JPS62224995A - Manufacture of power module board - Google Patents
Manufacture of power module boardInfo
- Publication number
- JPS62224995A JPS62224995A JP6914586A JP6914586A JPS62224995A JP S62224995 A JPS62224995 A JP S62224995A JP 6914586 A JP6914586 A JP 6914586A JP 6914586 A JP6914586 A JP 6914586A JP S62224995 A JPS62224995 A JP S62224995A
- Authority
- JP
- Japan
- Prior art keywords
- copper plate
- tab
- copper
- molded
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 62
- 229910052802 copper Inorganic materials 0.000 claims description 62
- 239000010949 copper Substances 0.000 claims description 62
- 239000000758 substrate Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- 238000005530 etching Methods 0.000 claims description 15
- 238000007747 plating Methods 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 6
- 238000005304 joining Methods 0.000 claims description 3
- 239000011224 oxide ceramic Substances 0.000 description 19
- 229910052574 oxide ceramic Inorganic materials 0.000 description 19
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、パワーモジュール基盤の製造方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method for manufacturing a power module board.
さらに詳しくは、複数個の成形銅板がタブ部分により互
いに連結された形の成形銅板集合体を酸化物セラミック
ス基板に直接接合させ、接合後、該タブ部分を切り取る
事により、熱放散性に優れ、回路構成されたパワーモジ
ュール基盤を製造する方法を提供する事に関する。More specifically, a molded copper plate assembly in which a plurality of molded copper plates are connected to each other by tab portions is directly bonded to an oxide ceramic substrate, and after bonding, the tab portions are cut off, resulting in excellent heat dissipation. The present invention relates to providing a method for manufacturing a power module board having a circuit configuration.
［従来の技術］
従来のパワーモジュール基盤ｌｉｔ造方法では、酸化物
セラミックス基盤に、モリブデン又はタングステンをメ
タライズさせ、ニッケルメッキし、その後、ハンダ付け
を行ない銅の熱拡散板を接合させている。しかし、この
ような従来技術の方法では回路構成が比較的容易なため
、熱伝導度の悪いモリブデンおよびタングステンが用い
られ、放熱性に欠点があった。又、特開昭４９−１７３
８１号公報に詳細に述べられている様に、酸化物セラミ
ックスと銅どを直接接触させて・接合させる直接接合法
があるが、銅板を回路構成した時、多くの小さな要素に
分かれるため、酸化物セラミックス基盤上に精度よく配
置し、直接接合することは難しく、高コストとなる欠点
がある。さらに、酸化物セラミックス基盤の表面に銅を
メッキづるパワーモジコール基盤の製造方法があるが、
酸化物セラミックス基盤上の銅メッキの厚さが薄いため
、放熱性に劣り、熱を多量に発生する電子部品を搭載す
ると、故障の原因となる欠点があり、又、銅メッキを行
なうために、酸化物セラミックス基盤の表面処理が必要
となり、高コストどなる欠点がある。[Prior Art] In a conventional power module substrate LIT manufacturing method, an oxide ceramic substrate is metallized with molybdenum or tungsten, plated with nickel, and then soldered to join a copper thermal diffusion plate. However, since the circuit configuration is relatively easy in such prior art methods, molybdenum and tungsten, which have poor thermal conductivity, are used, which has a drawback in heat dissipation. Also, JP-A-49-173
As described in detail in Publication No. 81, there is a direct bonding method in which oxide ceramics and copper are brought into direct contact and bonded, but when a copper plate is configured into a circuit, it is divided into many small elements, so oxidation It is difficult to accurately arrange and bond directly onto a ceramic substrate, which has the drawback of high cost. Furthermore, there is a method for manufacturing a power modicoll board in which copper is plated on the surface of an oxide ceramic board.
Because the copper plating on the oxide ceramic substrate is thin, it has poor heat dissipation, and if electronic components that generate a large amount of heat are mounted, it may cause failure. It requires surface treatment of the oxide ceramic base, which has the drawback of high cost.
又、酸化物セラミックスＭ盤に接合された銅に、必要な
回路構成を行なう方法として、エツチングが考えられる
が、接合された銅が厚い場合、エツチングが表面から行
なわれていくため、第５図に示すごとく、レジストを塗
布した表面層と、酸化物セラミックスどの接合面に差が
生じ、精度のよい回路構成が行なえない欠点がある。In addition, etching can be considered as a method of forming the necessary circuit structure on the copper bonded to the oxide ceramic M board, but if the bonded copper is thick, etching will be performed from the surface, as shown in Figure 5. As shown in Fig. 2, there is a difference between the surface layer coated with resist and the bonding surface of the oxide ceramic, etc., which makes it difficult to form a circuit with high precision.
