JPS63224936A - Laminated board - Google Patents
Laminated boardInfo
- Publication number
- JPS63224936A JPS63224936A JP6048287A JP6048287A JPS63224936A JP S63224936 A JPS63224936 A JP S63224936A JP 6048287 A JP6048287 A JP 6048287A JP 6048287 A JP6048287 A JP 6048287A JP S63224936 A JPS63224936 A JP S63224936A
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- thickness
- resin
- cloth
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004744 fabric Substances 0.000 claims description 18
- 239000011521 glass Substances 0.000 claims description 16
- 239000011888 foil Substances 0.000 claims description 9
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 238000009413 insulation Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229920006361 Polyflon Polymers 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000002075 main ingredient Substances 0.000 description 3
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical group FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 2
- 229920006026 co-polymeric resin Polymers 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- JMGNVALALWCTLC-UHFFFAOYSA-N 1-fluoro-2-(2-fluoroethenoxy)ethene Chemical compound FC=COC=CF JMGNVALALWCTLC-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000976 Electrical steel Inorganic materials 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 125000006337 tetrafluoro ethyl group Chemical group 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔技術分野〕
本発明は多層プリント配線板に使用する積層板に関する
。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a laminate used in a multilayer printed wiring board.
従来より、ガラス布基材にエポキシ樹脂あるいはポリイ
ミＶ樹脂を含浸させ乾燥させて形成した樹脂含浸基材を
積層成形してプリント配線板用の積層板が製造されて偽
るが、この積層板の誘電率はガラス／エボキＶ系の樹脂
含浸基材を採用した場合には４．５で、ガラス／ポリイ
ミド系で４６０と比較的大きく、従って、プリント配線
板として使用した場合には高周波に対する特性が不充分
で、高周波クロックを用いた高絢波演算回路の実装とか
、通信機器回路の実装には制約を受けていた。Conventionally, laminates for printed wiring boards have been fabricated by laminating resin-impregnated base materials formed by impregnating a glass cloth base material with epoxy resin or polyimide V resin and drying them. The ratio is 4.5 when a glass/Evoki V-based resin-impregnated base material is used, and 460 when a glass/polyimide-based base material is used, which is relatively large. Therefore, when used as a printed wiring board, the characteristics against high frequencies are poor. However, there were restrictions on the implementation of high-frequency arithmetic circuits using high-frequency clocks and the implementation of communication equipment circuits.
このため本発明者らは、既に、絶縁層をフッ素樹脂含浸
ガラス布基材で形成して誘電率が小さく、高周波特性が
良好な積層板を開発して−るが、ガラス布は含浸樹脂と
の密着性を良くして耐熱性を確保するために、例えば４
０〜５０μ程度のガラス布を採用しているが、このガラ
ス布は高価であり、積層板のコストを上昇させるだけで
なく、厚みが小さいことから寸法安定性に劣ったもので
あった。For this reason, the present inventors have already developed a laminate with a low dielectric constant and good high frequency characteristics by forming the insulating layer with a glass cloth base material impregnated with a fluororesin. For example, in order to improve adhesion and ensure heat resistance,
Glass cloth of about 0 to 50 μm is used, but this glass cloth is expensive and not only increases the cost of the laminate, but also has poor dimensional stability due to its small thickness.
本発明は上記事情に鑑みて為されたものであり、その目
的とするところは、耐熱性、電気Ｊ！縁性に優れ誘電率
が小さくて高周波特性が良好となり、プリント配線板と
して使用した場合に高周波演算回路、通信機回路の実装
が可能であるのはもちろんのこと、寸法安定性に優れ、
しかもコストを抑えることができる積層板を提供するこ
とにある。The present invention has been made in view of the above circumstances, and its purpose is to improve heat resistance, electric J! It has excellent edge resistance, low dielectric constant, and good high-frequency characteristics.When used as a printed wiring board, it is possible to mount high-frequency arithmetic circuits and communication circuits, and it also has excellent dimensional stability.
Moreover, the object is to provide a laminate that can reduce costs.
