JPH0354887A - Method and apparatus for treatment of fine hole in printed board - Google Patents
Method and apparatus for treatment of fine hole in printed boardInfo
- Publication number
- JPH0354887A JPH0354887A JP18897089A JP18897089A JPH0354887A JP H0354887 A JPH0354887 A JP H0354887A JP 18897089 A JP18897089 A JP 18897089A JP 18897089 A JP18897089 A JP 18897089A JP H0354887 A JPH0354887 A JP H0354887A
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- processing liquid
- printed circuit
- circuit board
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000011282 treatment Methods 0.000 title abstract description 16
- 238000000034 method Methods 0.000 title description 9
- 239000007788 liquid Substances 0.000 claims abstract description 97
- 239000012530 fluid Substances 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 238000007747 plating Methods 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000012267 brine Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical compound O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野Ｊ
本発明は、特にプリント配線基板スルーホール及びブラ
インドホールを湿式法により処理するのに有用なプリン
ト基板の微小孔処理方法およびその装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application J] The present invention relates to a method and apparatus for treating microholes in a printed circuit board, which is particularly useful for treating through holes and blind holes in a printed circuit board by a wet method.
従来、微小貫通孔を有する被処理物を湿式法により処理
する場合、孔が微小径になるほど孔内に処理戚（以下、
単に「ｌ夜」と記す）が入りにくく、又孔内に気泡がた
まって液が孔内部に接触できないため、処理できない部
分が生じ、或は液が微小孔に入って気泡が抜けたとして
も孔内部の？夜を外部の新鮮な液と交換して流動させる
ことが困難であるという問題点があった。Conventionally, when processing objects with minute through-holes using a wet method, the smaller the diameter of the holes, the more processing material (hereinafter referred to as
(simply written as ``l night'') is difficult to enter, and there are areas that cannot be treated because air bubbles accumulate in the holes and the liquid cannot come into contact with the inside of the holes, or even if the liquid enters the micropores and the air bubbles escape. Inside the hole? There was a problem in that it was difficult to replace the liquid with fresh liquid from outside to make it flow.
プリント基板において、特に問題となるのは孔を介して
両側の導体を電気的に接続するための湿式処理工程であ
り、この工程は大別して孔洗浄、脱脂、触媒化、無電解
銅メッキ及び電気銅メッキから成っているのが一般的で
ある。これらは水洗、湯洗を含めすべて湿式法による処
理であるため、特に微小孔を有する基板において前述の
問題の解決が重要となる。In printed circuit boards, a particular problem is the wet processing process for electrically connecting conductors on both sides through holes, and this process can be broadly divided into hole cleaning, degreasing, catalyticization, electroless copper plating, and electroplating. It is generally made of copper plating. Since all of these treatments, including washing with water and hot water, are performed using wet methods, it is important to solve the above-mentioned problems, especially in the case of substrates having micropores.
これらの問題を解決するための装置として、特開昭６１
−２１０６９４号公報、特公昭６１−４７９１８号公報
、特公昭６３−９０３６号公報等に開示されたものが提
案されている。As a device to solve these problems,
Those disclosed in Japanese Patent Publication No. 210694, Japanese Patent Publication No. 61-47918, Japanese Patent Publication No. 63-9036, etc. have been proposed.
第１の提案（特開昭６１−２１０６９４号公報）は、基
板両側の処理液を基板により分離し、孔を介して液が流
動するようにしたうえで基板両側の液を交互に加圧して
液を流動させる装置である。The first proposal (Japanese Unexamined Patent Publication No. 61-210694) is to separate the processing liquid on both sides of the substrate by the substrate, allow the liquid to flow through holes, and then pressurize the liquid on both sides of the substrate alternately. This is a device that allows liquid to flow.
第２の提案（特公昭６１−４７９１８号公報）は、液を
流下し、液流乱し部材により基板表面に加圧、負圧が生
じるようにして孔内に液を流動させる装置である。The second proposal (Japanese Patent Publication No. 61-47918) is an apparatus in which the liquid flows down and the liquid is caused to flow into the hole by causing pressurization and negative pressure to be generated on the substrate surface by a liquid flow turbulent member.
第３の提案（特公昭６３−９０３６号公報）は、ノズル
を用いて孔に高速液流を衝突させて孔内に液を流動させ
る装置である。The third proposal (Japanese Patent Publication No. 63-9036) is a device that uses a nozzle to impinge a high-speed liquid stream on a hole to cause the liquid to flow into the hole.