［発明が解決しようとＪる問題点］
本発明は、上述のごとき欠点がなく、しかも安価なパワ
ーモジコール基盤の製造方法を提供せんとするものであ
る。[Problems to be Solved by the Invention] The present invention aims to provide a method for manufacturing a power modicoll board that is free from the above-mentioned drawbacks and is inexpensive.
［問題点を解決するための手段］
本発明は、回路構成された要素となる銅板部分がタブ部
分でつなぎ合わされた形の複数の銅板の集合体をプレス
で成形加工してつくり、次に酸化物セラミックス基盤に
タブ部分が接触しない様にするため、プレスで成形加工
された成形銅板の回路構成された各要素部分だ【プをレ
ジストでおおい、露出したタブ部分を１ツヂングにより
各要素部分より薄くシ、次いでレジストを除去し、酸化
物セラミックス基盤上に精度よく配置して直接接合させ
た後、接合されずに残っているタブ部分を、カッターあ
るいはルータ等で除去することからなるパワーモジュー
ル基盤のＬｕ方法を提供せんとするものである。[Means for Solving the Problems] The present invention is made by forming an assembly of a plurality of copper plates with a press, in which the copper plate parts that are the elements of the circuit are connected by tab parts, and then oxidizing. In order to prevent the tab parts from coming into contact with the ceramic substrate, each element part of the circuit is made of a molded copper plate that is formed using a press. The power module board is made by thinly cutting it, then removing the resist, placing it with precision on the oxide ceramic board, directly bonding it, and then removing the tab portion that remains unbonded with a cutter or router. The purpose of this invention is to provide a Lu method.
回路構成された要素となる銅板部分がタブでつなぎ合わ
された状態の銅板集合体をプレスで成形加工してつくり
、酸化物セラミックス基盤上に精度よく配置し、直接接
合さゼる時、タブ部分と回路構成された各要素の銅板と
なる部分の厚さが同一であれば、タブ部分も接合され、
接合後タブ部分の除去が必要となる。そこで、タブ部分
を接合させないため、プレスで成形した銅板の回路構成
された各要素部分をレジストでおおい、タブ部分だけを
エツチングにより、板厚を、各要素より薄くし、レジス
トを除去したあと、酸化物セラミックス基盤上に精度よ
く配置し、直接接合させると、タブ部分は、回路構成さ
れた各要素部分の銅板より板厚が薄いので、酸化物セラ
ミックス基盤に接触しないため、接合せず、カッターあ
るいはルータ等で容易に除去出来る。タブ部分のエツチ
ングは、回路構成された各要素となる部分の成形銅板を
酸化物セラミックスＭ！２！上に精度よく配置して直接
接合を行う際に、タブ部分が酸化物セラミックス基盤に
接触しない程度であればよい。このようにエツチングの
程度を最小限に留めれば、エツチングによる銅板サイド
のアンダーカットが大きくならないので、成形銅板の板
厚が厚くても、精度よく回路構成された、パワーモジュ
ール基盤が製造出来る。The copper plate parts that form the elements of the circuit are formed by pressing a copper plate assembly in which they are connected by tabs, and when they are precisely placed on an oxide ceramic substrate and directly bonded, the tab parts and If the thickness of the copper plate part of each element in the circuit is the same, the tab part will also be joined,
After joining, the tab portion must be removed. Therefore, in order not to join the tab parts, each element part of the circuit structure of the press-formed copper plate was covered with resist, and only the tab part was etched to make the board thinner than each element, and after removing the resist, When placed accurately on the oxide ceramic substrate and directly bonded, the tab portion is thinner than the copper plate of each element part of the circuit, so it does not contact the oxide ceramic substrate, so it is not bonded and the cutter Alternatively, it can be easily removed using a router or the like. The etching of the tab part is done by using oxide ceramic M! 2! It is sufficient that the tab portion does not come into contact with the oxide ceramic substrate when the tab portion is precisely placed on the oxide ceramic substrate and directly bonded. If the degree of etching is kept to a minimum in this way, the undercut on the side of the copper plate due to etching will not become large, so even if the thickness of the molded copper plate is thick, a power module board with an accurate circuit configuration can be manufactured.
