JPS5930548Y2 - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS5930548Y2 JPS5930548Y2 JP3600580U JP3600580U JPS5930548Y2 JP S5930548 Y2 JPS5930548 Y2 JP S5930548Y2 JP 3600580 U JP3600580 U JP 3600580U JP 3600580 U JP3600580 U JP 3600580U JP S5930548 Y2 JPS5930548 Y2 JP S5930548Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- conductor layer
- mounting hole
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【考案の詳細な説明】
本案は各種電気部品を取付は半田付けするための印刷配
線板に係り、簡単な構成で導体層間を相当接近させた場
合でも半田のブリッジによる短絡状態を防止できる優れ
た印刷配線板を提供することを目的とするもので゛ある
。[Detailed description of the invention] This invention relates to a printed wiring board for mounting and soldering various electrical components, and has a simple structure that prevents short circuits caused by solder bridges even when conductor layers are brought very close together. The purpose is to provide printed wiring boards.
一般に使用されている印刷配線板はいずれも第１図、第
２図に示すように絶縁基板１の表面に単にフラットな導
体層２を形成し、この導体層２の中央部に取付孔３を形
威しただけのものである。All commonly used printed wiring boards simply form a flat conductor layer 2 on the surface of an insulating substrate 1, as shown in FIGS. 1 and 2, and a mounting hole 3 is formed in the center of this conductor layer 2. It's just a formality.
したがって、この種のものでは導体層２が互に接近して
いる場合、取付孔３に各端子４を挿入し、半田付けする
と互に隣合う導体層２間で半田５がブリッジ状に接なが
ることがあり、隣合う導体層２間が第１図、第２図に示
すように互に短絡するという問題があった。Therefore, in this type of device, if the conductor layers 2 are close to each other, when each terminal 4 is inserted into the mounting hole 3 and soldered, the solder 5 will form a bridge-like connection between the adjacent conductor layers 2. There was a problem in that adjacent conductor layers 2 were short-circuited to each other as shown in FIGS. 1 and 2.
特にスライドスイッチや集積回路のように複数の端子が
互に接近して存在する電気部品を取付けるための印刷配
線板では、このような問題が多く発生する可能性があり
、また、この種の印刷配線板では個々の導体層が必然的
に小さくなり、半田の付着量が少なくなることとあいま
ってトンネル不良や機械的強度の不定等を招く可能性が
あり、実用上多くの問題を有している。This type of problem can occur particularly with printed circuit boards used to mount electrical components such as slide switches and integrated circuits, which have multiple terminals located close to each other. In wiring boards, the individual conductor layers inevitably become smaller, which, combined with a reduced amount of solder adhesion, can lead to poor tunneling and unstable mechanical strength, which poses many practical problems. There is.
本案は以上のような従来の欠点を除去するものであり、
簡単な構成で、これらの問題点を解決できる優れた印刷
配線板を提供するものである。This proposal eliminates the above-mentioned conventional drawbacks,
The present invention provides an excellent printed wiring board that can solve these problems with a simple configuration.
以下、本案の印刷配線板について一実施例の図面ととも
に説明する。Hereinafter, the printed wiring board of the present invention will be explained with reference to drawings of one embodiment.
第２図、第３図は本案の印刷配線板における一実施例の
上面図及び断側面図であり、図中６は紙圧ノール、紙エ
ポキシ、ガラスエポキシ等の材料で構成された絶縁基板
、７は絶縁基板６の表面にエツチング等によって形成さ
れた導体層、８は導体層７の中央部に絶縁基板６を含め
て貫通するように形威された取付孔である。2 and 3 are a top view and a cross-sectional side view of one embodiment of the printed wiring board of the present invention, and 6 in the figure shows an insulating substrate made of materials such as paper pressure glue, paper epoxy, glass epoxy, etc. 7 is a conductor layer formed on the surface of the insulating substrate 6 by etching or the like, and 8 is a mounting hole formed in the center of the conductor layer 7 so as to penetrate through the insulating substrate 6.
