JPS6255991A - Flexible printed circuit board with shield - Google Patents
Flexible printed circuit board with shieldInfo
- Publication number
- JPS6255991A JPS6255991A JP19713785A JP19713785A JPS6255991A JP S6255991 A JPS6255991 A JP S6255991A JP 19713785 A JP19713785 A JP 19713785A JP 19713785 A JP19713785 A JP 19713785A JP S6255991 A JPS6255991 A JP S6255991A
- Authority
- JP
- Japan
- Prior art keywords
- shield
- porous
- circuit board
- layer
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明はシールド付可撓性プリント回路基板に係わる。[Detailed description of the invention] [Industrial application field] The present invention relates to a shielded flexible printed circuit board.
［在来技術と問題点コ
可視性プリント回路基板（以下ＦＰＣという）として、
ポリエステル、ポリイミドフィルムに接着剤を塗布して
銅箔と貼合せ、その後鋼箔をエツチングして回路形成し
たものが用いられるが、耐熱、難燃、半田付性が要求さ
れる基板としては、はとんどポリイミドフィルムをベー
スにしたもので、一部弗素系樹脂、例えばＦＥＰ、 Ｐ
ＦＡ、 ＥＴＦＥ等を押出しコーティングした基板が使
用されている。[Conventional technology and problems] As a visible printed circuit board (hereinafter referred to as FPC),
Polyester or polyimide films are coated with adhesive and laminated with copper foil, and then steel foil is etched to form circuits. However, for substrates that require heat resistance, flame retardancy, and solderability, It is mostly based on polyimide film, and some fluorine resins such as FEP, P
Substrates coated with extrusion of FA, ETFE, etc. are used.
ところで、回路がＩＭＨｚ以上の高周波回路として使用
されるものは、ＦＰＣにシールド層を必要とするが、ポ
リイミドフィルムでは絶縁層の誘電率が３．５と高いた
め、優れたシールド効果が得られなかった。By the way, circuits used as high frequency circuits of IMHz or higher require a shielding layer on the FPC, but with polyimide film, the dielectric constant of the insulating layer is as high as 3.5, so excellent shielding effects cannot be obtained. Ta.
このため、一部１０ＧＨ２以上の高周波域では、硬質の
四弗化エチレン樹脂基板が使用され、金属板でシールド
する方式がとられていた。For this reason, in some high frequency ranges of 10 GH2 or higher, hard tetrafluoroethylene resin substrates have been used and shielded with metal plates.
静電シールド、電磁シールド効果を出すには、絶縁層の
容量を小さくする必要がある。ポリイミドフィルムや四
弗化樹脂フィルムでは層を厚くすると可撓性がなくなり
、又高価である。特に四弗化樹脂の場合、同樹脂と銅箔
やシールド層との接若が困難で、表面処理に多大な労力
とコストを要している。In order to produce electrostatic shielding and electromagnetic shielding effects, it is necessary to reduce the capacitance of the insulating layer. When a polyimide film or a tetrafluoride resin film is made thicker, it loses flexibility and is also expensive. Particularly in the case of tetrafluoride resin, it is difficult to attach the resin to copper foil or a shield layer, and surface treatment requires a great deal of effort and cost.
［発明の目的コ
本発明は耐熱、難燃、半田耐熱性があり、可撓性を保持
し、加工性に優れ、且つ高周波に対して十分シールド効
果を維持できるシールド付可撓性プリント回路基板を提
供することを目的とするものである。[Purpose of the Invention] The present invention provides a flexible printed circuit board with a shield that is heat resistant, flame retardant, resistant to soldering heat, maintains flexibility, has excellent workability, and can maintain a sufficient shielding effect against high frequencies. The purpose is to provide the following.