本発明の積層板は所要枚数のフッ素樹脂含浸ガラス布の
上面及び又は下面に金属箔を配役した積層体を積層一体
化してなる積層板におりて、ガラス布の淳みが０．０６
〜０．２２ｊｆｆで、表面処理を施しり単糸クロスであ
ることを特徴とするものであり、この、構成により上記
目的を達成できたものである。The laminate of the present invention is a laminate made by laminating and integrating a required number of fluororesin-impregnated glass cloths with metal foil on the upper and/or lower surfaces, and the thickness of the glass cloth is 0.06.
~0.22jff, and is characterized by being a surface-treated single yarn cloth, and with this configuration, the above object can be achieved.
以下本発明を添付の図面を参照して詳細に説明する。The present invention will now be described in detail with reference to the accompanying drawings.
本発明で使用するガラス基材は、厚みが０．０６−０．
２２ｆｆ の単糸クロスであるのが必須条件である。The glass substrate used in the present invention has a thickness of 0.06-0.
The essential condition is that it is a 22ff single yarn cloth.
このガラス基材のその他の要件としては、重量が６０〜
２３０ ｆ／ゴ、密度が縦３０〜６０本／２５闘、横３
０〜６０＄／２５ｆｌ で単糸平織クロスを好適に採
用できる。このガラス基材はシランカップリング剤で表
面処理が施されている。シランカップリング剤としては
、厚みの大きいガラスクロスを使用するので、Ｐｈ５ｉ
（ＯＲ）ｓを主剤とするものが好まし論にのガラス基材
にフッ素樹脂を含浸させ乾燥させてプリプレグが形成さ
れている。フリ素樹脂としては、三フリ化塩化エチレン
樹Ｉｌｌ （ＣＴＦＥ、融点２１０〜２１２℃）、四７
．化エチレン樹脂（ＴＦＥ。Other requirements for this glass substrate include a weight of 60~
230 f/go, density 30-60 vertical lines/25 lines, 3 horizontal lines
Single yarn plain weave cloth can be suitably used at 0 to 60 $/25 fl. This glass substrate has been surface-treated with a silane coupling agent. Since a thick glass cloth is used as the silane coupling agent, Ph5i
A prepreg is formed by impregnating a glass substrate with (OR)s as the main ingredient and drying the fluororesin. Examples of fluororesins include trifluorochloroethylene resin (CTFE, melting point 210-212°C),
．． ethylene resin (TFE).
Ｍｉ点ｓ２ｏ〜３３５℃）、四フッ化エチＶンー六フ咋
化プロピレン共重合体樹脂（ＦＥＰ、融点２６０〜２８
０℃）、四フッ化エチレスーパープルオロビニルエーテ
ル共重合体樹脂（ＰＦＡ、融点３０２〜３１０℃）、四
フッ化エチレンーエチレン共菖合体樹脂（ＥＴＦＥ、融
点２６０〜２７０℃）などのような融点カ２００℃以上
のものが好ましｈｏこのようにして形成したプリプレグ
が複数枚積層され、その両面又は片面に金属箔が貼着さ
れて積層板が形成されて−る。金属箔としては銅箔、ア
ルミニウム箔、真ちゅう箔、鉄箔、ステンレス＠箔、ニ
ッケル箔、ケイ素鋼箔などいずれをも採用できる。Mi point s2o~335°C), tetrafluoroethyl V-hexafluoropropylene copolymer resin (FEP, melting point 260~28
0°C), tetrafluoroethylene super fluorovinyl ether copolymer resin (PFA, melting point 302-310°C), tetrafluoroethylene-ethylene copolymer resin (ETFE, melting point 260-270°C), etc. Preferably, the temperature is 200° C. or higher. A plurality of prepregs thus formed are laminated, and metal foil is adhered to both or one side of the prepreg to form a laminate. As the metal foil, copper foil, aluminum foil, brass foil, iron foil, stainless steel foil, nickel foil, silicon steel foil, etc. can be used.
本発明の積層板は、例えば複数枚のプリプレグを積み重
ねると共にプリプレグ間に接着剤層としてフッ素増脂フ
ィルムとかボリイミＶ樹脂のような誘電率の小さｂその
他の樹＠フィルムを介在させ、更にその両面又は片面に
接着剤層を介して金層箔を積み重ね、このものを−組み
として成形プレートを介して複数組み熱盤間に配置し、
２００’Ｃ以上、２０〜１５０ ＫＱ／ｃｄ ｓ ４Ｇ
〜１００ 分で加熱加圧して積層一体化させて製造
する。The laminate of the present invention can be produced by, for example, stacking a plurality of prepregs, interposing a resin film with a low dielectric constant such as fluorine fat film or Boliimi V resin as an adhesive layer between the prepregs, and furthermore, Alternatively, stack gold layer foils on one side with an adhesive layer interposed therebetween, and arrange multiple sets between hot plates via forming plates as a set.