酸化物セラミックス基盤に直接接合される成形銅板部分
が厚くなるに従い、タブ部分の板厚を、切除可能な厚さ
にエツチングする必要性を生じる。As the portion of the formed copper plate directly bonded to the oxide ceramic substrate becomes thicker, it becomes necessary to etch the tab portion to a removable thickness.
しかし、厚さ方向に、一方向からのみエツチングを続け
ると、アンダーカットが著しくなり、垂直なエツジを呈
ざなくなる。そこで成形銅板の回路構成された各要素部
分をレジストでおおい、タブ部分を両面からエツチング
し、エツチングサイドのアンダーカットが著しくならな
い程度でエツチングを止め、レジストを除去し、酸化物
セラミックス基盤上に、精度良く配置し、直接接合を行
なえば、カッターおよびルータ等で、切除可能なタブ部
分の厚さが実用できる。パワーモジュール基盤に搭載さ
れる電子部品の消費電力が大きくなるに従い、酸化物セ
ラミックス基盤に直接接合させる成形銅板の板厚が厚＜
＜Ｋるので、タブ部分を両面からエツチングすることに
Ｊ：す、精度よく回路構成されたパワーモジュール基盤
を製造することができる。しかしながら、この方法によ
り、ざらに厚い成形銅板をエツチングしようとするとき
、エツチングサイドのアンダーカットが激しくなり、実
用的でない場合がある。そこで、上記製造方法により製
造されたパワーモジコール基盤の回路構成された成形銅
板部分の上に、銅メッキを施ツ事により、所定の厚さの
、アンダーカットの少ない成形銅板を得ることができ、
精度の良い、パワーモジュール基盤が製造出来る。この
場合、回路構成された各要素の中で、さらに厚くする必
要のない要素となる部分の成形銅板をレジストでおおう
事により、必要とり°る要素部分の成形銅板だけに銅メ
ッキを施す事も出来る。However, if etching is continued from only one direction in the thickness direction, undercuts become significant and vertical edges no longer appear. Therefore, each element part of the molded copper plate containing the circuit was covered with a resist, the tab part was etched from both sides, the etching was stopped to the extent that undercuts on the etched side did not become significant, the resist was removed, and the etching was done on an oxide ceramic substrate. If placed accurately and bonded directly, the thickness of the tab portion can be cut out with a cutter, router, etc. for practical purposes. As the power consumption of electronic components mounted on power module boards increases, the thickness of the molded copper plate directly bonded to the oxide ceramic board is increasing.
Therefore, by etching the tab portion from both sides, it is possible to manufacture a power module board with a highly accurate circuit configuration. However, when attempting to etch a relatively thick molded copper plate using this method, the undercut on the etched side becomes severe, which may be impractical. Therefore, by applying copper plating to the circuit-configured molded copper plate portion of the Power Mogicor board manufactured by the above manufacturing method, it is possible to obtain a molded copper plate with a predetermined thickness and less undercuts. ,
It is possible to manufacture power module boards with high precision. In this case, by covering the molded copper plates of the elements that do not need to be thicker with resist among the elements in the circuit, it is also possible to apply copper plating only to the parts of the molded copper plates that are necessary. I can do it.
［実施例 １］
第１図に示すように、回路構成された銅板がタブで接続
された形の連結体をプレスで成形加工してつくった。タ
ブ部分以外の銅板表面にレジストを塗布し、乾燥後、塩
化第二鉄溶液の中に１０分間浸せきした。水洗い後、レ
ジストを除去し、水洗、乾燥後アルミナＩＩ＜９６％Ａ
ｆＪ２０３〉に上記銅板を載せて、１０６５℃で５分間
、酸素８１度２１）ｌ’１ｌｌｌの雰囲気中で加熱し、
銅板どセラミックス基盤を直接接合させた。タブ部分と
回路構成された銅板部分との境界をカッターで切断した
。切断したときの銅板の断面形状を第３図に示す。銅板
表面はレジストが塗布されているが、エツチング時のサ
イドエッチによりアンダーカッ１〜が発生していた。[Example 1] As shown in FIG. 1, a connected body in which copper plates having a circuit configuration were connected by tabs was formed by press forming. A resist was applied to the surface of the copper plate other than the tab portion, and after drying, it was immersed in a ferric chloride solution for 10 minutes. After washing with water, remove the resist, wash with water, and after drying, alumina II < 96% A
The above copper plate was placed on 1065°C for 5 minutes in an oxygen atmosphere of 81°C (21) l'1lll,
The copper plate and ceramic base were directly bonded. A cutter was used to cut the boundary between the tab portion and the copper plate portion where the circuit was configured. Figure 3 shows the cross-sectional shape of the copper plate when cut. Although a resist was applied to the surface of the copper plate, undercuts 1 to 1 were generated due to side etching during etching.