ところが、上記従来例において、第１の提案では加圧流
動で孔内に液を流動させるようにした装置のため、装置
内に液漏れのないような工夫が必要であり、構造が複雑
となり、さらに被処理物の耐圧が問題となる等の欠点が
あった。第２の提案では、密閉構造とする必要はないが
、？夜を流下させるだけでは加圧及び負圧の効果が小さ
く、微小孔を有する基板においては、基板両側で生じる
圧力差により液を流動させるのは不十分である。However, in the conventional example described above, the first proposal uses a device that allows liquid to flow into the hole using pressurized flow, so it is necessary to devise measures to prevent liquid from leaking inside the device, making the structure complicated. Furthermore, there were other drawbacks such as problems with the pressure resistance of the object to be treated. In the second proposal, there is no need for a sealed structure, but? Simply letting the liquid flow down has little effect on pressurization and negative pressure, and in a substrate with micropores, it is insufficient to cause the liquid to flow due to the pressure difference generated on both sides of the substrate.
又、第３の提案では微小孔内の冫夜を押し出すのに十分
な高速液流をノズルにより噴出させて圧力差を生じさせ
ることができるものの基板に垂直に液を衝突させる方法
であるため、微小孔内に液を押し込むためには、ノズル
を基板に接するように近づけなおかつ孔径より小さいノ
ズル径とすることが望ましいが、加圧すればするほど基
板はノズルから離れてしまうため、反対側に強固な支え
を設けて基板が反らないようにする工夫が必要であった
。又、いずれの方法も孔径が０，ｌｎｏｎΦというよう
な超微小孔となった場合には液流を圧力で得ようとする
と液の流動性は極端に悪くなり、現実的には不可能であ
った。In addition, in the third proposal, although it is possible to generate a pressure difference by ejecting a high-speed liquid flow from a nozzle that is sufficient to push out the darkness inside the micropores, the method involves colliding the liquid perpendicularly to the substrate. In order to push the liquid into the micropores, it is desirable to bring the nozzle close to the substrate and make the nozzle diameter smaller than the hole diameter. However, the more pressure is applied, the further the substrate will be from the nozzle, It was necessary to provide a strong support to prevent the board from warping. In addition, in either method, if the pore size is 0 or lnonΦ, the fluidity of the liquid will be extremely poor if you try to obtain a liquid flow using pressure, making it practically impossible. there were.
本発明は、上記の問題点を解消するために成されたもの
で簡単な手段により被処理物に設けられた微小孔内に処
理液をスムーズに流動することができる湿式電解処理装
置を提供することを目的とする。The present invention has been made to solve the above-mentioned problems, and provides a wet electrolytic treatment apparatus that can smoothly flow a treatment liquid into micropores provided in a workpiece by a simple means. The purpose is to
上記の課題は、本発明の、プリント基板に孔明けした微
小孔に流体を流通させて処理する装置において、プリン
ト基板の片側表面に対し処理液を平行に流通させる開口
部を有する高速液流発生部材と、前記高速液流発生部材
に対して処理液を供給する処理液供給手段と、前記処理
液供給手段からの処理液を吸引する処理液吸引手段と、
前記供給手段から供給された処理府と前記吸引手段によ
り吸引された処理液とを循環させる循環手段とを備えた
ことを特徴とするプリント基板の微小孔処理装置により
解決できる。The above-mentioned problem can be solved by the high-speed liquid flow generation in the present invention, which has an opening that allows the processing liquid to flow parallel to one surface of the printed circuit board. a processing liquid supply means for supplying a processing liquid to the high-speed liquid flow generating member; a processing liquid suction means for sucking the processing liquid from the processing liquid supply means;
This problem can be solved by a microhole processing apparatus for a printed circuit board, which is equipped with a circulation means for circulating the processing chamber supplied from the supply means and the processing liquid sucked by the suction means.
