JPS62202099A - Plating device for printed circuit board - Google Patents
Plating device for printed circuit boardInfo
- Publication number
- JPS62202099A JPS62202099A JP4364986A JP4364986A JPS62202099A JP S62202099 A JPS62202099 A JP S62202099A JP 4364986 A JP4364986 A JP 4364986A JP 4364986 A JP4364986 A JP 4364986A JP S62202099 A JPS62202099 A JP S62202099A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- plating
- bubbling
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 80
- 230000005587 bubbling Effects 0.000 claims abstract description 27
- 238000003756 stirring Methods 0.000 claims abstract description 10
- 238000009713 electroplating Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 abstract description 7
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910021645 metal ion Inorganic materials 0.000 description 5
- 238000005192 partition Methods 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000007257 malfunction Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 235000011962 puddings Nutrition 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003411 electrode reaction Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910000372 mercury(II) sulfate Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明はプリント基板のメッキ装置に係り、特に、多数
のスルーホールを有するプリント基板に適用するのに最
適なプリント基板のメッキ装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a printed circuit board plating apparatus, and particularly to a printed circuit board plating apparatus that is most suitable for application to a printed circuit board having a large number of through holes.
電子機器等に用いられるプリント基板は、両面又は多層
にプリント基板を設けた場合、両面又は多層間の回路は
スルーホールを用いて接続されるが、このスルーホール
内のメッキは、電子回路の誤動作や不動作を防止するた
めには確実且つ十分に行なわていることが要求される。When printed circuit boards used in electronic devices are provided with double-sided or multilayer printed circuit boards, circuits between both sides or between the layers are connected using through holes, but plating inside these through holes may cause malfunction of the electronic circuit. In order to prevent malfunctions and malfunctions, it is necessary to perform them reliably and sufficiently.
特に、スルーホールのメツキネ良は外部から識別するこ
とが難しく、部品等を装着した後ではチェックの方法が
無いため、充分なメッキを事前に施すことは極めて重要
である。In particular, it is difficult to identify whether the through-hole is defective from the outside and there is no way to check it after parts have been installed, so it is extremely important to apply sufficient plating in advance.
近年、プリント基板に対する需要が広範囲になり、且つ
経済性、信願性にイ）れた高密度で高精度のプリント基
板が要求されている。例えば、高密度化に対しては、ア
スペクト比（プリント基板の厚さ／スルーホール径）が
従来の１〜２に対し、５或いは１０程度の高アスペクト
比を有する基板が要求されている。このような極めて小
径のスルーボール内部をメッキする方法としては、無電
解による化学メッキがある。かかる、化学メッキでは、
数１０μＩｎのメッキ厚を得るためには長時間を要する
ことから、最初にスルーホール内部の絶縁部に無電解メ
ッキによって約０．５μｍの厚さにし、その後に電気メ
ッキで約３５μｍの厚さにする処理が施されている。し
かし、スルーホールの径が極めて小さいため、メッキ液
の供給が不十分となり、メッキ厚が不均一になるという
問題がある。In recent years, demand for printed circuit boards has become widespread, and high-density, high-precision printed circuit boards that are economical and reliable are required. For example, in order to achieve high density, a substrate having a high aspect ratio (printed circuit board thickness/through hole diameter) of about 5 or 10 is required, compared to the conventional 1 to 2. Electroless chemical plating is a method for plating the inside of such an extremely small diameter through ball. In chemical plating,
Since it takes a long time to obtain a plating thickness of several tens of microns, the insulating part inside the through hole was first plated to a thickness of approximately 0.5 μm by electroless plating, and then electroplated to a thickness of approximately 35 μm. It has been processed to However, since the diameter of the through-hole is extremely small, there is a problem in that the plating solution is insufficiently supplied and the plating thickness becomes uneven.
また、電気メッキを高速化し、量産性を高めるためには
、電流密度を大きくすることによって達成されるが、メ
ッキ反応（電極反応）においては限界電流密度があるた
め、この値以上に大きくすることができない。この限界
電流密度は電解条件によって変わることから、最適電解
条件を選定し、限界電流密度を大きくしてやることによ
り、高速化を図ることができる。電気メツキ反応におけ
る限界電流密度ｉｄは、金属イオンの拡散に基づく濃度
分極によって決り、次式で表わされる。In addition, speeding up electroplating and increasing mass productivity can be achieved by increasing the current density, but since there is a limiting current density in plating reactions (electrode reactions), it is necessary to increase the current density beyond this value. I can't. Since this limiting current density changes depending on the electrolytic conditions, speeding up can be achieved by selecting optimal electrolytic conditions and increasing the limiting current density. The limiting current density id in the electroplating reaction is determined by concentration polarization based on the diffusion of metal ions, and is expressed by the following equation.