しかし、カッターで切削した断面はアルミナ１１％に対
して、直角に切断されており、精度的には問題はない製
品であった。However, the cross section cut with the cutter was cut at right angles to the 11% alumina, so there was no problem with the accuracy of the product.
［実施例 ２］
実施例１と同様の手順で同様の銅−アルミナ基盤接合体
を作成した。タブ部分を切削して良好な接合体を得た後
レジストを銅板の表面部以外に塗布して乾燥させ、銅メ
ッキを施し、銅板上に所望のメッキ層を形成させた。メ
ッキ終了後、レジストを除去した。この時の断面を第４
図に六す。図から理解出来る様に、タブ部分のエツチン
グ時に形成されたアンダーツコツトが若干残っている。[Example 2] A similar copper-alumina substrate bonded body was created using the same procedure as in Example 1. After cutting the tab portion to obtain a good bonded body, resist was applied to areas other than the surface of the copper plate, dried, and copper plated to form a desired plating layer on the copper plate. After plating was completed, the resist was removed. The cross section at this time is the fourth
Figure 6 shows this. As can be seen from the figure, some undercuts formed during etching of the tab remain.
又、メッキ層の断面もかならずしも垂直ではない。しか
し銅板と銅板のギャップが設甜仕様内に入っており、パ
ワーモジュール基盤としての使用に問題はない製品であ
った。この方法によれば、メッキにより、最終の板厚を
所望の厚さに仕上げる事が可能である。Furthermore, the cross section of the plating layer is not necessarily vertical. However, the gap between the copper plates was within the design specifications, so there was no problem in using the product as a power module board. According to this method, it is possible to finish the final plate thickness to a desired thickness by plating.
［比較例 １］
第１図に示した回路構成された銅板のギャップにタブ部
分を設けず、連続した一枚の銅板をアルミナ基盤に直接
接合させ、回路構成された銅板に相当する面積に、レジ
ストを塗布し、乾燥後、エツチングによりギャップを作
成した。この時の基盤の断面図を第５図に示す。サイド
エッチが激しく、銅板表面近傍のギャップはかなり大き
くなり、このため銅板表面の面積が小さくなり電子部品
の搭載が難かしい製品となった。[Comparative Example 1] A continuous copper plate was directly bonded to the alumina substrate without providing a tab part in the gap of the copper plate with the circuit structure shown in Fig. 1, and the area corresponding to the copper plate with the circuit structure was A resist was applied, and after drying, a gap was created by etching. A cross-sectional view of the base plate at this time is shown in FIG. The side etching was severe, and the gap near the surface of the copper plate became quite large.As a result, the surface area of the copper plate became small, making it difficult to mount electronic components on the product.
［発明の効果］
上記のごとき本発明の方法によって製造したパー ８
＝
ワーモジコール基盤は、成形銅板より薄いタブ部分で複
数個の成形銅板が互いに連結された形のよ）酸化物セラ
ミックス接合体に直接ｉ斉合された後タブを切除してつ
くられるものであるため、低コス１〜で回路構成された
要素を粘度よく配置出来、厚い銅板を接合体どして形成
出来るため、熱放散性の優れた製品どして１ｑることが
できる。[Effect of the invention] Par 8 produced by the method of the present invention as described above
= The Warmodycol base is made by directly aligning the oxide ceramic bonded body (which has a shape in which multiple molded copper plates are connected to each other with a tab part that is thinner than the molded copper plate) and then cutting out the tab. Since it is possible to arrange circuit elements with good viscosity at a low cost of 1~, and can be formed by joining thick copper plates, it is possible to make a product with excellent heat dissipation performance of 1q.