［発明の構成コ
本発明は、四弗化エチレン樹脂を１００〜５００％延伸
し、延伸によるフィルム中の気孔率を３０〜８０％とし
た多孔質四弗化エチレン樹脂フィルムの片面に、金属層
を物理蒸着し、エツチング、銅電気メッキ等で電気回路
を形成するか、金属層を蒸着もせすそのままとし、他の
片面にシールド層として金属層を物理蒸着し、すくなく
とも一方の片面に電気回路を形成した２枚の前記多孔質
四弗化エチレン樹脂フィルムのシールド層を表にして、
前記２枚の多孔質四弗化エチレン樹脂フィルムを接合し
たシールド付可撓性プリント回路基板にある。[Structure of the Invention] The present invention provides a metal layer on one side of a porous tetrafluoroethylene resin film which is made by stretching a tetrafluoroethylene resin by 100 to 500% and increasing the porosity of the film by stretching to 30 to 80%. Form an electric circuit by physical vapor deposition, etching, copper electroplating, etc., or leave a metal layer as is to be vapor deposited, physically vapor deposit a metal layer as a shield layer on the other side, and form an electric circuit on at least one side. With the shield layer of the two formed porous tetrafluoroethylene resin films facing up,
The present invention provides a shielded flexible printed circuit board in which the two porous tetrafluoroethylene resin films are bonded together.
なお、気孔率が３０％以下であると誘電率は低下せず、
又接着力も低い。８０％以上になると表面における金属
層の物理蒸着に均一性を得ることができず、又機械的強
度が低く実用に耐えない。Note that when the porosity is 30% or less, the dielectric constant does not decrease;
It also has low adhesive strength. If it exceeds 80%, it will not be possible to achieve uniformity in the physical vapor deposition of the metal layer on the surface, and the mechanical strength will be so low that it will not be practical.
上述のように、四弗化エチレン樹脂を延伸し、表面にも
微小孔を有する多孔質四弗化エチレン樹脂フィルムは、
表面微小孔による凹凸面に、銅その他の金属を物理蒸着
により均一に被覆することができ、蒸着した金属は微小
孔より多孔質内部に入り込み、機械的に強固に接合する
。As mentioned above, the porous tetrafluoroethylene resin film, which is made by stretching the tetrafluoroethylene resin and has micropores on the surface, is
Copper and other metals can be uniformly coated on the uneven surface due to the surface micropores by physical vapor deposition, and the vapor-deposited metal penetrates into the porous interior through the micropores to form a strong mechanical bond.
第２図に多孔質四弗化エチレンフィルムに金属を蒸着し
たものを拡大して示す。すでに知られているように、四
弗化エチレン樹脂は延伸（２軸延伸を含む）により多孔
質フィルムとなる。本発明において使用されるものの孔
径は０．１〜５μ位、厚さは５０〜５００μが適当であ
る。図において１は多孔質四弗化エチレン樹脂フィルム
を示し、２は微小孔を示し、３は物理蒸着された金属層
を示す。FIG. 2 shows an enlarged view of a porous tetrafluoroethylene film with metal deposited on it. As is already known, tetrafluoroethylene resin becomes a porous film by stretching (including biaxial stretching). The suitable pore diameter of the material used in the present invention is about 0.1 to 5 μm, and the thickness is about 50 to 500 μm. In the figure, 1 indicates a porous tetrafluoroethylene resin film, 2 indicates micropores, and 3 indicates a metal layer deposited by physical vapor deposition.
回路構成用の銅の蒸着が行われ、この反対面に銅、ニッ
ケル、鉄等の金属の物理蒸着でシールド層が形成される
。Copper for the circuit structure is vapor-deposited, and a shield layer is formed on the opposite side by physical vapor deposition of metals such as copper, nickel, and iron.
銅、ニッケル、鉄等の金属の物理蒸着手段として、真空
蒸着、スパッタリング、クラスターイオン蒸着法等が使
用され、その厚みは０．１〜５μ程度である。Vacuum deposition, sputtering, cluster ion deposition, etc. are used as physical vapor deposition means for metals such as copper, nickel, iron, etc., and the thickness thereof is about 0.1 to 5 μm.
回路構成用の銅の蒸着面は、露光、現像、エツチングに
より所要回路を現出させ、その後回路上のみ電気メッキ
により厚みＩＯμ程度までふとらせる。The copper vapor-deposited surface for the circuit structure is exposed to light, developed, and etched to reveal the required circuit, and then electroplated only on the circuit to a thickness of about IOμ.
第１図（イ）、（ロ）は本発明の実施例を示す。（イ）
図において、１は多孔質四弗化エチレン樹脂フィルムで
あり、４は金属蒸着によるシールド層を示す。FIGS. 1A and 1B show embodiments of the present invention. (stomach)
In the figure, 1 is a porous tetrafluoroethylene resin film, and 4 is a shield layer formed by metal vapor deposition.