１ｄ＝ｎＸＦＸＤＸＣ／δ
但し、
ｎ：金属イオンの荷電Ｂ （ｅ ｑ ｕ ｉ ｖ／ｍｏ
Ｉ）Ｆ：ファラデ一定数 （Ｃｏｕｌ／ｅｑｕｉｖ）
Ｄ：金属イオンの拡ｉ１シ係Ｂ （ｃｕｔ／ ｓ ｅ
ｃ ）Ｃ：バルクの金属イオン濃度（ｍ、ｏｌ／ｃ＋ｄ
）δ：拡散層の厚さく ｃｍ ）
前記の式より明らかなように、限界電流密度Ｉｄを大き
くするためには、Ｃを大きくするか、もしくはδを小さ
くすることによって実現できる６Ｃはメッキ液中の金属
イオンが上限に設定されているので、変えることはでき
ず、δのみを小さくすることが可能である。このδはメ
ッキ液を攪拌することによって実現できる。1d=nXFXDXC/δ However, n: Charge B of metal ion (e q u i v/mo
I) F: Farade constant number (Coul/equiv)
D: Metal ion expansion agent B (cut/s e
c) C: Bulk metal ion concentration (m, ol/c+d
) δ: Thickness of the diffusion layer (cm) As is clear from the above equation, in order to increase the critical current density Id, 6C can be achieved by increasing C or decreasing δ. Since the metal ion of is set as the upper limit, it cannot be changed, and only δ can be reduced. This δ can be achieved by stirring the plating solution.
この問題及び前記メ、 ＝ｌ＝ ｌゾの不均一の問題を
解決するため、従来、メッキ液の攪拌にバブリング装置
がメッキ装置に用いられる。第６図は従来のメッキ装置
で、図に示すようにメッキ電解槽１０には調整した酸性
硫酸銅液（ＣｕＳＯ４７５ｇ／Ｎ、ＨｇＳＯ４を１９０
ｇ／６、その他の添加剤）等によるメッキ液１２が満さ
れ、電解槽１０の中央にプリント基板１４がメッキ液１
２に浸され、クランプ冶具１６によって係止される。又
、基板１４はクランプ治具１６を介して電源１８の陰極
に接続される。一方、糟１０内の両側面の付近にチタン
ハスケソＩ−で形成され銅ポールが挿入される陽極板２
０が設けられ、電源１８に接続される。これにより、電
流が陽極板２０からプリント基板１４に流れ、プリント
基板１４が電気メッキされる。又、この時に槽１０の底
面に設けたバブリング攪拌装置２２によってメッキ液は
攪拌される。In order to solve this problem and the above-mentioned non-uniformity problem, a bubbling device is conventionally used in a plating apparatus to stir the plating solution. Figure 6 shows a conventional plating apparatus, and as shown in the figure, the plating electrolytic bath 10 contains a prepared acidic copper sulfate solution (CuSO475g/N, HgSO4 190g/N).
A printed circuit board 14 is placed in the center of the electrolytic bath 10, and a printed circuit board 14 is placed in the center of the electrolytic bath 10.
2 and is locked by a clamp jig 16. Further, the substrate 14 is connected to the cathode of a power source 18 via a clamp jig 16. On the other hand, an anode plate 2 formed of titanium Hasukeso I- and having copper poles inserted near both sides of the anode 10
0 is provided and connected to the power supply 18. As a result, current flows from the anode plate 20 to the printed circuit board 14, and the printed circuit board 14 is electroplated. Further, at this time, the plating solution is stirred by a bubbling stirring device 22 provided at the bottom of the tank 10.