200'C or higher, 20-150 KQ/cd s 4G
It is manufactured by heating and pressing for ~100 minutes to integrate the layers.
この積層板は順次、孔明け、無電解めっき、パターン形
成、パターンめりき、レジストめっき、レジスト除去、
エツチング、外形仕上げ、Ｖンボルマーク印刷といった
工程でスルーホールめっきプリント配線板が製造される
。This laminate is sequentially processed by drilling, electroless plating, pattern formation, pattern plating, resist plating, resist removal, and
Through-hole plated printed wiring boards are manufactured through processes such as etching, external finishing, and V-embol mark printing.
次に、本発明の実施例を具体的に説明する。Next, examples of the present invention will be specifically described.
（実施例１）
厚み０．１１０１、重量が１０４ ｆｌ／ｖｆ 、密度
が縦６ 昧、４ｓ ｊｏｌ、横５８本／２５ｍＡの単糸
平織クロス（商品名ｒＷｌ −１１６ＥＪ、日東紡績（
株）製）の表面をＰｈ５ｉ（ＯＲ）ｓを主剤とするシラ
ンカブプリング剤により表面処理した後、四フフ化エチ
レン樹脂（商品名「ポリフロンＴＦＥＪ、ダイキン工業
（株）製）を含浸、焼成してプリプレグを形成した。(Example 1) A single yarn plain weave cloth (product name: rWl-116EJ, Nitto Boseki (trade name: rWl-116EJ,
Co., Ltd.) was surface-treated with a silane turn-pull agent containing Ph5i(OR)s as the main ingredient, and then impregnated with tetrafluoroethylene resin (trade name: Polyflon TFEJ, manufactured by Daikin Industries, Ltd.) and fired. A prepreg was formed.
二枚のプリプレグの両面及び間に厚み０．０４ＸＩｌの
ＴＦＥ７９素樹脂フィルム（「ニドフロン」）ヲ装置し
、更に両面に厚みＱ、０３５．四の銅箔を配置して積層
成形して厚み０．３１ｆｆの銅張り積層板を製造した。A TFE79 base resin film ("Nidoflon") with a thickness of 0.04XIl was placed on both sides of the two prepregs and between them, and a thickness of Q, 035. A copper-clad laminate having a thickness of 0.31 ff was manufactured by arranging and laminating the four copper foils.
との銅張り積層板の寸法変化基（ＸｔＯ℃で６０分加熱
）、耐熱性及び絶縁抵抗（Ｄ −２／１００ ）を測定
した。結果を第１表に示す。The dimensional change (heated at XtO° C. for 60 minutes), heat resistance, and insulation resistance (D −2/100 ) of the copper-clad laminate were measured. The results are shown in Table 1.
（実施例２）
淳み０．２１１１１、重量が２０６か曾、密度が縦４２
本Ａ５順、横ａ Ｚ２Ｅ ／２５ ｔｇの単糸平織クロ
ス（商品名「ｗＥ−１８Ｋ Ｊ、日東紡績（株）製）の
表面をＰｈｏｔ（ＯＲ）ｓを主剤とするシランカップリ
ング剤により表面処理した後、四フッ化エチレン樹脂（
商品名「ポリフロンＴＦＥ Ｊ、ダイキン工業０株）裂
）を含浸、焼成してプリプレグを形成した。(Example 2) Thickness 0.21111, weight 206, density 42
The surface of this A5 order, horizontal a Z2E /25 tg single yarn plain weave cloth (product name "wE-18K J", manufactured by Nitto Boseki Co., Ltd.) was surface treated with a silane coupling agent containing Phot(OR)s as the main ingredient. After that, add tetrafluoroethylene resin (
A prepreg was formed by impregnating and firing Polyflon TFE J (trade name: Polyflon TFE J, Daikin Industries, Ltd.).