上記の本発明において、処理液供給手段から供給された
処理液は、高速ｌ夜流発生手段の開口部を通過すること
により、プリント基板表面に平行に流通し、次いで処理
液吸引手段により吸引され、循環手段により再び供給手
段から吐出される。従って、高速液流を生じさせた側の
プリント基板の微小孔開口部分の液圧と微小孔を介して
反対側孔開口部分の液圧とに圧力差が生じ、この圧力差
により微小孔内に処理液を流通させることができる。又
、高速液流発生部材の開口部の口径を可変とすることに
より、プリント基板表面に平行に流通する流量を調整す
ることができ、る。In the present invention described above, the processing liquid supplied from the processing liquid supply means flows parallel to the printed circuit board surface by passing through the opening of the high-speed night flow generating means, and is then sucked by the processing liquid suction means. , and is again discharged from the supply means by the circulation means. Therefore, a pressure difference is created between the liquid pressure at the microhole opening part of the printed circuit board on the side where the high-speed liquid flow was generated and the liquid pressure at the opposite side hole opening part via the microhole, and this pressure difference causes the liquid pressure to flow inside the microhole. Processing liquid can be circulated. Furthermore, by making the diameter of the opening of the high-speed liquid flow generating member variable, the flow rate flowing parallel to the surface of the printed circuit board can be adjusted.
上記は、貫通孔（スルーホール）における効果であるが
、一方が閉ざされた微小孔（ブラインホール）において
も同様であって、高速液流を生じさせた側の開口部分の
液圧が微小孔内部の液圧より小さくなり、開口部分へ向
けて微小孔内で液流が生じる。The above effect is for a through hole (through hole), but it is also the same for a microhole (brine hole) that is closed on one side, and the liquid pressure at the opening on the side where high-speed liquid flow was generated is The pressure becomes lower than the internal liquid pressure, and a liquid flow occurs within the micropore toward the opening.
以下、本発明の実施例について図面を参照しながら説明
する。Embodiments of the present invention will be described below with reference to the drawings.
第１図は本発明による実施例装置の模式的断面図、第２
図は第１図の要部拡大断面図、第３図（ａ）は第２図の
側方からの部分図、第３図（ｂ）は第２図の上方からの
部分図である。FIG. 1 is a schematic sectional view of an embodiment device according to the present invention, and FIG.
The figure is an enlarged sectional view of the main part of FIG. 1, FIG. 3(a) is a partial view from the side of FIG. 2, and FIG. 3(b) is a partial view of FIG. 2 from above.
第１図に示すように、処理槽２に処理液８が収容され、
この処理槽２内にプリント基板１（以下、単に「基板」
と記す）が両端部についてガイドレール３により保持さ
れ、基板裏表面方向について複数のローラ４により保持
されている。As shown in FIG. 1, a processing liquid 8 is stored in a processing tank 2,
A printed circuit board 1 (hereinafter simply referred to as a "board") is placed inside this processing tank 2.
) is held at both ends by guide rails 3, and held by a plurality of rollers 4 in the direction of the back surface of the substrate.
上記基板１の各裏表面側には、高速液流発生手段５が千
鳥状に設けられている（第３図（ｂ）参照）。この各高
速液流発生手段５には、これに処理液８を供給する手段
として吐出ボンプ６が接続され、又処理液８を吸引する
手段として吸引ボンブ７が接続されている。On each back surface side of the substrate 1, high-speed liquid flow generating means 5 are provided in a staggered manner (see FIG. 3(b)). A discharge bomb 6 is connected to each high-speed liquid flow generating means 5 as a means for supplying the processing liquid 8 thereto, and a suction bomb 7 is connected as a means for sucking the processing liquid 8.