又、プリント基板１４は、第７図に示すように、エポキ
シ樹脂等を用いた絶縁板２４ （内部に銅７ｆｊ２６が
多層に形成されている）にスルーホール２８が形成され
、その外表面及びスルーホール２８内には化学銅メッキ
層３０が施され、更に、該メッキ層３０の表面に電気銅
メッート層３２が施される。Further, as shown in FIG. 7, the printed circuit board 14 has a through hole 28 formed in an insulating plate 24 made of epoxy resin or the like (with copper 7fj26 formed in multiple layers inside), and the outer surface and through hole 28 are A chemical copper plating layer 30 is applied within the hole 28, and an electrolytic copper met layer 32 is further applied on the surface of the plating layer 30.
しかしながら、単純なエアバブリング方式による前記メ
ッキ装置による場合には、スルーホール２８内のメッキ
厚は、化学銅メッキ層３０が一定であるのに対し、電気
銅メッキ層３２は、メッキ液の移動が小さいいため、第
７図に示すようにスルーホール２８のエツジ部にメッキ
が集中し、厚みが不均一になる。又、プリント基板に垂
直あるいは斜め方向から高速水流を噴射したり、プリン
ト基板に機械的振動を加え、槽内でプリント基板を揺動
させたり、槽内で題名波振動を発生させ、プリント基板
の表面の液を振動させたりしても不具合は解消されない
。However, in the case of the plating apparatus using a simple air bubbling method, the plating thickness in the through hole 28 is constant for the chemical copper plating layer 30, whereas the electrolytic copper plating layer 32 has a constant plating thickness. Because of the small size, the plating concentrates on the edges of the through holes 28, as shown in FIG. 7, resulting in non-uniform thickness. In addition, high-speed water jets are jetted vertically or diagonally onto the printed circuit board, mechanical vibrations are applied to the printed circuit board, the printed circuit board is swayed in the tank, and title wave vibrations are generated in the tank to cause the printed circuit board to move. Even if you vibrate the liquid on the surface, the problem will not be resolved.
本発明は、このような事情に鑑みてなされたもので、ス
ルーホール内のメソ；）−を均一に且つ高速に行なうこ
とのできるプリント基板のメ７・キ装置を提案すること
を目ｎ勺としている。The present invention has been made in view of the above circumstances, and an object of the present invention is to propose a printed circuit board mechanical device that can uniformly and rapidly perform meso-coating in through-holes. It is said that
〔発明の４既要〕
本発明は前記目的を達成する為に、メッキ槽のメッキ液
中にプリン）５板を浸して直流電圧を印加し、電気メッ
キを施すプリント基板のメッキ装置に於いて、前記メッ
キ槽内のプリント基板の下方に配置され、プリン１一基
板を境界面とする両側のメッキ’ｔ（７ｊ、を交互にガ
スでバブリング攪拌するバブリング装置を設けたことを
特徴とする。[4 Summary of the Invention] In order to achieve the above-mentioned object, the present invention provides a printed circuit board plating apparatus in which a pudding board is immersed in a plating solution in a plating tank and subjected to electroplating by applying a DC voltage. , a bubbling device is disposed below the printed circuit board in the plating tank and alternately bubbles and stirs the plating 't(7j) on both sides with the printed circuit board 1 and the board as the boundary surface.
以下、添付図面に従って本発明に係るプリント基板のメ
ッキ装置の好ましい実施例を詳説する。Hereinafter, preferred embodiments of a printed circuit board plating apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
第１図は本発明に係るメッキ装置の斜視図である。第１
図に示すようにメッキ装置は長形状のメッキ槽４０から
なり、メッキ槽４０はその上部４０Δの一部か開口され
ている。メッキ槽４０内にはメッキ液１２に浸されたプ
リント基板１４が配置され、プリント基板１４はメッキ
槽４０の開口４２から挿入され、クランプ１６の下端に
吊り下げられている。クランプ１６の上端は移動コンベ
ア４４に保持され、コンヘア４４はメッキ槽４０の」こ
方長手方向に配設されるレール４６上に移動可能に保持
されている。これにより、プリント基板はクランプ１６
に吊り下げられた状態でメッキ槽４０内を長手方向に沿
って矢印の方向に移動する。FIG. 1 is a perspective view of a plating apparatus according to the present invention. 1st
As shown in the figure, the plating apparatus consists of an elongated plating tank 40, and a part of the upper part 40Δ of the plating tank 40 is opened. A printed circuit board 14 immersed in the plating solution 12 is placed in the plating tank 40 , and the printed circuit board 14 is inserted through the opening 42 of the plating tank 40 and suspended from the lower end of the clamp 16 . The upper end of the clamp 16 is held by a moving conveyor 44, and the conveyor 44 is movably held on a rail 46 disposed in the longitudinal direction of the plating tank 40. As a result, the printed circuit board is secured to the clamp 16.
