JPS6289141U - - Google Patents
Info
- Publication number
- JPS6289141U JPS6289141U JP18088085U JP18088085U JPS6289141U JP S6289141 U JPS6289141 U JP S6289141U JP 18088085 U JP18088085 U JP 18088085U JP 18088085 U JP18088085 U JP 18088085U JP S6289141 U JPS6289141 U JP S6289141U
- Authority
- JP
- Japan
- Prior art keywords
- land
- semiconductor element
- hook
- corners
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
- H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Description
第1図及び第2図はこの考案の一実施例を示す
図で、第1図は斜視図、第2図は要部の拡大斜視
図である。
1……回路パターン、2……半導体素子、3…
…ランド、4……かぎ形の溝。
1 and 2 are views showing one embodiment of this invention, with FIG. 1 being a perspective view and FIG. 2 being an enlarged perspective view of the main parts. 1...Circuit pattern, 2...Semiconductor element, 3...
...Land, 4...Hook-shaped groove.
Claims (1)
溝を形成して成ることを特徴とする半導体素子実
装用のランド。 A land for mounting a semiconductor element, characterized in that hook-shaped grooves are formed at the four corners of the land on which the semiconductor element is mounted.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18088085U JPS6289141U (en) | 1985-11-25 | 1985-11-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18088085U JPS6289141U (en) | 1985-11-25 | 1985-11-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6289141U true JPS6289141U (en) | 1987-06-08 |
Family
ID=31125239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18088085U Pending JPS6289141U (en) | 1985-11-25 | 1985-11-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6289141U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01293557A (en) * | 1988-05-20 | 1989-11-27 | Mitsubishi Electric Corp | Semiconductor device |
JP2014060211A (en) * | 2012-09-14 | 2014-04-03 | Omron Corp | Substrate structure, semiconductor chip mounting method and solid state relay |
JP2014132682A (en) * | 2014-03-14 | 2014-07-17 | Renesas Electronics Corp | Resin encapsulated semiconductor device manufacturing method |
-
1985
- 1985-11-25 JP JP18088085U patent/JPS6289141U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01293557A (en) * | 1988-05-20 | 1989-11-27 | Mitsubishi Electric Corp | Semiconductor device |
JP2014060211A (en) * | 2012-09-14 | 2014-04-03 | Omron Corp | Substrate structure, semiconductor chip mounting method and solid state relay |
JP2014132682A (en) * | 2014-03-14 | 2014-07-17 | Renesas Electronics Corp | Resin encapsulated semiconductor device manufacturing method |