JPS62238792A - Thermal stencil paper - Google Patents
Thermal stencil paperInfo
- Publication number
- JPS62238792A JPS62238792A JP8136786A JP8136786A JPS62238792A JP S62238792 A JPS62238792 A JP S62238792A JP 8136786 A JP8136786 A JP 8136786A JP 8136786 A JP8136786 A JP 8136786A JP S62238792 A JPS62238792 A JP S62238792A
- Authority
- JP
- Japan
- Prior art keywords
- film
- fine particles
- silicone resin
- stencil paper
- paper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920002050 silicone resin Polymers 0.000 claims abstract description 33
- 239000010419 fine particle Substances 0.000 claims abstract description 30
- 239000002245 particle Substances 0.000 claims abstract description 19
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 14
- 239000000057 synthetic resin Substances 0.000 claims abstract description 14
- 239000000853 adhesive Substances 0.000 claims abstract description 10
- 230000001070 adhesive effect Effects 0.000 claims abstract description 10
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 9
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 9
- 238000010030 laminating Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 abstract description 4
- 239000007787 solid Substances 0.000 abstract description 4
- 239000002904 solvent Substances 0.000 abstract description 2
- 239000011230 binding agent Substances 0.000 abstract 3
- 238000001035 drying Methods 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 42
- 239000003795 chemical substances by application Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 239000000835 fiber Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 229920006267 polyester film Polymers 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 240000000907 Musa textilis Species 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 229920002545 silicone oil Polymers 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 229920002978 Vinylon Polymers 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920002994 synthetic fiber Polymers 0.000 description 2
- 239000012209 synthetic fiber Substances 0.000 description 2
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 240000006248 Broussonetia kazinoki Species 0.000 description 1
- 241001265525 Edgeworthia chrysantha Species 0.000 description 1
- 240000000249 Morus alba Species 0.000 description 1
- 235000008708 Morus alba Nutrition 0.000 description 1
- 240000009253 Morus australis Species 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000005667 methoxymethylation reaction Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 235000014593 oils and fats Nutrition 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/245—Stencils; Stencil materials; Carriers therefor characterised by the thermo-perforable polymeric film heat absorbing means or release coating therefor
Landscapes
- Printing Plates And Materials Therefor (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は感熱性孔版原紙に関する。さらに詳しくは熱転
写プリンター、電話ファクシミリなどに使用されるサー
マルヘッドの熱により原紙の対応する部分が溶融穿孔さ
れて孔版を与える感熱性孔版原紙に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a heat-sensitive stencil paper. More specifically, the present invention relates to heat-sensitive stencil paper used in thermal transfer printers, telephone facsimile machines, etc., in which corresponding portions of the base paper are melted and perforated by the heat of a thermal head to form a stencil.
［従来の技術］
従来よりかかるサーマルヘッドにより穿孔可能な感熱性
孔版原紙として、塩化ビニル系フィルム、ポリエステル
フィルムなどの延伸された熱可塑性合成樹脂フィルムと
、コウゾ、ミツマタ、マニラ麻などの天然繊維またはポ
リエステル繊維、レーヨン繊維、ビニロン繊維などの合
成繊維などを抄紙した多孔性薄葉紙とを接着剤で貼合せ
たものが知られている（たとえば特開昭６０−４８３９
８号公報参照）。[Prior Art] Conventionally, as heat-sensitive stencil paper that can be perforated by such a thermal head, stretched thermoplastic synthetic resin films such as vinyl chloride films and polyester films, natural fibers such as mulberry, Japanese mulberry, and Manila hemp, or polyester have been used. It is known that porous thin paper made from fibers, synthetic fibers such as rayon fibers, vinylon fibers, etc. is bonded with an adhesive (for example, Japanese Patent Application Laid-Open No. 60-4839
(See Publication No. 8).
さらに前記原紙のフィルム表面に、サーマルヘッドによ
り溶融穿孔されたときにフィルムの溶融物がサーマルヘ
ッドに付着するのを防止するために、シリコーンオイル
、界面活性剤などを塗布することが知られている（たと
えば特開昭（ｉｏ−１９５９２号公報参照）。Furthermore, it is known to apply silicone oil, surfactant, etc. to the film surface of the base paper in order to prevent the molten material of the film from adhering to the thermal head when the film is melted and perforated by the thermal head. (For example, see Japanese Unexamined Patent Publication No. IO-19592).