It moves in the direction of the arrow along the longitudinal direction within the plating tank 40 while being suspended.
第１図及び第２図に示すようにメッキ液１２中のプリン
ト基板１４の両側には、チタンハスケソト２０．２０が
配置されバスケット２０内には図示しない銅ボールが収
納されている。バスケット２０は電源１８に接続され、
バスケット２０内の消ボールはバスケット２０と共に陽
極に荷電される。またメッキ槽４０の上面４０Ａの所定
間隔にはバスケット２０内に銅ボールを供給するだめの
補給口５２が形成される。一方、移動コンベア４４の下
方には一定間隔にカーボンブラシ５４が設けられ、カー
ボンブラシ５４は電源１８の陰極に接続される。プリン
ト基板１４のクランプ１６は移動に際してカーボンブラ
シ５４と摺接し、この摺接によってクランプ１６を介し
てプリント基板１４が電源１８の陰極に通電される。こ
のようにプリント基板１４は移動可能な状ｆフで通電さ
れ、プリント基板１４にはメッキが施される。As shown in FIGS. 1 and 2, titanium metal plates 20 and 20 are arranged on both sides of the printed circuit board 14 in the plating solution 12, and copper balls (not shown) are housed in the basket 20. Basket 20 is connected to power source 18;
The erased balls in the basket 20 are positively charged together with the basket 20. Furthermore, supply ports 52 for supplying copper balls into the basket 20 are formed at predetermined intervals on the upper surface 40A of the plating tank 40. On the other hand, carbon brushes 54 are provided below the moving conveyor 44 at regular intervals, and the carbon brushes 54 are connected to the cathode of the power source 18. The clamp 16 of the printed circuit board 14 comes into sliding contact with the carbon brush 54 during movement, and due to this sliding contact, the printed circuit board 14 is energized via the clamp 16 to the cathode of the power source 18 . In this way, the printed circuit board 14 is energized in a movable state, and the printed circuit board 14 is plated.
メッキ槽４０の底面４０Ｂの中央には仕切り板５８が取
付られ、仕切り板５８の上端には断面がコの字状のガイ
ドレール６０が設けられる。この仕切り板５８及びガイ
トレール６０は基板１４の移動方向に沿って設けられる
。プリント基板１４の端部はガ・イドレール６０のコの
字形状内に配置され、吊り下げられたプリント基板１４
が左右にｔ１？）動しないようになっている。また仕切
り板５８の両側にはエアバブリングノズル６２Ｌ、６２
Ｒが設けられ、バブリングノズル６２Ｌ、６２Ｒは仕切
り板５８及びガイドレール６０と同様にプリン１−恭板
１４の移動方向に沿って設けられている。エアハゲリン
グノズル６２Ｌ、６２Ｒは管６４Ｌ、６４Ｒを介して３
方バルブ６６に接続され、３方バブル６６はブロアー６
８に接続される。ブロアー６８からはバブリング用エア
が送られ、ブロアー６８からのエアは３方バルブ６６で
調節されて交互にノズル６２丁、又はノズル６２Ｒに送
られる。３方バルブ６６でのバブリングエアの供給切り
換えはバルブ切換１凋整装置７０によって自動的に行わ
れる。A partition plate 58 is attached to the center of the bottom surface 40B of the plating tank 40, and a guide rail 60 having a U-shaped cross section is provided at the upper end of the partition plate 58. The partition plate 58 and the guide rail 60 are provided along the moving direction of the board 14. The end of the printed circuit board 14 is placed within the U-shape of the guide rail 60, and the printed circuit board 14 is suspended.
Is it t1 on the left and right? ) does not move. Also, air bubbling nozzles 62L, 62 are provided on both sides of the partition plate 58.
