JPS6213767B2 - - Google Patents

Info

Publication number: JPS6213767B2
Authority: JP; Japan
Prior art keywords: resin; polyamide; inner layer; weight; equivalent
Prior art date: 1982-02-12
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP57020954A

Other languages

English (en)

Japanese (ja)

Other versions

JPS58140909A (ja

Inventor

Kenji Asano

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Hitachi Cable Ltd

Original Assignee

Hitachi Cable Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1982-02-12

Filing date

1982-02-12

Publication date

1987-03-28

1982-02-12 Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd

1982-02-12 Priority to JP57020954A priority Critical patent/JPS58140909A/ja

1983-08-20 Publication of JPS58140909A publication Critical patent/JPS58140909A/ja

1987-03-28 Publication of JPS6213767B2 publication Critical patent/JPS6213767B2/ja

Status Granted legal-status Critical Current

Links

229920005989 resin Polymers 0.000 claims description 29
239000011347 resin Substances 0.000 claims description 29
239000004962 Polyamide-imide Substances 0.000 claims description 22
229920002312 polyamide-imide Polymers 0.000 claims description 22
QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 16
229930003836 cresol Natural products 0.000 claims description 16
239000005056 polyisocyanate Substances 0.000 claims description 14
229920001228 polyisocyanate Polymers 0.000 claims description 14
239000002904 solvent Substances 0.000 claims description 12
ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 8
125000004018 acid anhydride group Chemical group 0.000 claims description 7
239000011248 coating agent Substances 0.000 claims description 6
238000000576 coating method Methods 0.000 claims description 6
239000004020 conductor Substances 0.000 claims description 6
229920001721 polyimide Polymers 0.000 claims description 6
239000002253 acid Substances 0.000 claims description 5
229920003180 amino resin Polymers 0.000 claims description 5
150000003951 lactams Chemical class 0.000 claims description 5
239000009719 polyimide resin Substances 0.000 claims description 5
239000011342 resin composition Substances 0.000 claims description 5
239000005011 phenolic resin Substances 0.000 claims description 3
239000002966 varnish Substances 0.000 description 16
230000000052 comparative effect Effects 0.000 description 10
IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 8
238000006243 chemical reaction Methods 0.000 description 7
ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
150000001875 compounds Chemical class 0.000 description 5
239000012948 isocyanate Substances 0.000 description 5
150000002513 isocyanates Chemical class 0.000 description 5
239000002994 raw material Substances 0.000 description 5
IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
239000004593 Epoxy Substances 0.000 description 4
JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 4
KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
-1 alkali metal acetates Chemical class 0.000 description 3
230000015572 biosynthetic process Effects 0.000 description 3
239000003054 catalyst Substances 0.000 description 3
229920001568 phenolic resin Polymers 0.000 description 3
238000003786 synthesis reaction Methods 0.000 description 3
DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 3
SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 3
FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 2
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
230000003247 decreasing effect Effects 0.000 description 2
230000006866 deterioration Effects 0.000 description 2
125000005442 diisocyanate group Chemical group 0.000 description 2
USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
239000004615 ingredient Substances 0.000 description 2
229910052757 nitrogen Inorganic materials 0.000 description 2
125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
238000005829 trimerization reaction Methods 0.000 description 2
QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
239000010754 BS 2869 Class F Substances 0.000 description 1
FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
239000004642 Polyimide Substances 0.000 description 1
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
239000000654 additive Substances 0.000 description 1
230000000996 additive effect Effects 0.000 description 1
125000002723 alicyclic group Chemical group 0.000 description 1
125000001931 aliphatic group Chemical group 0.000 description 1
150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
229910052783 alkali metal Inorganic materials 0.000 description 1
239000002585 base Substances 0.000 description 1
230000015556 catabolic process Effects 0.000 description 1
210000003298 dental enamel Anatomy 0.000 description 1
239000003822 epoxy resin Substances 0.000 description 1
150000002148 esters Chemical class 0.000 description 1
238000011156 evaluation Methods 0.000 description 1
NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
229910052742 iron Inorganic materials 0.000 description 1
150000002576 ketones Chemical class 0.000 description 1
239000011133 lead Substances 0.000 description 1
229910052749 magnesium Inorganic materials 0.000 description 1
239000011777 magnesium Substances 0.000 description 1
229910052751 metal Inorganic materials 0.000 description 1
239000002184 metal Chemical class 0.000 description 1
239000012046 mixed solvent Substances 0.000 description 1
239000000203 mixture Substances 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
150000002902 organometallic compounds Chemical class 0.000 description 1
150000002989 phenols Chemical class 0.000 description 1
229920006287 phenoxy resin Polymers 0.000 description 1
239000013034 phenoxy resin Substances 0.000 description 1
239000002798 polar solvent Substances 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
230000009257 reactivity Effects 0.000 description 1
239000003507 refrigerant Substances 0.000 description 1
150000003839 salts Chemical class 0.000 description 1
230000007928 solubilization Effects 0.000 description 1
238000005063 solubilization Methods 0.000 description 1
150000003512 tertiary amines Chemical class 0.000 description 1
229910052718 tin Inorganic materials 0.000 description 1
239000011135 tin Substances 0.000 description 1
229910052719 titanium Inorganic materials 0.000 description 1
239000010936 titanium Substances 0.000 description 1
239000013638 trimer Substances 0.000 description 1
229910052720 vanadium Inorganic materials 0.000 description 1
GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
239000008096 xylene Substances 0.000 description 1
229910052725 zinc Inorganic materials 0.000 description 1
239000011701 zinc Substances 0.000 description 1