図示のように２枚の多孔質四弗化エチレン樹脂フィルム
１のうち１枚の片面にはすでに説明した方法で金属蒸着
回路５およびその表面への銅メッキによる電気回路６が
形成され、両多孔質四弗化エチレン樹脂フィルム１はシ
ールド層４をそれぞれ外側として、内側となる面に接着
剤を貼って一体とする。As shown in the figure, a metal vapor deposition circuit 5 and an electric circuit 6 by copper plating on the surface are formed on one side of one of the two porous tetrafluoroethylene resin films 1 by the method already explained, and both porous The tetrafluoroethylene resin film 1 is integrated with the shield layer 4 on the outside and an adhesive on the inside surface.
（ロ）図において、２枚の多孔質四弗化エチレン樹脂フ
ィルム１には上下対称に、同一パターンの金属蒸着回路
５およびその表面への銅電気メッキによる電気回路が形
成され、２枚の多孔質四弗化エチレン樹脂フィルムは、
対称的に形成された電気回路６を合わせ、半田層７によ
って一体とする。(b) In the figure, two porous polytetrafluoroethylene resin films 1 are vertically symmetrically formed with metal vapor-deposited circuits 5 of the same pattern and electric circuits formed by copper electroplating on their surfaces. Quality tetrafluoroethylene resin film is
The symmetrically formed electrical circuits 6 are brought together and integrated by a solder layer 7.
以上は本発明の構成を例示するものであるが、次に本発
明による試作例について説明する。The above is an example of the configuration of the present invention, and next, a prototype example according to the present invention will be explained.
気孔率４０％、厚さ１２０μの多孔質四弗化エチレン樹
脂フィルム（孔径０．３〜２μ）にスパッタリング装置
内で、銅を０．５μ厚うらおもて蒸着した。Copper was deposited on the back and front of a porous tetrafluoroethylene resin film (pore diameter: 0.3 to 2 μm) with a porosity of 40% and a thickness of 120 μm in a sputtering apparatus.
その後、片面のみに電気回路を露光、現像、エツチング
により現出させ、その後回路上のみ電気メッキにより厚
さ１０μまでふとらせた。Thereafter, an electric circuit was exposed on only one side by exposure, development, and etching, and then only the circuit was electroplated to a thickness of 10 μm.
さらに、片面のみ銅スパツタリングした多孔質四弗化エ
チレンフィルムの裏面に、熱硬化性型のフィルム状接着
剤をラミネートし、前記回路面に重ね、１５０℃で加圧
接若させた。Further, a thermosetting film adhesive was laminated on the back side of the porous tetrafluoroethylene film with copper sputtering applied on only one side, and the film was stacked on the circuit surface and bonded under pressure at 150°C.
得られた回路及びシールド層の接着力は４００ｇ／ｃｖ
ｓの剥離強度が得られ、前記多孔質フィルムが破断した
。The adhesive strength of the obtained circuit and shield layer was 400g/cv
A peel strength of s was obtained, and the porous film was broken.
またシールド効果を測定した結果、一般ＦＰＣと比較し
て静電容量が１７４に低下して良好なンールド特性を示
した。Furthermore, as a result of measuring the shielding effect, the capacitance was lowered to 174 compared to a general FPC, indicating good rolled characteristics.
本発明は高周波基板、／−ルド付ＦＰＣに適用すること
ができる。The present invention can be applied to high frequency boards and FPCs with /- leads.
［効果コ
以上説明したように、従来は四弗化樹脂を単にンートと
したものを使用していたのに対し、本発明では多孔質の
四弗化エチレン樹脂（厚さ５０〜５００μ）を用いてい
るため、半田耐熱性、低誘電率（ε：１．４〜２．１）
、柔軟性を示すＦＰＣが得られる。[Effects] As explained above, in the past, tetrafluoride resin was simply used as a thin layer, but in the present invention, porous tetrafluoroethylene resin (thickness 50 to 500μ) was used. Because of this, soldering heat resistance and low dielectric constant (ε: 1.4 to 2.1) are achieved.
, an FPC exhibiting flexibility is obtained.
金属蒸着層が多孔質体表面の１〜１０μ深さまで入り込
み、投錨状態となり、多孔質の表面に接着剤なくして金
属が一体化しており、耐熱的であって、温湿度の影響を
受けないプリント回路基板が得られる。The metal vapor deposition layer penetrates to a depth of 1 to 10 μm into the surface of the porous material, creating an anchored state, and the metal is integrated onto the porous surface without adhesive, making it heat resistant and print unaffected by temperature and humidity. A circuit board is obtained.