Bubbling nozzles 62L and 62R are provided along the moving direction of the pudding 1-gating plate 14, similarly to the partition plate 58 and the guide rail 60. The air blowing nozzles 62L and 62R are connected to the 3
The three-way bubble 66 is connected to the blower 6
Connected to 8. Bubbling air is sent from the blower 68, and the air from the blower 68 is regulated by the three-way valve 66 and sent alternately to the 62 nozzles or the nozzle 62R. The supply switching of bubbling air at the three-way valve 66 is automatically performed by a valve switching adjustment device 70.
前記の如く構成された本発明に係わるプリント基板のメ
ッキ装置によれば、プリント基板１４はクランプ１６を
介してメッキ槽４０内に吊り下げられコンベア１８によ
ってメッキ槽４０内を移動する。プリント基板１４には
電源１８の陰極が通電され、泪ボール入りのチタンハケ
ソト２０には電源１８の陽極が通電され、プリント基板
１４はその基板面のスルーホール２８内にメッキが施さ
れる。プリン１一基板１４のメッキが進むに従ってチタ
ンバケット２０内の銅ポールが消費され定期的に補給口
５２から銅ボールが補給される。According to the printed circuit board plating apparatus according to the present invention constructed as described above, the printed circuit board 14 is suspended within the plating tank 40 via the clamp 16 and is moved within the plating tank 40 by the conveyor 18. The cathode of the power source 18 is energized to the printed circuit board 14, the anode of the power source 18 is energized to the titanium brush 20 containing the tear ball, and the through holes 28 on the surface of the printed circuit board 14 are plated. As the plating of the printed circuit board 14 progresses, the copper poles in the titanium bucket 20 are consumed and copper balls are periodically replenished from the replenishment port 52.
メッキ槽４０の底面４０Ｂ上のエアバブリングノズル６
２Ｌ及び６２Ｒからはバブリングエアが噴出され、バブ
リングエアはブロア６８から３方コツクロロを介して送
られる。３方バルブ６６はバルブ切換調節装置７０によ
って周期的に切換られ、ブロア６８からのバブリングエ
アをノズル６２Ｌ、６２１７に交互に周１■的に送る。Air bubbling nozzle 6 on the bottom surface 40B of the plating tank 40
Bubbling air is blown out from 2L and 62R, and the bubbling air is sent from the blower 68 via a three-way flow pipe. The three-way valve 66 is periodically switched by the valve switching and adjusting device 70, and sends bubbling air from the blower 68 to the nozzles 62L and 6217 alternately around the circumference.
噴出されるバブリングエアは移動するプリント基板１４
の両側のメッキ液を交互に攪拌する。The bubbling air that is blown out is connected to the moving printed circuit board 14.
Stir the plating solution on both sides alternately.
第３図はプリント基板１４の左側のエアノズル６２Ｌか
らのバブリングエアを噴出させたときのプリント基板１
４の断面を示すものである。第３図に示すようにエアバ
ブリングによって攪拌される左側のノブキ液Ｉ２中の拡
ｔ’ｒ’Ｉ Ｐ５は薄くなり、メッキ速度が犬き（なる
。このためスルーホール２８内のメソ−１一層３２は拡
散層に反比例してバブリング側で厚（、攪拌しない右側
に行くに従って薄くなる。一方、第４図はプリント基板
１４の右側をバブリングしたもので、第３図の場合と逆
に拡散層が右側で薄くなり、スルーホール２８内のメッ
キ層３２はバブリングされる右側で厚く施され、左側で
河く施される。ノズル６２Ｌ、６２Ｒのバブリングエア
はバブル６６によって周期的に交互に噴出されるので、
第５図に示すようにプリント基板１４のスルーポール２
８内の拡散槽θを相対的に平均させ、スルーホール内の
メッキ層３２か高速に且つ均一に施すことができる。FIG. 3 shows the printed circuit board 1 when bubbling air is ejected from the air nozzle 62L on the left side of the printed circuit board 14.