［発明が解決しようとする問題点］
これらの感熱性孔版原紙においては、フィルム層がサー
マルヘッドの熱を受けることにより溶融穿孔されるので
あるが、鮮明度の高い穿孔をうるには、通常きわめて薄
いフィルムを使用することが必要である。ゆえに、一般
には厚さが０．５〜５μという薄いフィルムが使用され
ている。[Problems to be Solved by the Invention] In these heat-sensitive stencil papers, the film layer is melted and perforated by receiving heat from a thermal head, but in order to obtain perforations with high definition, it usually takes a very long time. It is necessary to use thin films. Therefore, a thin film with a thickness of 0.5 to 5 μm is generally used.
しかし、フィルム層がこのように薄いばあいは、孔版で
あるがゆえに印刷時におけるインクの透過性が過大にな
り、そのため印刷用紙に過剰のインクが付着して、印刷
の鮮明度が低下することがある。However, if the film layer is thin like this, the transparency of the ink during printing will be excessive because it is a stencil, and as a result, excessive ink will adhere to the printing paper, reducing the clarity of the print. There is.
このように感熱性孔版原紙においては、それに使用され
るフィルムは、穿孔適性の点から薄いフィルムの方が好
ましく、よりサーマルヘッドの加熱素子の形状に忠実で
鮮明な孔版かえられるが、印刷時のインクの透過性はフ
ィルムが薄くなるほど高くなり、インクの透過性が過大
になると印刷用紙へのインクの過剰付着を招来し、印刷
時の鮮明度が低下する原因になっている。In this way, it is preferable for the film used in heat-sensitive stencil paper to be thin from the point of view of perforation suitability, and it is possible to produce a clear stencil that is more faithful to the shape of the heating element of the thermal head. Ink permeability increases as the film becomes thinner, and when ink permeability becomes excessive, ink adheres excessively to printing paper, causing a decrease in clarity during printing.
従来これらの欠点を補う方法として、インクの粘度を高
くしてインクの透過量を減らす方法も考えられているが
、この方法によると同じ印刷機で他の謄写原紙、たとえ
ば平均厚さ５０μのタイプライタ−原紙、平均厚さ３０
μの放電式電気記録謄写原紙などと併用することができ
ない。Conventionally, as a method to compensate for these shortcomings, a method has been considered to increase the viscosity of the ink to reduce the amount of ink permeation. Lighter base paper, average thickness 30
It cannot be used in conjunction with μ discharge type electric recording mimeograph paper.
したがって感熱性孔版原紙のばあいは硬いインクを、他
の原紙のばあいは柔かいインクを各々選択して使用しな
ければならず、不便である。Therefore, a hard ink must be selected for heat-sensitive stencil paper, and a soft ink must be selected for other base papers, which is inconvenient.
また前記のごとくサーマルヘッドにより溶融穿孔される
フィルムの樹脂がサーマルヘッドに付着するのを防止す
る方法は知られているが、これによってはインクの透過
性の調節はできない。Further, as mentioned above, although there is a known method for preventing the resin of the film melted and perforated by the thermal head from adhering to the thermal head, the ink permeability cannot be adjusted by this method.
本発明はこれらの欠点が解消された感熱性孔版原紙を提
供せんとするものである。The present invention aims to provide a heat-sensitive stencil paper which eliminates these drawbacks.
［問題点を解決するための手段］
すなわち本発明は、厚さが０．５〜５μの熱可塑性合成
樹脂フィルムと多孔性支持体とを接着剤で貼合せてなる
感熱性孔版原紙において、該合成樹脂フィルムの表面に
平均粒径ｌＯμ以下のシリコーン樹脂微粒子が分散固着
されてなることを特徴とする感熱性孔版原紙に関する。[Means for Solving the Problems] That is, the present invention provides a heat-sensitive stencil paper formed by laminating a thermoplastic synthetic resin film with a thickness of 0.5 to 5 μm and a porous support with an adhesive. The present invention relates to a heat-sensitive stencil paper characterized in that fine silicone resin particles having an average particle diameter of 10μ or less are dispersed and fixed on the surface of a synthetic resin film.