このプリプレグの両面及び間に匣みｏ、ｏａ＊ｍ のＴ
ＦＥ フ、ｇａｔ脂フィルム（「＝ドア０ンＪ）を配置
し、更に両面に厚み０．０３５ｆｌの銅箔を配置して積
層成形して厚み０．３１ｆｆの銅張り積層板を製造した
。T of o, oa*m is placed between both sides of this prepreg and between
FE F, GAT resin film ("=door 0n J") was placed, and copper foil with a thickness of 0.035 fl was placed on both sides, and laminated molding was performed to produce a copper-clad laminate with a thickness of 0.31 ff.
この銅張り積層板の寸法変化率、耐熱性及び絶縁抵抗を
実施例１と同様にして測定した。結果を第１表に示す。The dimensional change rate, heat resistance, and insulation resistance of this copper-clad laminate were measured in the same manner as in Example 1. The results are shown in Table 1.
（比較例１）
厚みＱ、Ｑ５ｆｌ、重量が４９９β、密度が縦６０本Ａ
５鱈・、 、横４６ ＄／２５ ｊｌ’ｌの合撚糸平織
クロス（１０８タイプ）の平面を糊で処理した後、四フ
ッ化エチレン樹脂（商品名「ポリフロンＴＦＥＪ、ダイ
キン工業（株）製）を含浸焼成してプリプレグを形成し
た。(Comparative Example 1) Thickness Q, Q5fl, weight 499β, density 60 vertical lines A
After treating the flat surface of a 5-cod, width 46 $/25 jl'l plied yarn plain weave cloth (108 type) with glue, polytetrafluoroethylene resin (trade name "Polyflon TFEJ" manufactured by Daikin Industries, Ltd.) was applied. A prepreg was formed by impregnating and firing.
四枚のプリプレグの画面及び間に厚み０．０４ｆｌのＴ
ＦＥフッ素樹脂フィルム（「ニドフロンＪ）を配置し、
更に両面に厚み０．０３５ｍｗの銅箔を配置して積層成
形して厚み０．３１５ｍの銅張り積層板を製造した。Four prepreg screens and a 0.04fl thick T between them.
Place FE fluororesin film (Nidoflon J),
Furthermore, copper foil with a thickness of 0.035 mw was placed on both sides and laminated and molded to produce a copper-clad laminate with a thickness of 0.315 m.
この銅張り積層板の寸法変化率、耐熱性及び絶縁抵抗を
実施例１と同様にして測定した。結果を第１表に示す。The dimensional change rate, heat resistance, and insulation resistance of this copper-clad laminate were measured in the same manner as in Example 1. The results are shown in Table 1.
（比較例２）
単糸平織クロス（ｒ ＷＥ−ｏ ｓＥ ｊ ）の表面を
Ｐｈ５ｉ（ＯＲ）ｓで処理した以外は比較例１と同様に
してプリプレグ及び鋼張り積層板を製造した。(Comparative Example 2) A prepreg and a steel-clad laminate were produced in the same manner as in Comparative Example 1, except that the surface of the single yarn plain weave cloth (r WE-osE j ) was treated with Ph5i(OR)s.
この銅張り積層板の寸法変化率、耐熱性及び絶縁抵抗を
実施例１と同様にして測定した。結果を第１表に示す。The dimensional change rate, heat resistance, and insulation resistance of this copper-clad laminate were measured in the same manner as in Example 1. The results are shown in Table 1.
（比較例３）
単糸平織クロス（商品名ｒＷＥ−１１６ＥＪ、日東紡績
（株）！ｉｌ）の表面を糊で表面処理した以外は実施例
１と同様にしてプリプレグ及び銅張り積層板を製造した
。(Comparative Example 3) A prepreg and a copper-clad laminate were manufactured in the same manner as in Example 1, except that the surface of the single yarn plain weave cloth (trade name rWE-116EJ, Nitto Boseki Co., Ltd.!il) was surface-treated with glue. .
との銅張り積層板の寸法変化率、耐熱性及び絶縁抵抗を
実施例１と同様にして測定した。結果をｆａ１表に示す
。The dimensional change rate, heat resistance, and insulation resistance of the copper-clad laminate were measured in the same manner as in Example 1. The results are shown in table fa1.