4 is shown. As shown in FIG. 3, the expanded t'r'I P5 in the Nobuki liquid I2 on the left side stirred by air bubbling becomes thinner, and the plating speed slows down. 32 is thicker on the bubbling side in inverse proportion to the diffusion layer (and becomes thinner toward the right side where stirring is not performed. On the other hand, in FIG. 4, the right side of the printed circuit board 14 is bubbled, and contrary to the case of FIG. becomes thinner on the right side, and the plating layer 32 in the through hole 28 is thickly applied on the right side where bubbling is performed, and is applied thinly on the left side.The bubbling air from the nozzles 62L and 62R is periodically and alternately ejected by the bubbles 66. Because
As shown in FIG. 5, the through pole 2 of the printed circuit board 14
By making the diffusion tanks θ in the through holes relatively average, the plating layer 32 in the through holes can be uniformly applied at high speed.
またこのように行う場合において、バルブ切換調節装置
７０のバブリングエアの切換時間を１５秒乃至６０秒の
周回で変換し、且つメッキ電流密度を１０ Ａ、 ／ｄ
ｔｎ、メッキａｙ間を１８分としてメッキを施すと、
約３５μｍ厚の均一な電気メッキ層を形成することがで
きる。これは従来の装β′に比べて約３倍以上の高速化
が図れることきなる。In addition, in this case, the switching time of the bubbling air of the valve switching adjustment device 70 is changed from 15 seconds to 60 seconds, and the plating current density is set to 10 A/d.
When plating is performed with the time between tn and plating ay being 18 minutes,
A uniform electroplated layer with a thickness of about 35 μm can be formed. This means that the speed can be increased by about three times as compared to the conventional system β'.
以上においては、プリント基板のスルーホールにメッキ
をする場合を例に説明したが、スルーホール以外に物、
例えば、金Ｅ＋Ｓ、プラス千ツク板等に対するメッキに
も適用可能である。In the above, we have explained the case of plating the through holes of a printed circuit board as an example, but in addition to through holes, there are
For example, it can be applied to plating gold E+S, plus plate, etc.
以上説明したように本発明に係るプリン１一基板のメッ
キ装置によれば、メッキ槽液中にガスを発生させてプリ
ント基板を境界面とする両側のメ・７キ液を交互にバブ
リング攪拌するバブリング装置を設けたので、プリント
基板のスルーホール内を均一な厚みのメッキを施すこと
ができる。As explained above, according to the plating apparatus for plating 1 and 7 substrates according to the present invention, gas is generated in the plating bath liquid to alternately bubble and stir the coating liquids on both sides of the printed circuit board as the boundary surface. Since the bubbling device is provided, the inside of the through hole of the printed circuit board can be plated to a uniform thickness.
第１図は本発明に係わるプリント基板のメッキ装置の斜
視図、第２図は本発明に係わるプリンｌ−基板のメッキ
装置の断面図、第３図、第４図及び第５図は本発明に係
わるプリント基板のメッキ装置で処理したときのプリン
ト基板の拡大断面図、第６図は従来のプリン）ｌ板のメ
ッキ装置の断面図、第７図は従来のプリント基板のメッ
キ装置で処理したときのプリント基板の拡大断面図であ
る１２・・・メッキ液、 １４・・・プリント基板、
４０・・・メソ；１一槽、 ６０・・・ガイドブ
レート、６２Ｌ、６２Ｒ・・・エアバブリングノズル、
６６・・・３方バルブ、 ６８・・・ブＬ７ア、
７０・・・バルブ切換調節装置。
出願人 日立プラント建設株式会社第２図
第３図
告
告
第４図FIG. 1 is a perspective view of a printed circuit board plating apparatus according to the present invention, FIG. 2 is a sectional view of a printed circuit board plating apparatus according to the present invention, and FIGS. 3, 4, and 5 are according to the present invention. Figure 6 is a cross-sectional view of a conventional printed circuit board plating apparatus, and Figure 7 is an enlarged cross-sectional view of a printed circuit board processed with a conventional printed circuit board plating apparatus. 12... plating liquid, 14... printed circuit board,
40... Meso; 1 tank, 60... Guide plate, 62L, 62R... Air bubbling nozzle,
66...3-way valve, 68...B L7a,
70... Valve switching adjustment device. Applicant Hitachi Plant Construction Co., Ltd. Figure 2 Figure 3 Notice Figure 4
Claims (2)
流電圧を印加し、電気メッキを施すプリント基板のメッ
キ装置に於いて、前記メッキ槽内のプリント基板の下方
に配置され、プリント基板を境界面とする両側のメッキ
液を交互にガスでバブリング攪拌するバブリング装置を
設けたことを特徴とするプリント基板のメッキ装置。(1) In a printed circuit board plating device in which a printed circuit board is immersed in a plating solution in a plating tank and subjected to electroplating by applying a DC voltage, the device is placed below the printed circuit board in the plating tank, and the printed circuit board is A plating device for printed circuit boards, characterized in that it is equipped with a bubbling device that alternately bubbles and stirs the plating solution on both sides of the interface with gas.