［実施例］
つぎに図面にもとづいて、本発明の感熱性孔版原紙を説
明する。[Example] Next, the heat-sensitive stencil paper of the present invention will be explained based on the drawings.
第１図は本発明の一実施例による感熱性孔版原紙の穿孔
製版時の状態を示す概略説明図である。FIG. 1 is a schematic explanatory diagram showing the state of a heat-sensitive stencil paper during perforation making according to an embodiment of the present invention.
第１図において、（１）は感熱性孔版原紙であり、該原
紙は熱可塑性合成樹脂フィルム（２）と多孔性支持体（
３）とを接着剤（４）で貼合せた構成のものであり、該
フィルム（′２Ｊの表面にはシリコーン樹脂微粒子（６
）が均一に分散された層（５）が設けられている。該層
（５）は通常シリコーン樹脂微粒子（６）を固着剤（７
）でフィルム（２の表面に固着させることによって形成
される。In FIG. 1, (1) is a heat-sensitive stencil paper, which consists of a thermoplastic synthetic resin film (2) and a porous support (
3) are bonded together with an adhesive (4), and the surface of the film ('2J) is coated with silicone resin fine particles (6
) is provided, in which a layer (5) is uniformly dispersed. The layer (5) usually consists of silicone resin particles (6) and a fixing agent (7).
) by adhering it to the surface of the film (2).
前記感熱性孔版原紙（１）の穿孔製版は、フィルム（２
）のシリコーン樹脂微粒子層（５）の側にサーマルヘッ
ド（財）を抑圧接触させ、その熱でフィルム（２）の対
応する部分を溶融穿孔することによって行なわれる。The perforation of the heat-sensitive stencil paper (1) is performed using a film (2).
) is brought into pressure contact with the silicone resin fine particle layer (5), and the heat is used to melt and perforate the corresponding portion of the film (2).
従来のサーマルプリンター用感熱性孔版原紙のばあいは
、フィルム（２）に、サーマルヘッド（至）の選択的に
加熱された加熱素子に対応してこれとほぼ同形の孔（ド
ツト）があくわけであるが、本発明の感熱性孔版原紙の
ばあいは、シリコーン樹脂微粒子層（５）を介してサー
マルヘッド（至）とフィルム（２）が抑圧接触するため
に、分散されたシリコーン樹脂微粒子（６）を介してサ
ーマルヘッド（１０）の熱がフィルム（２）に伝達され
、その結果シリコーン樹脂微粒子（６）に対応した孔■
がフィルム（２）に穿孔される。シリコーン樹脂微粒子
（６）はサーマルヘッドＭの加熱素子の面積より小さい
から、本発明においては従来の加熱素子に対応するドツ
トはさらに小さい複数のドツト囚で構成されることにな
る。なおサーマルヘッド（１０）による溶融穿孔時にお
けるフィルム（２）、シリコーン樹脂微粒子（６）など
の溶融物は多孔性支持体（３）中に吸収される。In the case of conventional heat-sensitive stencil paper for thermal printers, there are holes (dots) in the film (2) that are approximately the same shape as the selectively heated heating elements of the thermal head (to). However, in the case of the heat-sensitive stencil paper of the present invention, since the thermal head (to) and the film (2) come into suppressive contact via the silicone resin fine particle layer (5), the dispersed silicone resin fine particles ( The heat of the thermal head (10) is transferred to the film (2) through 6), and as a result, holes corresponding to the silicone resin particles (6) are formed.
are perforated in the film (2). Since the silicone resin fine particles (6) are smaller in area than the heating element of the thermal head M, in the present invention, the dots corresponding to the conventional heating element are composed of a plurality of even smaller dots. Note that during melt perforation by the thermal head (10), melted materials such as the film (2) and silicone resin fine particles (6) are absorbed into the porous support (3).