高速液流発生手段５は、第２図に示すように、基板１と
近接する部位に開口部５ｃと、これに処理戚８を供給す
る吐出口５ａと該供給された処理液８を吸引する吸引口
５ｂとを備え、上記のように吐出ボンブ６から供給され
、吸引ボンブ７により吸引されて該開口部５ｃを流通循
環する処理液の液流を基板１に対して平行に流通させる
ことができる。又、吐出口５ａと吸引口５ｂの開口部５
ｃ付近における口径は、流路が狭められるように他の流
通経路に比較して小径にされ、これにより開口部５ｃに
供給される処理液８の液流が高速にされ、又、吸引する
際の処理液に負荷がかけられる。従って、上記開口部５
ｃを流通する高速液流により基板１のスルホール１０に
圧力差が生じて該スルホール１０内に液流を生じさせ、
さらに吸引口５ｂによる吸引力によりスルホール１０内
の処理液８を強制的に吸引することができる。かくして
、スルホール１０内の気泡は吸引口５ｂに吸引され、又
スルホール１０内壁を新鮮な処理液が流通することがで
きる。As shown in FIG. 2, the high-speed liquid flow generating means 5 has an opening 5c in the vicinity of the substrate 1, a discharge port 5a for supplying the processing liquid 8 to the opening 5c, and a discharge port 5a for sucking the supplied processing liquid 8. As described above, the processing liquid supplied from the discharge bomb 6, sucked by the suction bomb 7, and circulated through the opening 5c can be caused to flow parallel to the substrate 1. can. Moreover, the openings 5 of the discharge port 5a and the suction port 5b
The aperture in the vicinity of c is made smaller than other flow paths so that the flow path is narrowed, thereby increasing the flow rate of the processing liquid 8 supplied to the opening 5c, and also increasing the flow rate during suction. load is applied to the processing liquid. Therefore, the opening 5
A pressure difference is generated in the through hole 10 of the substrate 1 due to the high speed liquid flow flowing through c, causing a liquid flow in the through hole 10,
Furthermore, the processing liquid 8 in the through hole 10 can be forcibly sucked by the suction force of the suction port 5b. In this way, air bubbles in the through hole 10 are sucked into the suction port 5b, and fresh processing liquid can flow through the inner wall of the through hole 10.
基板１は上記のガイドレール３により案内されてローラ
４により保持されつつ移動し、上記の如く順次スルホー
ルｌＯの処理が成される。The substrate 1 moves while being guided by the guide rail 3 and held by the rollers 4, and the through-holes 10 are sequentially processed as described above.
なお、本装置によれば、スルホール１０だけでなく、ブ
ラインドホール１１についても同様に処理することがで
きる。このブラインドホール１１のように片方が閉じら
れた孔においては、貫通孔に比べ、液の流動はきわめて
困難であるが、吐出口５ａによる高速液流により、孔開
口部に乱律流が生じ、又、吸引口５ｂによる吸引作用も
働いて効果的に孔内な流通させること−ができる。Note that, according to the present apparatus, not only the through hole 10 but also the blind hole 11 can be treated in the same manner. In a hole where one side is closed like the blind hole 11, liquid flow is extremely difficult compared to a through hole, but due to the high speed liquid flow from the discharge port 5a, a turbulent flow is generated at the hole opening. In addition, the suction effect by the suction port 5b also works, allowing effective circulation within the hole.
なお、上記のように吸引口５ｂによる負荷を生じさせる
には吐出口５ａによる吸引能力を高めることが望ましく
、これには吐出口５ａ及び吐出口５ａの口径を調整する
ことにより行なうことができる。Note that in order to generate a load by the suction port 5b as described above, it is desirable to increase the suction ability by the discharge port 5a, and this can be done by adjusting the diameter of the discharge port 5a and the discharge port 5a.
さらに、本装置には、第２図に示すような高速戚流発生
部材５に、開口部５ｃと基板１との間隔を一定にする間
隔調整部材としてのスベーサー９が設けられている。こ
のスペーサ−９の基板との接触部分には基板１の移動時
の動きを円滑にするローラが設けられている（第３図（
ａ））。スベーサ−９により、上記負圧化かにともなっ
て基板ｌが開口部５ｃ方向に引き寄せられても、基板１
と開口部５Ｃとの間隔が一定に保たれ、又基板１の反り
発生が防止される。Furthermore, in this device, a spacer 9 is provided on the high-speed flow generating member 5 as shown in FIG. 2, as a spacer 9 that serves as a spacer adjusting member that keeps the space between the opening 5c and the substrate 1 constant. A roller is provided at the contact portion of the spacer 9 with the substrate to smooth the movement of the substrate 1 (see Fig. 3).
a)). Due to the spacer 9, even if the substrate l is drawn toward the opening 5c due to the negative pressure, the substrate 1
The distance between the opening 5C and the opening 5C is maintained constant, and the occurrence of warpage of the substrate 1 is prevented.
本装置によれば、微小孔を有するプリント基板の温式処
理全般にわたって適用でき、脱脂等の浸漬処理であれば
、処理液を変えることで適用できる。This apparatus can be applied to all types of hot processing of printed circuit boards having micropores, and can be applied to immersion processing such as degreasing by changing the processing liquid.