Landscapes

Insulated Conductors (AREA)
Organic Insulating Materials (AREA)

JP57020954A 1982-02-12 1982-02-12 絶縁電線 Granted JPS58140909A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP57020954A JPS58140909A (ja)	1982-02-12	1982-02-12	絶縁電線

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP57020954A JPS58140909A (ja)	1982-02-12	1982-02-12	絶縁電線

Publications (2)

Publication Number	Publication Date
JPS58140909A JPS58140909A (ja)	1983-08-20
JPS6213767B2 true JPS6213767B2 (ko)	1987-03-28

Family

ID=12041574

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP57020954A Granted JPS58140909A (ja)	1982-02-12	1982-02-12	絶縁電線

Country Status (1)

Country	Link
JP (1)	JPS58140909A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH02216365A (ja) *	1989-02-17	1990-08-29	Mitsubishi Motors Corp	小舵角ステアリング装置
JPH02216367A (ja) *	1989-02-17	1990-08-29	Mitsubishi Motors Corp	小舵角ステアリング装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2032075C3 (de) *	1970-06-29	1980-06-26	Bayer Ag, 5090 Leverkusen	Mehrschichtisolierstoffe
JPS5163984U (ko) *	1975-02-12	1976-05-20

1982
- 1982-02-12 JP JP57020954A patent/JPS58140909A/ja active Granted

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH02216365A (ja) *	1989-02-17	1990-08-29	Mitsubishi Motors Corp	小舵角ステアリング装置
JPH02216367A (ja) *	1989-02-17	1990-08-29	Mitsubishi Motors Corp	小舵角ステアリング装置

Also Published As

Publication number	Publication date
JPS58140909A (ja)	1983-08-20

Publication	Publication Date	Title
US4448844A (en)	1984-05-15	Heat resistant resin and process for producing the same
US7122244B2 (en)	2006-10-17	Polyamide-imide resin solution and the use thereof for producing wire enamels
US4294952A (en)	1981-10-13	Polyamide-imide resin and its production
US3493540A (en)	1970-02-03	Polyimides which are soluble in organic solvents
US4740576A (en)	1988-04-26	Preparation of polyamidoimide coatings having a long shelf life
US4614782A (en)	1986-09-30	Heat resistant resin composition
JPS6213767B2 (ko)	1987-03-28
JPS6213768B2 (ko)	1987-03-28
US20060122353A1 (en)	2006-06-08	Method of producing a modified diisocyanate,method of producing a self-lubricating enamelling varnish and method of producing an enameled electrical conductor
CA1318431C (en)	1993-05-25	High temperature resistant fast soldering wire enamel
JPH09302226A (ja)	1997-11-25	ポリアミドイミド樹脂組成物および低温硬化型高密着性耐熱塗料
JPS6139689B2 (ko)	1986-09-05
JPS6351196B2 (ko)	1988-10-13
JP3336220B2 (ja)	2002-10-21	絶縁電線
JPH027337B2 (ko)	1990-02-16
JPS6411656B2 (ko)	1989-02-27
JPS6141086B2 (ko)	1986-09-12
JPS585207B2 (ja)	1983-01-29	ポリアミドイミド樹脂組成物
JPH08143663A (ja)	1996-06-04	耐熱性樹脂組成物
JP4399912B2 (ja)	2010-01-20	電気絶縁用樹脂組成物及びこれを用いた絶縁電線
JPS60118740A (ja)	1985-06-26	耐熱性樹脂組成物
KR920001726B1 (ko)	1992-02-24	자기 융착성 절연전선
JPH10265717A (ja)	1998-10-06	絶縁塗料
JPH05331367A (ja)	1993-12-14	樹脂組成物及びこれを用いた絶縁電線
JPS62156122A (ja)	1987-07-11	耐熱性樹脂組成物

JPS6213767B2 - - Google Patents

Info

Links

Landscapes

Priority Applications (1)

Applications Claiming Priority (1)

Publications (2)

Family

ID=12041574

Family Applications (1)

Country Status (1)

Cited By (2)

Family Cites Families (2)

Cited By (2)

Also Published As

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