しかして印刷時にはこの微小なドツト■によってインク
の透過量が抑制されるため、フィルム（′２Ｊとして薄
いものを用いてもインクの透過量が過大にならず、イン
クのニジミなどが防止されて鮮明度が向上される。However, during printing, the amount of ink that passes through is suppressed by these minute dots, so even if a thin film (2J) is used, the amount of ink that passes through does not become excessive, preventing ink smudges and creating a clear image. degree will be improved.
さらにサーマルヘッドａ０はフィルム（２に直接接触し
ないから、従来におけるごときフィルムの溶融物がサー
マルヘッド（至）に付着することがない。なおシリコー
ン樹脂微粒子（６）は溶融してもサーマルヘッド００）
に付着することはない。Furthermore, since the thermal head a0 does not come into direct contact with the film (2), the melted material of the film does not adhere to the thermal head (2) as in the conventional case.Even if the silicone resin fine particles (6) melt, the thermal head (2) does not adhere to the thermal head (2).
It will not stick to the surface.
本発明に使用される熱可塑性合成樹脂フィルムとしては
、厚さ３〜５μの塩化ビニル−塩化ビニリデン共重合体
フィルム、ポリエチレンフィルム、ポリプロピレンフィ
ルム、および厚さ０．５〜３μの延伸された、ポリエス
テルフィルム、フッ化ビニリデンフィルム、ポリカーボ
ネートフィルムなどがあげられる。Thermoplastic synthetic resin films used in the present invention include vinyl chloride-vinylidene chloride copolymer films with a thickness of 3 to 5 μm, polyethylene films, polypropylene films, and stretched polyester films with a thickness of 0.5 to 3 μm. film, vinylidene fluoride film, polycarbonate film, etc.
本発明に使用される多孔性支持体としては、繊度３デニ
ール以下の、ポリエステル繊維、ビニロン繊維、ナイロ
ン繊維などの合成繊維またはマニラ麻、コウゾ、ミツマ
タ、バルブなどの天然繊維の単独もしくは混合物からな
るものが用いられる。多孔性支持体は坪量が６〜１４ｇ
／ｒｒｆ、なかんづく ８〜１４ｇ／ｒｒ？、厚さが２
０〜６０μ、なかんず＜３０〜５０μのものが好ましい
。The porous support used in the present invention is made of synthetic fibers such as polyester fibers, vinylon fibers, and nylon fibers, or natural fibers such as manila hemp, paper mulberry, mitsumata, and bulb, with a fineness of 3 denier or less, alone or in combination. is used. The porous support has a basis weight of 6 to 14 g.
/rrf, especially 8-14g/rr? , thickness 2
0 to 60μ, especially <30 to 50μ is preferred.
本発明に用いるシリコーン樹脂微粒子としては、平均粒
径がＩＯμ以下、好ましくは２〜８μの微粒子であって
、球形に近い形状のものが好ましい。平均粒径が１０μ
を超えると固着剤中に分散して塗布したばあい、粒子１
個あたりの断面積が大きいので、フィルムの穿孔時に形
成されるドツト■の面積が大きくなり、インクの透過量
を抑制できなくなる。またサーマルヘッドの熱エネルギ
ーがフィルムに到達するまでの時間が長くなり、その間
に熱エネルギーが他に転移して鮮明な穿孔かえられなく
なる。シリコーン樹脂微粒子の大きさが小さすぎると、
インクの透過量が過小になったり、フィルム（２）とサ
ーマルヘッドＭの直接接触を招来するので、好ましくな
い。The silicone resin fine particles used in the present invention preferably have an average particle diameter of IOμ or less, preferably 2 to 8μ, and have a shape close to spherical. Average particle size is 10μ
If the particle size exceeds 1, when applied dispersed in a fixing agent,
Since the cross-sectional area of each dot is large, the area of the dots (2) formed when the film is perforated becomes large, making it impossible to suppress the amount of ink permeation. In addition, it takes a long time for the thermal energy of the thermal head to reach the film, and during that time the thermal energy is transferred to other areas, making it impossible to form sharp holes. If the size of the silicone resin particles is too small,
This is not preferable because the amount of ink permeation becomes too small or direct contact between the film (2) and the thermal head M occurs.