又、電気メッキのように電極を必要とする場合には、本
装置を第５図に示すように構成することができる。同図
の装置は、吸引孔５のみによる処理手段で、基板１を垂
直方向に配置し、該基板と平行に正電極ｌ２を設け、基
板１を負電極とする構成としてある。７は吸引孔５の処
理液を吸引するボンブである。なお、第４図に、吸引の
みにより処理する構成について示してある。この場合の
構成及び効果は第１図の装置の吸引口５ｂにょる吸引に
よる場合と同様である。Further, in cases where electrodes are required, such as in electroplating, the present apparatus can be constructed as shown in FIG. The apparatus shown in the figure is a processing means using only suction holes 5, and has a configuration in which a substrate 1 is arranged vertically, a positive electrode 12 is provided parallel to the substrate, and the substrate 1 is used as a negative electrode. 7 is a bomb that sucks the processing liquid from the suction hole 5. Note that FIG. 4 shows a configuration in which treatment is performed only by suction. The structure and effect in this case are the same as those in the case of suction through the suction port 5b of the apparatus shown in FIG.
次ぎの上記の装置を用いた具体的実施例について説明す
る。Next, a specific example using the above-mentioned apparatus will be described.
実施例１：
基板１として銅張積層板（ｔ＝０．６ｍｍ、大きさ１
０ ０ｍｍＸ Ｉ Ｏ Ｏｍｍ、東芝ケミカルズ社製；
ＴＣＬ−５５１）を用い、これにドリルにより径０．０
８ｍｍの貫通孔を明け、この基板を第１図に示す装置に
組み込み、所定の前処理液及び水洗水を順次層２内に導
入し、基板ｌを左右に移動して所定時間の処理を行なっ
た。この時、高速液流発生手段５の開口部５ｃの流路は
１ｍｍとし、スベーサ−９の調整により基板１と高速液
流発生手段５との間隔が０，５１となるように調整した
。又、開口部５Ｃにおける液流が５ｍ／秒となるように
吐出ボンブ６及び吸引ボンブ７の流量を調整した。Example 1: A copper-clad laminate (t=0.6 mm, size 1
0 0mmX IO Omm, manufactured by Toshiba Chemicals;
TCL-551) and drilled it with a diameter of 0.0.
A through hole of 8 mm was made, and this substrate was assembled into the apparatus shown in Fig. 1, and a predetermined pretreatment liquid and washing water were sequentially introduced into the layer 2, and the substrate l was moved from side to side to carry out the treatment for a predetermined time. Ta. At this time, the flow path of the opening 5c of the high-speed liquid flow generating means 5 was set to 1 mm, and the spacing between the substrate 1 and the high-speed liquid flow generating means 5 was adjusted to 0.51 by adjusting the spacer 9. Further, the flow rates of the discharge bomb 6 and the suction bomb 7 were adjusted so that the liquid flow at the opening 5C was 5 m/sec.
次ぎに無電解銅メッキ液を装置内に導入し、２０分間で
約０．５μｍの銅メッキ皮膜を形成させた。次いで、処
理槽２の内壁に銅極板を入れてこれを陽極とし、基板１
を陰極として、ＩＯＡ／ｄｍ”で１５分の硫酸銅メッキ
処理を行ない、銅皮膜約３０ｔＪ．ｍの試料を得た。Next, an electroless copper plating solution was introduced into the apparatus, and a copper plating film of about 0.5 μm was formed in 20 minutes. Next, a copper electrode plate is placed on the inner wall of the processing tank 2 to serve as an anode, and the substrate 1 is
Copper sulfate plating treatment was carried out for 15 minutes at IOA/dm'' using as a cathode to obtain a sample with a copper coating of about 30 tJ.m.
そして、この基板１を｛孔ごとに切断し、ミリオームメ
ータを用いて孔の導通抵抗を測定した。Then, this substrate 1 was cut into holes, and the conduction resistance of the holes was measured using a milliohmmeter.
その結果については後述する。The results will be discussed later.
実施例２：
基板１として板厚１．６ｍｍの銅張積層板を用い、これ
にドリルにより径０．２ｍｍの貫通孔を明け第５図に示
す装置に基板が垂直となるように組み込んだ。以下、実
施例１と同様に処理を行なった。その結果については後
述する。Example 2: A copper-clad laminate with a thickness of 1.6 mm was used as the substrate 1. A through hole with a diameter of 0.2 mm was drilled in this, and the substrate was installed in the apparatus shown in FIG. 5 so as to be vertical. Thereafter, the same processing as in Example 1 was performed. The results will be discussed later.
