JPH01133739U - - Google Patents
Info
- Publication number
- JPH01133739U JPH01133739U JP2960788U JP2960788U JPH01133739U JP H01133739 U JPH01133739 U JP H01133739U JP 2960788 U JP2960788 U JP 2960788U JP 2960788 U JP2960788 U JP 2960788U JP H01133739 U JPH01133739 U JP H01133739U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- holder substrate
- holder
- claw
- formed near
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 210000000078 claw Anatomy 0.000 claims description 4
Description
第１図は、この考案による一実施例のウエハー
ホルダーにウエハーを装着した状態を示す側面図
、第２図は従来例のウエハーホルダーにウエハー
を装着した状態を示す側面図である。
１……ウエハーホルダー、２……ウエハー、１
１……ホルダー基板、１２……ウエハー支持片、
１３ａ……くさび形爪。
FIG. 1 is a side view showing a state in which a wafer is mounted on a wafer holder according to an embodiment of this invention, and FIG. 2 is a side view showing a state in which a wafer is mounted in a conventional wafer holder. 1...Wafer holder, 2...Wafer, 1
1...Holder substrate, 12...Wafer support piece,
13a... Wedge-shaped claw.
Claims (1)
されたウエハー支持片と、同じくその一面の他端
部近傍に形成された爪とからなり、これらのウエ
ハー支持片と爪によりウエハーをその一面が前記
ホルダー基板の一面に接するように保持するウエ
ハーホルダーにおいて、前記爪と前記ホルダー基
板との間に形成される空隙が下方に開いたくさび
形であることを特徴とするウエハーホルダー。 It consists of a holder substrate, a wafer support piece formed near one end of one side of the holder substrate, and a claw similarly formed near the other end of the one side, and these wafer support pieces and claws hold the wafer so that the one side is A wafer holder that is held in contact with one surface of a holder substrate, wherein a gap formed between the claw and the holder substrate is wedge-shaped and opens downward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2960788U JPH01133739U (en) | 1988-03-04 | 1988-03-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2960788U JPH01133739U (en) | 1988-03-04 | 1988-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01133739U true JPH01133739U (en) | 1989-09-12 |
Family
ID=31253968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2960788U Pending JPH01133739U (en) | 1988-03-04 | 1988-03-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01133739U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016139703A (en) * | 2015-01-28 | 2016-08-04 | 株式会社島津製作所 | Substrate support |
-
1988
- 1988-03-04 JP JP2960788U patent/JPH01133739U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016139703A (en) * | 2015-01-28 | 2016-08-04 | 株式会社島津製作所 | Substrate support |