本発明に用いる固着剤はとくに制限されないが、たとえ
ば酢酸ビニル樹脂系、ポリアミド系、ポリエステル系、
アクリル樹脂系などの合成樹脂、またはワックス、固形
油脂などがあげられ、少量でシリコーン樹脂を固着しう
るものが好ましい。The adhesive used in the present invention is not particularly limited, but includes, for example, vinyl acetate resin, polyamide, polyester,
Examples include synthetic resins such as acrylic resins, waxes, solid oils and fats, and those that can fix the silicone resin in a small amount are preferred.
本発明の感熱性孔版原紙は、前記熱可塑性合成樹脂フィ
ルムの片面に、前記固着剤を適宜な溶剤に溶解し、これ
にシリコーン樹脂微粒子を該微粒子１００重量部に対し
、固着剤溶液の固形分が好ましくは５〜４０重量部、よ
り好ましくは１０〜２０重量部になるように加え、均一
に分散し、えられた分散液を乾燥塗布量が好ましくは０
．０５〜８ｇ／ｒｒ？、より好ましくは０．１〜Ｉｇ／
ゴになるように塗布し、その反対側に前記多孔性支持体
を適宜な接着剤により貼合せ、乾燥することによりえら
れる。The heat-sensitive stencil paper of the present invention is prepared by dissolving the fixing agent in an appropriate solvent on one side of the thermoplastic synthetic resin film, and adding silicone resin fine particles to the solid content of the fixing agent solution per 100 parts by weight of the fine particles. is added to preferably 5 to 40 parts by weight, more preferably 10 to 20 parts by weight, and dispersed uniformly, and the resulting dispersion is coated in a dry coating amount of preferably 0.
．． 05~8g/rr? , more preferably 0.1 to Ig/
The porous support is applied on the opposite side with a suitable adhesive and dried.
シリコーン樹脂微粒子は固着剤溶液中に均一に分散させ
ることが必要であり、混合機としてたとえばディスパー
、コロイドミル、ホモジナイザーなどの高速混合機を用
いるのが好ましい。It is necessary to uniformly disperse the silicone resin particles in the fixing agent solution, and it is preferable to use a high-speed mixer such as a disper, colloid mill, or homogenizer.
またシリコーン樹脂微粒子の添加量は前記したように該
微粒子１００重量部に対して固着剤溶液の固形分５〜４
０重量部の割合が好ましく、シリコーン樹脂微粒子の添
加量が前記範囲より少ないと粒子間の面積が広くなり、
ドツト■の個数が少なく、インクの透過量が過少になり
、好ましくない。一方前記範囲より多いとサーマルヘッ
ドの熱エネルギーの伝達性がわるくなり、さらに穿孔が
ドツト形状にならず、好ましくない。なお該微粒子の添
加量は微粒子の粒径、分散状態、分散液の塗布量、サー
マルヘッドの熱量などに依存するものであり、したがっ
て前記の添加量は好ましい範囲の例示であって、これに
限定されるものではない。Further, the amount of silicone resin fine particles added is 5 to 4 parts by weight of the solid content of the fixing agent solution per 100 parts by weight of the fine particles.
A ratio of 0 parts by weight is preferable, and if the amount of silicone resin fine particles added is less than the above range, the area between the particles will increase,
The number of dots (3) is small, and the amount of ink permeation becomes too small, which is not preferable. On the other hand, if the amount exceeds the above range, the thermal energy transferability of the thermal head will deteriorate, and the perforations will not form a dot shape, which is not preferable. The amount of the fine particles added depends on the particle size of the fine particles, the dispersion state, the amount of dispersion applied, the heat amount of the thermal head, etc. Therefore, the amount added above is an example of a preferable range, and is not limited to this. It is not something that will be done.
さらに分散液塗布後のシリコーン樹脂微粒子が、第２図
に示されるごとく２次元的に均一に分散されていること
が必要であり、第３図に示されるように部分的に不均一
な分散状態が生じると印刷鮮明性が低下するので、好ま
しくない。Furthermore, it is necessary that the silicone resin fine particles after applying the dispersion liquid be uniformly dispersed two-dimensionally as shown in Fig. If this occurs, the print clarity will deteriorate, which is not preferable.