第１図は本発明で用いる回路構成された銅板２枚がタブ
部分で連結された形の銅板集合体を表わず。
第２図はアルミナ基盤に、エツチングされたタブ部分で
連結されている成形銅板集合体を直接接合した時の断面
図を表わす。
第３図は接合した銅板のタブ部分をカッターで切除した
後の断面図を表わず。
第４図は接合した銅板の表面にメッキを施した後の断面
図を表ねり。
第５図は本発明の方法によらずにエツチングを行なった
場合の銅−セラミックス接合体の断面図を表わす。
図中の参照番号は次のものを表ね寸。
１・・・回路構成された銅板
２・・・タ ブ ３・・・アルミナ基盤４・
・・メッキ層FIG. 1 does not show a copper plate assembly in which two copper plates having a circuit structure used in the present invention are connected by a tab portion. FIG. 2 shows a cross-sectional view of a molded copper plate assembly connected by etched tabs directly bonded to an alumina substrate. Figure 3 does not show a cross-sectional view after the tab portion of the joined copper plates is cut out with a cutter. Figure 4 shows a cross-sectional view after plating has been applied to the surface of the joined copper plates. FIG. 5 shows a cross-sectional view of a copper-ceramic bonded body which was etched without using the method of the present invention. The reference numbers in the diagram indicate the following dimensions. 1...Copper plate with circuit configuration 2...Tab 3...Alumina base 4.
・Plating layer
Claims (4)
ブ部分により互いに連結された形の成形銅板集合体をつ
くり、該集合体のタブ部分以外の部分をレジストで覆っ
てエッチングすることにより、タブ部分がタブ以外の部
分の成形銅板より薄くなるように処理した後レジストを
除去して前記集合体をセラミックス基板上に位置精度よ
く配置して成形銅板とセラミックス基板とを直接接合さ
せ、接合後にタブ部分を切除することを特徴とするパワ
ーモジュール基盤の製造方法。(1) Creating a molded copper plate assembly in which a plurality of molded copper plates are connected to each other by tab portions from one continuous copper plate, and covering the parts of the assembly other than the tab portions with resist and etching. After treating the tab portion to be thinner than the portion of the molded copper plate other than the tab, the resist is removed and the assembly is placed on the ceramic substrate with good positional accuracy to directly bond the molded copper plate and the ceramic substrate, A method for manufacturing a power module board, characterized in that a tab portion is removed after joining.
する特許請求の範囲第１項に記載の方法。(2) The method according to claim 1, characterized in that the tab is etched from both sides.
特徴とする特許請求の範囲第１〜２項のいずれかに記載
の方法。(3) The method according to any one of claims 1 to 2, characterized in that the surfaces of the bonded formed copper plates are plated.
面だけにメッキを施すことを特徴とする特許請求の範囲
第３項に記載の方法。(4) The method according to claim 3, wherein plating is applied only to the surface of a specific formed copper plate among the bonded formed copper plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6914586A JPS62224995A (en) | 1986-03-27 | 1986-03-27 | Manufacture of power module board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6914586A JPS62224995A (en) | 1986-03-27 | 1986-03-27 | Manufacture of power module board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62224995A true JPS62224995A (en) | 1987-10-02 |
| JPH0423432B2 JPH0423432B2 (en) | 1992-04-22 |
Family
ID=13394193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6914586A Granted JPS62224995A (en) | 1986-03-27 | 1986-03-27 | Manufacture of power module board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62224995A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01161892A (en) * | 1987-12-18 | 1989-06-26 | Toshiba Corp | Ceramics circuit board and its manufacture |
| JP2008045218A (en) * | 2007-10-01 | 2008-02-28 | Dowa Holdings Co Ltd | Plating method and patterning method on metal-ceramic composite member, wet treatment apparatus and metal-ceramic composite member for power module |
| WO2018110104A1 (en) * | 2016-12-16 | 2018-06-21 | Ｊｘ金属株式会社 | Metal plate for circuit board, circuit board, power module, metal plate molded article, method for manufacturing circuit board |
-
1986
- 1986-03-27 JP JP6914586A patent/JPS62224995A/en active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01161892A (en) * | 1987-12-18 | 1989-06-26 | Toshiba Corp | Ceramics circuit board and its manufacture |
| JP2008045218A (en) * | 2007-10-01 | 2008-02-28 | Dowa Holdings Co Ltd | Plating method and patterning method on metal-ceramic composite member, wet treatment apparatus and metal-ceramic composite member for power module |
| WO2018110104A1 (en) * | 2016-12-16 | 2018-06-21 | Ｊｘ金属株式会社 | Metal plate for circuit board, circuit board, power module, metal plate molded article, method for manufacturing circuit board |
| JP2018098467A (en) * | 2016-12-16 | 2018-06-21 | Ｊｘ金属株式会社 | Circuit board metal plate, circuit board, power module, metal plate molded component and circuit board manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0423432B2 (en) | 1992-04-22 |
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