基板を境界面として両側に設けられ、両側のノズルから
交互に周期的にガスを発生させることを特徴とする特許
請求の範囲第１項記載のプリント基板のメッキ装置。(2) The print according to claim 1, wherein the gas generating nozzles of the bubbling device are provided on both sides with the printed circuit board as a boundary surface, and gas is generated alternately and periodically from the nozzles on both sides. Board plating equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4364986A JPS62202099A (en) | 1986-02-28 | 1986-02-28 | Plating device for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4364986A JPS62202099A (en) | 1986-02-28 | 1986-02-28 | Plating device for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62202099A true JPS62202099A (en) | 1987-09-05 |
Family
ID=12669711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4364986A Pending JPS62202099A (en) | 1986-02-28 | 1986-02-28 | Plating device for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62202099A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0290591A (en) * | 1988-09-28 | 1990-03-30 | Hitachi Ltd | Processing method of inside of hole |
| KR20020065711A (en) * | 2001-02-07 | 2002-08-14 | 차성욱 | A copper plating method of PCB |
| JP2009102699A (en) * | 2007-10-24 | 2009-05-14 | Daisho Denshi:Kk | Plating current shielding body, plating tool, plating apparatus and method of manufacturing plated substrate |
| KR101070841B1 (en) | 2011-06-02 | 2011-10-06 | 장병원 | The plate method of a thin plate printed-circuit board and thereof ware |
-
1986
- 1986-02-28 JP JP4364986A patent/JPS62202099A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0290591A (en) * | 1988-09-28 | 1990-03-30 | Hitachi Ltd | Processing method of inside of hole |
| KR20020065711A (en) * | 2001-02-07 | 2002-08-14 | 차성욱 | A copper plating method of PCB |
| JP2009102699A (en) * | 2007-10-24 | 2009-05-14 | Daisho Denshi:Kk | Plating current shielding body, plating tool, plating apparatus and method of manufacturing plated substrate |
| KR101070841B1 (en) | 2011-06-02 | 2011-10-06 | 장병원 | The plate method of a thin plate printed-circuit board and thereof ware |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8801912B2 (en) | Continuous copper electroplating method | |
| US20060151328A1 (en) | Method of electroplating a workpiece having high-aspect ratio holes | |
| CZ278956B6 (en) | Process for cleaning and/or metal coating of bored holes in horizontally guided guide plates and device for carrying out said process | |
| JP4826756B2 (en) | Electroplating method | |
| EP1438446B1 (en) | System and method for electrolytic plating | |
| JPS62202099A (en) | Plating device for printed circuit board | |
| JPH0354887A (en) | Method and apparatus for treatment of fine hole in printed board | |
| US20070144896A1 (en) | Plating process enhanced by squeegee roller apparatus | |
| CA2079033A1 (en) | Electroplating means for perforated printed circuit boards to be treated in a horizontal pass | |
| US4969985A (en) | Device for transporting agitatable material having a vibrator which is submerged in a liquid | |
| JPH0241873Y2 (en) | ||
| JPS6277494A (en) | Plating device for printed circuit board | |
| JPS6277495A (en) | Plating device for printed circuit board | |
| US20240141534A1 (en) | Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate | |
| JPH10172974A (en) | Plating method and its device for semiconductor wafer | |
| KR102263628B1 (en) | Desolving tank | |
| JPH049500A (en) | Electroplating device | |
| JP3450179B2 (en) | Surface treatment equipment | |
| JP3264175B2 (en) | Electroplating apparatus and electroplating method | |
| JPH0243399A (en) | Electroplating tank | |
| JPH03158498A (en) | Method and device for electroplating | |
| JP2004332094A (en) | Method and apparatus for via-filling plating substrate having blind viahole | |
| JPH0458196B2 (en) | ||
| JPH1060684A (en) | Spray electroplating method | |
| JPH031390B2 (en) |