本発明においては、サーマルヘッドの加熱素子１個の面
積あたり、シリリコーン樹脂微粒子がｌＯ〜２０個程度
平面的に分布するようにするのが好ましい。In the present invention, it is preferable that about 10 to 20 silicone resin fine particles are distributed in a planar manner per area of one heating element of the thermal head.
つぎに実施例および比較例をあげて本発明を説明する。Next, the present invention will be explained with reference to Examples and Comparative Examples.
実施例１および比較例１〜２
平均粒径２μの球状シリコーン樹脂粉末１００部（重量
部、以下同様）、メトキシメチル化ポリアミド樹脂（メ
トキシメチル化率３０モル％）１０部およびメタノール
９０部をホモジナイザーにて高速回転により分散させて
固着剤分散液をえた。Example 1 and Comparative Examples 1 to 2 100 parts of spherical silicone resin powder with an average particle size of 2 μm (parts by weight, the same applies hereinafter), 10 parts of methoxymethylated polyamide resin (methoxymethylation rate 30 mol%), and 90 parts of methanol were mixed in a homogenizer. A fixing agent dispersion liquid was obtained by dispersing the mixture by high-speed rotation.
これを厚さ ２μの延伸ポリエステルフィルム（延伸倍
率がタテ、ヨコ方向とも約２００％のもの）に乾燥塗布
量が０．２ｇ／ｄになるように塗布し、その反対面に貼
合用接着剤として、酢酸ビニル樹脂の酢酸エチル２０％
溶液を塗布した後、１．５デニールのポリエステル繊維
からなる坪量１２ｇ／ゴ、厚さ４５μの多孔性支持体を
重ね貼合せ、７０℃で加熱乾燥して、感熱性孔版原紙を
えた。This was applied to a stretched polyester film with a thickness of 2 μm (stretching ratio of approximately 200% in both the vertical and horizontal directions) so that the dry coating amount was 0.2 g/d, and on the opposite side, adhesive for lamination was applied. As, vinyl acetate resin ethyl acetate 20%
After applying the solution, a porous support made of 1.5 denier polyester fibers with a basis weight of 12 g/g and a thickness of 45 μm was laminated and dried by heating at 70° C. to obtain a heat-sensitive stencil paper.
前記感熱性孔版原紙を、サーマルヘッドを備えた卓上型
ワードプロセッサー（シルバーリード■製デスクワード
）に装着してサーマルヘッドにより穿孔製版した。The heat-sensitive stencil paper was attached to a tabletop word processor (Deskword, manufactured by Silver Reed ■) equipped with a thermal head, and perforation was performed using the thermal head.
また比較のために、前記においてシリコーン樹脂微粒子
層を形成しなかったほかは前記と同様にして感熱性孔版
原紙を作製し、ついで前記と同一条件で穿孔製版をした
（比較例１）。For comparison, a heat-sensitive stencil paper was prepared in the same manner as above except that the silicone resin fine particle layer was not formed, and then perforated stencil making was carried out under the same conditions as above (Comparative Example 1).
さらに前記比較例１のフィルム表面に融着防止剤として
、シリコーンオイルを０．２ｇ／ｒｒ？の割合で塗布し
て同様の原紙をえ、同じ条件にて穿孔製版した（比較例
２）。Furthermore, 0.2 g/rr of silicone oil was added to the surface of the film of Comparative Example 1 as an anti-fusing agent. A similar base paper was obtained by applying the resin at a ratio of 1, and perforated plate making was performed under the same conditions (Comparative Example 2).
前記３種類の原紙について、ゲステラトナー社製輪転印
刷機４１７０型で、放電式電気記録謄写原紙用ゲステラ
トナーインク＃８４０を使用して印刷を行なった。Printing was carried out on the above three types of base paper using Gestellatner Ink #840 for electric discharge type mimeograph paper using a rotary printing press 4170 manufactured by Gestellatner.