実施例３：
基板１として板厚１．６ｍｍの銅張積層板を用い、これ
にドリルにより径０．２ｍｍの孔を深さ０．５ｍｍまで
孔明けしてブラインドホールを有する基板を作成した。Example 3: A copper-clad laminate with a thickness of 1.6 mm was used as the substrate 1, and holes with a diameter of 0.2 mm were drilled to a depth of 0.5 mm using a drill to create a substrate with blind holes.
以下、実施例１と同様に処理を行なった。この基板を樹
脂に埋め込み孔断面を顕微鏡で観察した。その結果、得
られた基板の孔底部まで表面と同様な膜厚で銅皮膜が形
成されていることが確認された。Thereafter, the same processing as in Example 1 was performed. This substrate was embedded in resin and the cross section of the hole was observed using a microscope. As a result, it was confirmed that a copper film was formed to the bottom of the hole of the obtained substrate with the same thickness as the surface.
比較例１：
実施例ｌと同様の基板を試料基板とし、従来と同様に振
動のみによる処理を行ない、電気メッキは２ Ａ ／
ｄ ｍ ２で１，２Ｈｒ処理し、約３０μｍの銅皮膜を
形成した。そして、この基板を孔ごとに切断し、上記の
ように導体抵抗を測定した。Comparative Example 1: The same substrate as in Example 1 was used as a sample substrate, and treatment using only vibration was performed in the same manner as before, and electroplating was performed at 2 A/
A copper film of about 30 μm was formed by treatment at d m 2 for 1.2 hours. This substrate was then cut into holes, and the conductor resistance was measured as described above.
以下、実施例１、実施例２、比較例ｌの測定結果を表記
する。The measurement results of Example 1, Example 2, and Comparative Example 1 will be described below.
ｎ＝３５０、導体抵抗１０ｍｍΩ以上を不良とする。n=350, conductor resistance of 10 mmΩ or more is considered defective.
以上説明したように、本発明によれば、次ぎの効果を有
する。As explained above, the present invention has the following effects.
１）孔径が０，０８φの極小径でも孔内の液を良好に流
動させ、完全な銅皮膜を形成でき、歩留まりを向上でき
る。1) Even if the hole diameter is as small as 0.08φ, the liquid inside the hole can flow well, a complete copper coating can be formed, and the yield can be improved.
２）スルーホールのみならずブラインドホールであって
も有効に処理できる。2) Not only through holes but also blind holes can be effectively processed.
３）密閉構造とする必要がなく、簡単な装置で構成する
ことができる。3) It does not need to be a sealed structure and can be constructed with a simple device.
４）高速液流及び吸引作用により、処理速度を向上する
ことができ生産性が向上する。4) High-speed liquid flow and suction action can improve processing speed and productivity.
第１図は本発明による実施例装置の模式的断面図、
第２図は第１図の要部拡大断面図、
第３図（ａ）は第２図の側方からの部分図、第３図（ｂ
）は第２図の上方からの部分図、第４図は、第１図に示
す高速液流発生部材の変形例を示す部分断面図、
第５図は第１図に示す装置を電気メッキ処理に適用した
例を示す断面図である。
１・・・プリント基板
２・・・処理槽
３、４・・・保持部材
５・・・高速液流発生部材
６・・・吐出口
７・・・吸引口
８・・・処理液
９・・・スベーサー
１０・・・スルーホール
１■・・・ブラインドホール
１２・・・電極板FIG. 1 is a schematic sectional view of an embodiment of the device according to the present invention, FIG. 2 is an enlarged sectional view of the main part of FIG. 1, FIG. 3(a) is a partial view from the side of FIG. Figure (b
) is a partial view from above in Fig. 2, Fig. 4 is a partial sectional view showing a modification of the high-speed liquid flow generating member shown in Fig. 1, and Fig. 5 is a partial view of the device shown in Fig. 1 subjected to electroplating. FIG. 2 is a cross-sectional view showing an example applied to. 1... Printed circuit board 2... Processing tanks 3, 4... Holding member 5... High speed liquid flow generating member 6... Discharge port 7... Suction port 8... Processing liquid 9...・Baser 10...Through hole 1■...Blind hole 12...Electrode plate
Claims (4)
せて処理する装置において、プリント基板の片側表面に
対し処理液を平行に流通させる開口部を有する高速液流
発生部材と、前記高速液流発生部材へ処理液を供給する
処理液供給手段と、前記高速液流発生部材の処理液を吸
引する処理液吸引手段と、前記供給手段から供給された
処理液と前記吸引手段により吸引された処理液とを循環
させる循環手段とを備えたことを特徴とするプリント基
板の微小孔処理装置。(1) An apparatus for processing a printed circuit board by flowing a fluid through micro holes drilled in the printed circuit board, which includes: a high-speed liquid flow generating member having an opening that allows the processing liquid to flow parallel to one surface of the printed circuit board; a processing liquid supply means for supplying the processing liquid to the flow generating member; a processing liquid suction means for sucking the processing liquid from the high-speed liquid flow generating member; and a processing liquid supplied from the supply means and the processing liquid sucked by the suction means. A micropore processing device for a printed circuit board, comprising a circulation means for circulating a processing liquid.