第１図（イ）、（ｏ）、はそれぞれ本発明の実施例であ
り、拡大断面図で示す。
第２図は多孔質四弗化エチレン樹脂フィルムに対する金
属物理蒸着の説明図である。
１・・・多孔質四弗化エチレン樹脂フィルム、２・・・
微小孔、３・・・蒸着金属層、４・・・シールド層、５
・・・金属蒸着回路、ｅ・・・電気回路、７・・・半田
層。FIGS. 1A and 1O show embodiments of the present invention, respectively, and are shown in enlarged cross-sectional views. FIG. 2 is an explanatory diagram of metal physical vapor deposition on a porous tetrafluoroethylene resin film. 1...Porous ethylene tetrafluoride resin film, 2...
Micropore, 3... Vapor deposited metal layer, 4... Shield layer, 5
...Metal deposition circuit, e...Electric circuit, 7...Solder layer.
Claims (1)
層を物理蒸着し、エッチング、銅メッキ等で電気回路を
形成するか、金属層の物理蒸着もせず、他の片面にシー
ルド層として金属層を物理蒸着し、ナくなくとも一方の
片面に電気回路を形成した２枚の前記多孔質四弗化エチ
レン樹脂フィルムのシールド層を表にして前記２枚の多
孔質四弗化エチレン樹脂フィルムを接合したことを特徴
とするシールド付可撓性プリント回路基板。(1) Either physically deposit a metal layer on one side of a porous tetrafluoroethylene resin film and form an electric circuit by etching, copper plating, etc., or use a metal layer as a shield layer on the other side without physical vapor deposition of a metal layer. The two porous polytetrafluoroethylene resin films are physically vapor-deposited, and the shield layer of the two porous polytetrafluoroethylene resin films is formed with an electric circuit on at least one side thereof, with the shield layer facing up. A flexible printed circuit board with a shield, characterized by bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19713785A JPH0644667B2 (en) | 1985-09-05 | 1985-09-05 | Flexible printed circuit board with shield |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19713785A JPH0644667B2 (en) | 1985-09-05 | 1985-09-05 | Flexible printed circuit board with shield |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6255991A true JPS6255991A (en) | 1987-03-11 |
| JPH0644667B2 JPH0644667B2 (en) | 1994-06-08 |
Family
ID=16369369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19713785A Expired - Lifetime JPH0644667B2 (en) | 1985-09-05 | 1985-09-05 | Flexible printed circuit board with shield |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0644667B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6442890A (en) * | 1987-08-11 | 1989-02-15 | Japan Gore Tex Inc | Printed substrate |
| JPH01287999A (en) * | 1988-05-16 | 1989-11-20 | Fujikura Ltd | Printed wiring board |
| JPH04267597A (en) * | 1991-02-22 | 1992-09-24 | Sumitomo Electric Ind Ltd | Manufacture of flexible printed wiring board |
| JPH05160558A (en) * | 1991-12-10 | 1993-06-25 | Mitsubishi Electric Corp | Moisture resistant structure of module circuit |
| JP2007180371A (en) * | 2005-12-28 | 2007-07-12 | Hitachi Cable Ltd | Substrate and electronic module |
| JP2009277855A (en) * | 2008-05-14 | 2009-11-26 | Hitachi Chem Co Ltd | High-frequency circuit board |
-
1985
- 1985-09-05 JP JP19713785A patent/JPH0644667B2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6442890A (en) * | 1987-08-11 | 1989-02-15 | Japan Gore Tex Inc | Printed substrate |
| JPH01287999A (en) * | 1988-05-16 | 1989-11-20 | Fujikura Ltd | Printed wiring board |
| JPH04267597A (en) * | 1991-02-22 | 1992-09-24 | Sumitomo Electric Ind Ltd | Manufacture of flexible printed wiring board |
| JPH05160558A (en) * | 1991-12-10 | 1993-06-25 | Mitsubishi Electric Corp | Moisture resistant structure of module circuit |
| JP2007180371A (en) * | 2005-12-28 | 2007-07-12 | Hitachi Cable Ltd | Substrate and electronic module |
| JP2009277855A (en) * | 2008-05-14 | 2009-11-26 | Hitachi Chem Co Ltd | High-frequency circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0644667B2 (en) | 1994-06-08 |
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