その結果、シリコーン樹脂微粒子層をフィルム表面に設
けた原紙（実施例１）のばあいは、約７０枚／分の速度
で上質紙に印刷したところ、裏移りの無い鮮明な印刷物
かえられた。As a result, in the case of the base paper (Example 1) in which the silicone resin fine particle layer was provided on the film surface, when printing on high quality paper at a speed of about 70 sheets/min, clear prints with no set-off were obtained.
しかし、シリコーン樹脂微粒子層を設けない原紙（比較
例１）のばあいは、サーマルヘッドにフィルムが融着し
て穿孔を継続することが出来なかった。またシリコーン
オイルを塗布した原紙（比較例２）のばあいは、穿孔で
きたものの、印刷時の用紙の裏移りが多く、またインキ
のニジミも多かった。However, in the case of the base paper without the silicone resin fine particle layer (Comparative Example 1), the film was fused to the thermal head and the perforation could not be continued. In addition, in the case of the base paper coated with silicone oil (Comparative Example 2), although perforation was possible, there was a lot of set-off during printing, and there was also a lot of ink smearing.
実施例２
平均粒径５μのシリコーン樹脂微粒子５０部、脂肪酸ア
マイド１５部およびトルエン １００部をディスパーに
て約３時間分放湿合させて固着剤分散液をえた。Example 2 50 parts of silicone resin fine particles having an average particle size of 5 μm, 15 parts of fatty acid amide, and 100 parts of toluene were dehumidified in a disper for about 3 hours to obtain a fixing agent dispersion.
これを厚さ １．５μのポリエステルフィルムに乾燥塗
布量が０．５ｇ／ｆｆｌ’になるように塗布し、その反
対面に貼合用接着剤として、ポリエステル樹脂のトルエ
ン１８％溶液を塗布し、マニラ麻を主成分とする、坪ｍ
８．５ｇ／ｄ、厚さ３０μの多孔性薄葉紙を重ね合せ
、７０℃で加熱乾燥して感熱性孔版原紙をえた。This was applied to a polyester film with a thickness of 1.5μ so that the dry coating amount was 0.5g/ffl', and on the other side, an 18% solution of polyester resin in toluene was applied as a lamination adhesive. The main ingredient is Manila hemp.
Porous thin papers having a weight of 8.5 g/d and a thickness of 30 μm were layered and dried by heating at 70° C. to obtain a heat-sensitive stencil paper.
前記感熱性孔版原紙をライン型サーマルヘッドを備える
ビデオプリンター（日本アレフ■製ＵＡ ４５５型）に
装着し、穿孔製版を行なった。The heat-sensitive stencil paper was mounted on a video printer (UA 455 model, manufactured by Nippon Aleph) equipped with a line-type thermal head, and perforation was performed.
また比較のために、前述の比較例２の原紙を前記と同一
条件で穿孔製版した。For comparison, the base paper of Comparative Example 2 was perforated and made under the same conditions as above.
前記２種類の原紙について、ゲステラトナー社製輪転印
刷機４１７０型でタイプ手書き原紙用水性インク（アジ
ア原紙■製）を使用して印刷テストを行なった。A printing test was conducted on the two types of base paper using a type 4170 type rotary printing machine manufactured by Gestelatner using water-based ink for type handwritten base paper (manufactured by Asia Base Paper).
その結果、実施例２の原紙のばあいは、比較例２の原紙
に比べて、僅かに印刷濃度が低いものの、インクのニジ
ミがなく、きわめて鮮明な印刷物かえられた。As a result, in the case of the base paper of Example 2, although the print density was slightly lower than that of the base paper of Comparative Example 2, there was no ink smearing and extremely clear printed matter was obtained.
