JPS62256440A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS62256440A
JPS62256440A JP61099975A JP9997586A JPS62256440A JP S62256440 A JPS62256440 A JP S62256440A JP 61099975 A JP61099975 A JP 61099975A JP 9997586 A JP9997586 A JP 9997586A JP S62256440 A JPS62256440 A JP S62256440A
Authority
JP
Japan
Prior art keywords
pellet
semiconductor device
paste
epoxy paste
surface edges
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61099975A
Other languages
English (en)
Inventor
Hideki Kurihara
秀樹 栗原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61099975A priority Critical patent/JPS62256440A/ja
Publication of JPS62256440A publication Critical patent/JPS62256440A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4899—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置に関し、特にボンデングワイヤーに
よるエツジタッチを防止した構造に関するものである。
〔従来の技術〕
従来、半導体装置は、その表面エッヂ部に半導体基板が
露出した半導体素子（以下ベレットと呼ぶ）をリードフ
レームのダイパッドに搭載した後、金線等のボンディン
グワイヤーで電極パッドとリードフレームのリードを結
線していた。
〔発明が解決しようとする問題点〕
上述した半導体装置ではベレットとリードを結線する際
、ワイヤーボンディング装置の振動等によりボンディン
グワイヤーが変形して、ボンディングワイヤーがベレッ
トの表面エッヂ部に露出している半導体基板に接触し、
半導体装置の電気的短絡を発生させるという不具合があ
った。
〔問題点を解決するための手段〕
本発明の半導体装置は、半導体素子の表面エッヂ部に絶
縁物を設けたことを特徴とする。
〔実施例〕
次に本発明について図面を参照して説明する。
第１図から第３図は、本発明の一実施例をその製造工程
順に示したものでまず第１図に示すように、リードフレ
ームのダイパッド１にベレット２を搭載した後、絶縁性
の熱硬化性エポキシペースト３を塗布油Ｊ７Ｊｅ４でベ
レット表面エッヂｍ５ｖＣ塗布する。次に第２図に示す
ように第１図に示す工程で塗布した熱硬化性エポキシペ
ースト３を加熱し、ベレット表面エッヂ５に固着させる
。熱硬化性エポキシペースト３を加熱する方法として、
グイパッド１の下からヒーター６で加熱する。固着した
エポキシペースト３は露出していたペレット２のエツジ
部５を覆ってしまう。従って第３図に示すように、ワイ
ヤーボンディング時にボンディングワイヤー８が変形し
、ペレット表面エッヂ部５に接触しても、半導体装置が
電気的に短絡することはない。
〔発明の効果〕
以上説明したように本発明は、半導体素子の表面エッヂ
部に絶縁物を設けることにより、ワイヤーボンディング
時にボンディングワイヤーが変形しても、ペレットの半
導体基板に接触することがなくなるので、半導体装置の
電気的な短絡を防止できるという効果がある。
【図面の簡単な説明】
第１図は、絶縁性熱硬化性ペーストをペレットエッヂに
塗布する状態を示した概略断面図、第２図は、第１図で
塗布したペーストを硬化させるため、ヒーターで加熱し
ていることを示す概略断面図、第３図は、第２図のペレ
ットにワイヤーボンディングを施こしたことを示す概略
断面図。 １・・・・・・グイパッド、２・・・・・・ペレット、
３・・・・・・絶縁性熱硬化性ペースト、４・・・・・
・ペースト塗布治具、５・・・・・・ベレットエラｆ部
、６・・・・・・ヒーター、８°゛。 ・・・ワイヤー、９・・・・・・電極パッド、１０・・
・・・・ペレットのカバー、１１・°°°°°リード。

Claims (1)

    【特許請求の範囲】
  1. 半導体素子の表面エッヂ部に絶縁物を設けたことを特徴
    とする半導体装置。
JP61099975A 1986-04-28 1986-04-28 半導体装置 Pending JPS62256440A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61099975A JPS62256440A (ja) 1986-04-28 1986-04-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61099975A JPS62256440A (ja) 1986-04-28 1986-04-28 半導体装置

Publications (1)

Publication Number Publication Date
JPS62256440A true JPS62256440A (ja) 1987-11-09

Family

ID=14261666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61099975A Pending JPS62256440A (ja) 1986-04-28 1986-04-28 半導体装置

Country Status (1)

Country Link
JP (1) JPS62256440A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH022835U (ja) * 1988-06-20 1990-01-10

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH022835U (ja) * 1988-06-20 1990-01-10

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