第１表の結果より明らかなように、本発明の実施例にあ
っては比較例のものに対して寸法安定性、耐熱性及び絶
縁抵抗のいずれにおいても優れて込ることが判る。As is clear from the results in Table 1, it can be seen that the examples of the present invention are superior to those of the comparative examples in all of dimensional stability, heat resistance, and insulation resistance.
本発明にあっては、誘電率が小さく、高周波特性が良好
となり、プリント配線板として使用した場合に高周波演
算回路、通信機回路の実装が可能な絶縁特性に優れガラ
ス基材が厚み０．０６〜Ｑ、２２ｆｆで表面処理を櫃し
た眼糸クロスであるので、含浸樹脂との密着性が良好で
寸法安定性及び耐熱性に優れ、しかもコストを抑えるこ
とができるものである。In the present invention, the dielectric constant is small, the high frequency characteristics are good, and when used as a printed wiring board, the glass base material has excellent insulation characteristics and has a thickness of 0.06 mm, allowing the mounting of high frequency arithmetic circuits and communication device circuits. ~Q, Since it is a eye thread cloth that has been surface-treated with 22ff, it has good adhesion to the impregnated resin, has excellent dimensional stability and heat resistance, and can reduce costs.
Claims (2)
は下面に金属箔を配設した積層体を積層一体化してなる
積層板において、ガラス布の厚みが０．０６〜０．２２
ｍｍで、表面処理を施した単糸クロスであることを特徴
とする積層板。(1) In a laminate formed by laminating and integrating a required number of fluororesin-impregnated glass cloths with metal foil arranged on the upper and/or lower surfaces, the thickness of the glass cloth is 0.06 to 0.22.
A laminate board characterized in that it is a single yarn cloth with a diameter of mm and has been surface-treated.
行なっていることを特徴とする特許請求の範囲第１項記
載の積層板。(2) The laminate according to claim 1, wherein the surface of the single yarn cloth is treated with a silane coupling agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6048287A JPS63224936A (en) | 1987-03-16 | 1987-03-16 | Laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6048287A JPS63224936A (en) | 1987-03-16 | 1987-03-16 | Laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63224936A true JPS63224936A (en) | 1988-09-20 |
Family
ID=13143540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6048287A Pending JPS63224936A (en) | 1987-03-16 | 1987-03-16 | Laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63224936A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001003478A1 (en) * | 1999-07-05 | 2001-01-11 | Nippon Pillar Packing Co., Ltd. | Printed wiring board and prepreg for printed wiring board |
| JP2006059865A (en) * | 2004-08-17 | 2006-03-02 | Unitika Ltd | Substrate and its manufacturing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5691030A (en) * | 1979-12-24 | 1981-07-23 | Mitsubishi Gas Chemical Co | Glass fabric substrate for copper cladded laminate plate |
| JPS57165917A (en) * | 1981-04-06 | 1982-10-13 | Fuji Fibre Glass Co Ltd | Electrically insulating laminated plate |
| JPS6144632A (en) * | 1984-08-10 | 1986-03-04 | 松下電工株式会社 | Adhesive prepreg for multilayer printed wiring board |
-
1987
- 1987-03-16 JP JP6048287A patent/JPS63224936A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5691030A (en) * | 1979-12-24 | 1981-07-23 | Mitsubishi Gas Chemical Co | Glass fabric substrate for copper cladded laminate plate |
| JPS57165917A (en) * | 1981-04-06 | 1982-10-13 | Fuji Fibre Glass Co Ltd | Electrically insulating laminated plate |
| JPS6144632A (en) * | 1984-08-10 | 1986-03-04 | 松下電工株式会社 | Adhesive prepreg for multilayer printed wiring board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001003478A1 (en) * | 1999-07-05 | 2001-01-11 | Nippon Pillar Packing Co., Ltd. | Printed wiring board and prepreg for printed wiring board |
| US6417459B1 (en) | 1999-07-05 | 2002-07-09 | Nippon Pillar Packing Co., Ltd. | Printed circuit board, and prepreg for a printed circuit board |
| KR100417951B1 (en) * | 1999-07-05 | 2004-02-11 | 니폰 필라고교 가부시키가이샤 | Printed wiring board and prepreg for printed wiring board |
| JP2006059865A (en) * | 2004-08-17 | 2006-03-02 | Unitika Ltd | Substrate and its manufacturing method |
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