する請求項１記載のプリント基板の微小孔処理装置。(2) The microhole processing device for a printed circuit board according to claim 1, wherein the opening diameter of the opening is variable.
径を可変とすることにより、プリント基板の片側表面に
対し平行に流通する処理液の流速を調整するようにした
ことを特徴とする請求項１記載のプリント基板の微小孔
処理装置。(3) The flow rate of the processing liquid flowing parallel to one surface of the printed circuit board is adjusted by making the flow path diameter of the processing liquid supply means and the processing liquid suction means variable. The apparatus for treating micropores in a printed circuit board according to claim 1.
基板との間隔を一定にする間隔調整部材を設けたことを
特徴とする請求項１記載のプリント基板の微小孔処理装
置。(4) The apparatus for treating micropores in a printed circuit board according to claim 1, further comprising a distance adjusting member provided at the opening of the high-speed liquid flow generating member to maintain a constant distance from the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18897089A JPH0354887A (en) | 1989-07-24 | 1989-07-24 | Method and apparatus for treatment of fine hole in printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18897089A JPH0354887A (en) | 1989-07-24 | 1989-07-24 | Method and apparatus for treatment of fine hole in printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0354887A true JPH0354887A (en) | 1991-03-08 |
Family
ID=16233115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18897089A Pending JPH0354887A (en) | 1989-07-24 | 1989-07-24 | Method and apparatus for treatment of fine hole in printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0354887A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05114781A (en) * | 1991-10-23 | 1993-05-07 | Tokyo Kakoki Kk | Cleaning device |
| JPH05167228A (en) * | 1991-12-11 | 1993-07-02 | Tokyo Kakoki Kk | Washing device |
| JPH05167229A (en) * | 1991-12-11 | 1993-07-02 | Tokyo Kakoki Kk | Drying equipment |
| JP2008098327A (en) * | 2006-10-11 | 2008-04-24 | Hitachi Ltd | Method of processing inside of holes of printed circuit board |
| WO2011105072A1 (en) * | 2010-02-24 | 2011-09-01 | 住友ベークライト株式会社 | Substrate treating method and substrate treating apparatus |
| JP2012082447A (en) * | 2010-10-07 | 2012-04-26 | Sumitomo Bakelite Co Ltd | Substrate treatment apparatus and method |
| JP2012082448A (en) * | 2010-10-07 | 2012-04-26 | Sumitomo Bakelite Co Ltd | Substrate treatment apparatus and method |
-
1989
- 1989-07-24 JP JP18897089A patent/JPH0354887A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05114781A (en) * | 1991-10-23 | 1993-05-07 | Tokyo Kakoki Kk | Cleaning device |
| JPH05167228A (en) * | 1991-12-11 | 1993-07-02 | Tokyo Kakoki Kk | Washing device |
| JPH05167229A (en) * | 1991-12-11 | 1993-07-02 | Tokyo Kakoki Kk | Drying equipment |
| JP2008098327A (en) * | 2006-10-11 | 2008-04-24 | Hitachi Ltd | Method of processing inside of holes of printed circuit board |
| WO2011105072A1 (en) * | 2010-02-24 | 2011-09-01 | 住友ベークライト株式会社 | Substrate treating method and substrate treating apparatus |
| JP2012082447A (en) * | 2010-10-07 | 2012-04-26 | Sumitomo Bakelite Co Ltd | Substrate treatment apparatus and method |
| JP2012082448A (en) * | 2010-10-07 | 2012-04-26 | Sumitomo Bakelite Co Ltd | Substrate treatment apparatus and method |
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