尚、導体層７は中央部が外周部より凹むようにすりばち
状に形成されており、その表面には中央部に行くにした
がって幅が広くなり、かく深さが深くなる複数本の凹溝
９が放射状に形成されている。The conductor layer 7 is formed in a concave shape so that the center part is recessed from the outer circumferential part, and the surface thereof has a plurality of grooves 9 that become wider and deeper toward the center part. are formed radially.
本案は上記実施例より明らかなように、中央部に取付孔
を有する導体層をすりばち状に形威し、その表面に複数
の凹溝を放射状に形成したものであり、取付孔に端子を
挿入して半田付けした場合半田が導体層によくなじみそ
の取付強度がきわめて向上するという利点を有する。As is clear from the above embodiment, the present invention has a conductor layer with a mounting hole in the center shaped like a dovetail, and a plurality of grooves are formed radially on the surface of the conductor layer, and the terminal is inserted into the mounting hole. When soldered, the solder blends well with the conductor layer, and has the advantage that its attachment strength is greatly improved.
そして放射状に形成された凹溝は付着した半田を導体層
の中央部に効果的に集中させる作用をなすため、半田が
隣合う導体層間でブリッジ状に接がるようなこともほと
んどなく、実用上きわめて有利なものである。The radially formed concave grooves effectively concentrate the adhered solder in the center of the conductor layer, so there is almost no chance of solder connecting in the form of a bridge between adjacent conductor layers, making it practical for practical use. This is extremely advantageous.
尚、導体層をすりばち状にし、その表面に複数の凹溝を
形成する方法として取付孔を打抜き加工する際に同時に
プレス等の方法により形成することが考えられる。In addition, as a method of forming the conductor layer into a dome shape and forming a plurality of grooves on the surface thereof, it is possible to form the attachment holes by a method such as pressing at the same time as punching the attachment holes.
この場合にはプレス加工によって導体層の中央部が一部
第３図、第４図に示すように取付孔８内に突出するよう
になるため、取付孔８に端子を挿入した場合両者間の隙
間が小さくなり、より半田の付着が強固になるという利
点を有する。In this case, the center part of the conductor layer partially protrudes into the mounting hole 8 due to press working as shown in FIGS. 3 and 4, so when the terminal is inserted into the mounting hole 8, This has the advantage that the gap becomes smaller and the solder adhesion becomes stronger.
また、実施例では、導体層のみをすりばち状に形成した
が第５図に示すように絶縁基板６を含めてすりばち状に
形成することも可能である。Further, in the embodiment, only the conductor layer is formed in a conical shape, but it is also possible to form it in a conical manner including the insulating substrate 6, as shown in FIG.
第１図は従来の印刷配線板の上面図、第２図は同印刷配
線板の断側面図、第３図は本案の印刷配線板における一
実施例の上面図、第４図は同実施例の断側面図、第５図
は他の実施例の断側面図である。
６・・・・・・絶縁基板、７・・・・・・導体層、８・
・・・・・取付孔、９・・・・・・凹溝。Figure 1 is a top view of a conventional printed wiring board, Figure 2 is a cross-sectional side view of the same printed wiring board, Figure 3 is a top view of an embodiment of the printed wiring board of the present invention, and Figure 4 is the same embodiment. FIG. 5 is a cross-sectional side view of another embodiment. 6... Insulating substrate, 7... Conductor layer, 8...
...Mounting hole, 9...Concave groove.
Claims (1)
々に凹むようにすりばち状に形威し、その表面に放射状
に複数の凹溝を形威して戒る印刷配線板。A printed wiring board in which a conductor layer having a mounting hole in the center is formed into a concave shape so that the center part is gradually recessed from the outer periphery, and a plurality of grooves are formed radially on the surface of the conductor layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3600580U JPS5930548Y2 (en) | 1980-03-19 | 1980-03-19 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3600580U JPS5930548Y2 (en) | 1980-03-19 | 1980-03-19 | printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56139267U JPS56139267U (en) | 1981-10-21 |
| JPS5930548Y2 true JPS5930548Y2 (en) | 1984-08-31 |
Family
ID=29631619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3600580U Expired JPS5930548Y2 (en) | 1980-03-19 | 1980-03-19 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5930548Y2 (en) |
-
1980
- 1980-03-19 JP JP3600580U patent/JPS5930548Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56139267U (en) | 1981-10-21 |
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