストの
ため製造工程２５％短縮及びコスト低減が可能となり、
また、本発明の製法で容易に非導通接続穴の形成が可能
となった。(3) According to the present invention, the manufacturing process can be shortened by 25% and the cost can be reduced because of a dilute alkaline developed photoetching resist using a photosensitive resin composition.
Further, the non-conductive connection hole can be easily formed by the manufacturing method of the present invention.
【図１】（ａ）〜（ｆ）は本発明の製造方法を説明する
断面図。FIGS. 1A to 1F are cross-sectional views illustrating a manufacturing method of the present invention.
【図２】図１（ｄ）は本発明の感光性樹脂組成物の塗
布、充填要部の断面図。FIG. 1 (d) is a cross-sectional view of a main part of application and filling of the photosensitive resin composition of the present invention.
【図３】（ａ）〜（ｄ）は従来の穴埋フォトテンティン
グ法の断面図。3 (a) to 3 (d) are cross-sectional views of a conventional buried photo-tenting method.
【図４】（ｅ）〜（ｈ）は従来の穴埋フォトテンティン
グ法の断面図。4 (e) to 4 (h) are cross-sectional views of a conventional hole filling photo-tenting method.
【図５】図３（ｄ）は従来製法の穴埋インク被覆欠落部
の要部断面図。FIG. 3D is a cross-sectional view of a main part of a hole-filled ink coating missing portion according to a conventional manufacturing method.
【図６】図４（ｆ）は従来製法の感光層レジスト密着不
充分部の要部断面図。FIG. 4F is a cross-sectional view of a main part of a photosensitive layer resist inadequately adhered portion in a conventional manufacturing method.
【図７】従来の製法でエッチング液しみ込み断線の要部
断面図。FIG. 7 is a cross-sectional view of a main part of a disconnection in which an etchant is absorbed by a conventional manufacturing method.
１…銅箔 ２…絶縁基板 ３…銅張り積層板 ３Ａ…め
っき付銅張り積層板 ４…貫通穴 ４Ａ…穴内壁 ５…電気銅めっき ５Ａ…
導体 ６…導通接続穴 ６Ａ…穴内壁 ６Ｂ…穴コーナー部 ７…感光性樹脂組
成物 ７Ａ…塗膜 ８…導体回路 ９…本発明のプリント配線板 １０…非
導通接続穴 １１…銅箔 １２…絶縁基板 １３…銅張り積層板 １３Ａ…めっき付銅張り積層板 １４…貫通穴 １４Ａ
…穴内壁 １５…電気銅めっき １５Ａ…導体 １６…導通接続穴
１６Ａ…穴内壁 １６Ｂ…穴コーナー部 １６Ｃ…溶解した穴壁 １７…
穴埋インク １７Ａ…インク被覆欠落部 １８…ドライフィルム １
８Ａ…感光性レジスト １８Ｂ…保護フィルム １８Ｃ…密着不充分部 １９…
導体回路 ２１…従来のプリント配線板DESCRIPTION OF SYMBOLS 1 ... Copper foil 2 ... Insulating board 3 ... Copper-clad laminate 3A ... Plated copper-clad laminate 4 ... Through-hole 4A ... Hole inner wall 5 ... Electrocopper plating 5A ...
Conductor 6 Conductive connection hole 6A Hole inner wall 6B Hole corner 7 Photosensitive resin composition 7A Coating film 8 Conductor circuit 9 Printed wiring board of the present invention 10 Non-conductive connection hole 11 Copper foil 12 Insulating substrate 13: copper-clad laminate 13A: plated copper-clad laminate 14: through-hole 14A
... inner wall of hole 15 ... copper plating 15A ... conductor 16 ... conductive connection hole 16A ... inner wall of hole 16B ... hole corner 16C ... melted hole wall 17 ...
Filled ink 17A: Ink coating missing part 18: Dry film 1
8A: photosensitive resist 18B: protective film 18C: poor adhesion area 19:
Conductor circuit 21: Conventional printed wiring board
Claims (2)
なる銅張り積層板を用い、この銅張り積層板に選択的に
貫通穴を穿設する。前記の貫通穴の穴内壁及び表裏両全
面に電気銅めっきで被覆した銅張り積層板に、感光性樹
脂組成物を用い、前記銅張り積層板の表裏両全面に規定
膜厚を塗布し、併わせて、前記の導通接続穴の穴内にも
充填・形成し、露光・現像及びエッチング・剥離により
配線密度を高密度化できることを特徴とするプリント配
線板の製造方法。1. A copper-clad laminate made by laminating copper foil on both sides of an insulating substrate, and through holes are selectively formed in the copper-clad laminate. On a copper-clad laminate coated with electrolytic copper plating on the entire inner wall and both front and back surfaces of the through-hole, a photosensitive resin composition is used, and a specified thickness is applied to both front and back surfaces of the copper-clad laminate, In addition, a method for manufacturing a printed wiring board, characterized in that a wiring density can be increased by filling and forming the inside of the conductive connection hole and exposing, developing, etching and peeling.
希アルカリ現像タイプ、液状フォトエッチングレジスト
であることを特徴とするプリント配線板の製造方法。2. The method according to claim 1, wherein the photosensitive resin composition is a dilute alkali developing type liquid photo-etching resist.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18671796A JPH1013017A (en) | 1996-06-27 | 1996-06-27 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18671796A JPH1013017A (en) | 1996-06-27 | 1996-06-27 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1013017A true JPH1013017A (en) | 1998-01-16 |
Family
ID=16193412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18671796A Pending JPH1013017A (en) | 1996-06-27 | 1996-06-27 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1013017A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011014636A (en) * | 2009-06-30 | 2011-01-20 | Goo Chemical Co Ltd | Method for manufacturing printed wiring board with through-hole |
| JP2013197418A (en) * | 2012-03-21 | 2013-09-30 | Shinko Seisakusho:Kk | Wiring board suitable to sealing component, chip component, and method of manufacturing the same |
| US9233263B2 (en) | 2004-04-01 | 2016-01-12 | Industrial Farmaceutica Cantabria, S.A. | Photoprotector and/or photoimmunoprotector compositions of the skin and their uses |
| CN111182733A (en) * | 2020-01-16 | 2020-05-19 | 深圳市志金电子有限公司 | Circuit board manufacturing process with side wall circuit and circuit board manufacturing process |
-
1996
- 1996-06-27 JP JP18671796A patent/JPH1013017A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9233263B2 (en) | 2004-04-01 | 2016-01-12 | Industrial Farmaceutica Cantabria, S.A. | Photoprotector and/or photoimmunoprotector compositions of the skin and their uses |
| JP2011014636A (en) * | 2009-06-30 | 2011-01-20 | Goo Chemical Co Ltd | Method for manufacturing printed wiring board with through-hole |
| JP2013197418A (en) * | 2012-03-21 | 2013-09-30 | Shinko Seisakusho:Kk | Wiring board suitable to sealing component, chip component, and method of manufacturing the same |
| CN111182733A (en) * | 2020-01-16 | 2020-05-19 | 深圳市志金电子有限公司 | Circuit board manufacturing process with side wall circuit and circuit board manufacturing process |
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