［発明の効果］
厚さが０．５〜５μの熱可塑性合成樹脂フィルムと多孔
性支持体とを貼合せてなる感熱性孔版原紙において、そ
のフィルム面に平均粒径１０μ以下のシリコーン樹脂微
粒子が均一に分散された層を設けたことによって、穿孔
製版時にサーマルヘッドとフィルムが直接に接触しない
ので、サーマルヘッドにフィルムの融着物が付着しない
とともに、シリコーン樹脂微粒子の存在によリサーマル
ヘッドのドツトより小さい孔が多く穿孔され、その結果
印刷時のインクの透過量が抑制されて、印刷用紙へのイ
ンクの過剰付着が防止され、鮮明度の高い印刷物かえら
れる。[Effect of the invention] In a heat-sensitive stencil paper formed by laminating a thermoplastic synthetic resin film with a thickness of 0.5 to 5 μm and a porous support, silicone resin fine particles with an average particle size of 10 μm or less are present on the film surface. By providing a uniformly dispersed layer, the thermal head and the film do not come into direct contact during perforation plate making, so there is no fusion of the film attached to the thermal head, and the presence of silicone resin particles prevents dots on the rethermal head. A large number of smaller holes are formed, and as a result, the amount of ink permeation during printing is suppressed, preventing excessive ink from adhering to the printing paper, and producing printed matter with high clarity.
第１図は本発明の一実施例による感熱性孔版原紙の穿孔
製版時の状態を示す概略説明図、第２図はシリコーン樹
脂微粒子の好ましい分布状態を示す平面図、第３図はシ
リコーン樹脂微粒子の好ましくない分布状態を示す平面
図である。
（図面の主要符号）
（１）：感熱性孔版原紙
（２）二合成樹脂フィルム
（３）：多孔性支持体
（６）：シリコーン樹脂微粒子FIG. 1 is a schematic explanatory diagram showing the state of a heat-sensitive stencil paper during perforation plate making according to an embodiment of the present invention, FIG. 2 is a plan view showing a preferred distribution state of silicone resin fine particles, and FIG. 3 is a plan view showing a preferable distribution state of silicone resin fine particles. FIG. 3 is a plan view showing an unfavorable distribution state of (Main symbols in the drawings) (1): Heat-sensitive stencil paper (2) Two-synthetic resin film (3): Porous support (6): Silicone resin fine particles
Claims (1)
多孔性支持体とを接着剤で貼合せてなる感熱性孔版原紙
において、該合成樹脂フィルムの表面に平均粒径１０μ
以下のシリコーン樹脂微粒子が分散固着されてなること
を特徴とする感熱性孔版原紙。1 In a heat-sensitive stencil paper made by laminating a thermoplastic synthetic resin film with a thickness of 0.5 to 5 μm and a porous support with an adhesive, particles with an average particle size of 10 μm are coated on the surface of the synthetic resin film.
A heat-sensitive stencil paper characterized in that the following silicone resin fine particles are dispersed and fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8136786A JPS62238792A (en) | 1986-04-09 | 1986-04-09 | Thermal stencil paper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8136786A JPS62238792A (en) | 1986-04-09 | 1986-04-09 | Thermal stencil paper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62238792A true JPS62238792A (en) | 1987-10-19 |
Family
ID=13744345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8136786A Pending JPS62238792A (en) | 1986-04-09 | 1986-04-09 | Thermal stencil paper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62238792A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01238992A (en) * | 1988-03-22 | 1989-09-25 | Asahi Chem Ind Co Ltd | Heat-sensitive stencil film and stencil paper |
| JPH02263694A (en) * | 1989-04-04 | 1990-10-26 | Diafoil Co Ltd | Film for thermal stencil printing base paper |
| US5303647A (en) * | 1992-05-27 | 1994-04-19 | Brother Kogyo Kabushiki Kaisha | Plate for stencil paper printing having a releasable film |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6140196A (en) * | 1984-07-31 | 1986-02-26 | Riso Kagaku Corp | Heat-sensitive stencil paper |
-
1986
- 1986-04-09 JP JP8136786A patent/JPS62238792A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6140196A (en) * | 1984-07-31 | 1986-02-26 | Riso Kagaku Corp | Heat-sensitive stencil paper |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01238992A (en) * | 1988-03-22 | 1989-09-25 | Asahi Chem Ind Co Ltd | Heat-sensitive stencil film and stencil paper |
| JPH02263694A (en) * | 1989-04-04 | 1990-10-26 | Diafoil Co Ltd | Film for thermal stencil printing base paper |
| US5303647A (en) * | 1992-05-27 | 1994-04-19 | Brother Kogyo Kabushiki Kaisha | Plate for stencil paper printing having a releasable film |
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