JPS6136772B2 - - Google Patents
Info
- Publication number
- JPS6136772B2 JPS6136772B2 JP763580A JP763580A JPS6136772B2 JP S6136772 B2 JPS6136772 B2 JP S6136772B2 JP 763580 A JP763580 A JP 763580A JP 763580 A JP763580 A JP 763580A JP S6136772 B2 JPS6136772 B2 JP S6136772B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- epoxy
- component
- present
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003822 epoxy resin Substances 0.000 claims description 22
- 229920000647 polyepoxide Polymers 0.000 claims description 22
- 239000000203 mixture Substances 0.000 claims description 16
- DZBUGLKDJFMEHC-UHFFFAOYSA-N acridine Chemical compound C1=CC=CC2=CC3=CC=CC=C3N=C21 DZBUGLKDJFMEHC-UHFFFAOYSA-N 0.000 claims description 8
- RGCKGOZRHPZPFP-UHFFFAOYSA-N alizarin Chemical compound C1=CC=C2C(=O)C3=C(O)C(O)=CC=C3C(=O)C2=C1 RGCKGOZRHPZPFP-UHFFFAOYSA-N 0.000 claims description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 7
- 229920003986 novolac Polymers 0.000 claims description 6
- 239000003054 catalyst Substances 0.000 claims description 5
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 claims description 4
- 229940105324 1,2-naphthoquinone Drugs 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 239000004593 Epoxy Substances 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- -1 2,3-epoxypropoxy Chemical group 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000012535 impurity Substances 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- LLPKQRMDOFYSGZ-UHFFFAOYSA-N 2,5-dimethyl-1h-imidazole Chemical compound CC1=CN=C(C)N1 LLPKQRMDOFYSGZ-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- JROURLWMOZCGJV-UHFFFAOYSA-N alizarin blue Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C1=CC=CN=C1C(O)=C2O JROURLWMOZCGJV-UHFFFAOYSA-N 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 229960001755 resorcinol Drugs 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1 -dodecene Natural products CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 1
- BDHGFCVQWMDIQX-UHFFFAOYSA-N 1-ethenyl-2-methylimidazole Chemical compound CC1=NC=CN1C=C BDHGFCVQWMDIQX-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical group CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- PLQNDYUMLMVFCX-UHFFFAOYSA-N 1h-imidazol-2-ylmethanediol Chemical compound OC(O)C1=NC=CN1 PLQNDYUMLMVFCX-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- LKMJVFRMDSNFRT-UHFFFAOYSA-N 2-(methoxymethyl)oxirane Chemical compound COCC1CO1 LKMJVFRMDSNFRT-UHFFFAOYSA-N 0.000 description 1
- FSYPIGPPWAJCJG-UHFFFAOYSA-N 2-[[4-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical compound C1OC1COC(C=C1)=CC=C1OCC1CO1 FSYPIGPPWAJCJG-UHFFFAOYSA-N 0.000 description 1
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- ANOPCGQVRXJHHD-UHFFFAOYSA-N 3-[3-(3-aminopropyl)-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]propan-1-amine Chemical compound C1OC(CCCN)OCC21COC(CCCN)OC2 ANOPCGQVRXJHHD-UHFFFAOYSA-N 0.000 description 1
- KOGSPLLRMRSADR-UHFFFAOYSA-N 4-(2-aminopropan-2-yl)-1-methylcyclohexan-1-amine Chemical compound CC(C)(N)C1CCC(C)(N)CC1 KOGSPLLRMRSADR-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- ZFIVKAOQEXOYFY-UHFFFAOYSA-N Diepoxybutane Chemical compound C1OC1C1OC1 ZFIVKAOQEXOYFY-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- LMMDJMWIHPEQSJ-UHFFFAOYSA-N bis[(3-methyl-7-oxabicyclo[4.1.0]heptan-4-yl)methyl] hexanedioate Chemical compound C1C2OC2CC(C)C1COC(=O)CCCCC(=O)OCC1CC2OC2CC1C LMMDJMWIHPEQSJ-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical compound C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 description 1
- FWFSEYBSWVRWGL-UHFFFAOYSA-N cyclohexene oxide Natural products O=C1CCCC=C1 FWFSEYBSWVRWGL-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 229940069096 dodecene Drugs 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 238000005502 peroxidation Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- ADXGNEYLLLSOAR-UHFFFAOYSA-N tasosartan Chemical compound C12=NC(C)=NC(C)=C2CCC(=O)N1CC(C=C1)=CC=C1C1=CC=CC=C1C=1N=NNN=1 ADXGNEYLLLSOAR-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Description
本発明は電子部品封止用エポキシ樹脂組成物に
関するものである。
近年、トランジスター、IC、LSIなどの半導体
素子、抵抗体あるいはコンデンサーなどの電子部
品をシリコーン系樹脂あるいはエポキシ系樹脂材
料などを用いて封止する樹脂封止法が広く採用さ
れ、これらの樹脂材料の内でもエポキシ系樹脂材
料はすぐれた気密性を与え、かつ安価であること
から封止用材料として汎用されている。
しかしながら、前記材料中の主構成成分である
エポキシ系樹脂は一般にその製造工程中において
微量のNa+、Cl-などのイオン性不純物を混入す
るが、これらの不純物の混入を防止することはき
わめて難かしく、このような不純物を含有するエ
ポキシ系樹脂を含む封止材料からなる成形品はそ
れに水分が吸収されると配線や電極類にアルミニ
ウムなどの金属蒸着膜を使用するトランジスタ
ー、ICあるいはLSIなどの素子においては、該蒸
着膜を腐食、劣化させるという不利をもたらし、
これがエポキシ系樹脂封止材料における信頼性を
低下させる一つの大きな原因となつている。
上述したような不純物は、樹脂の水洗あるいは
真空蒸留などの方法を採用しても確実に除去する
ことがきわめて困難であるのが現状である。
一方、シリコーン系樹脂は高温時での使用には
十分耐え得ることができるが、金属との接着面が
部分的に剥離を起こし、これが物性の低下をもた
らしている。
本発明は上記したような従来の不利を除去した
新規な電子部品封止用エポキシ樹脂組成物を提供
しようとするものであつて、これは
(イ) エポキシ樹脂、
(ロ) １分子中に水酸基を少くとも２個有するフエ
ノール・ノボラツク樹脂、
(ハ) 硬化用触媒
および
(ニ) アクリジン、１・２−ナフトキノン、アリザ
リンおよびこれらの誘導体から選択される少く
とも１種
からなるものである。
上記した(イ)〜(ニ)成分からなるエポキシ樹脂組成
物は、これを使用してアルミニウム配線やアルミ
ニウム電極を有する種々の電子部品を封止した場
合、その理論的根拠は明らかではないが従来から
知られているエポキシ系樹脂封止材料に比較して
配線あるいは電極の腐食を著しく防止することが
できるという顕著な効果を有するほか、該組成物
は成形時の流動性にきわめてすぐれる。
以下、本発明に係る電子部品封止用エポキシ樹
脂組成物について詳細に説明する。
まず、本発明において主成分とされるエポキシ
樹脂としては、その分子中にエポキシ結合を少く
とも２個有する化合物である限り、分子構造、分
子量などにとくに制限はなく、これには２・２−
ビス（４−ヒドロキシフエニル）プロパンまたは
このハロゲン化物のジグリシジルエーテル、ブタ
ジエンジエポキシド、ビニルシクロヘキセンジオ
キシド、レゾルシンのジグリシジルエーテル、
１・４−ビス（２・３−エポキシプロポキシ）ベ
ンゼン、４・4′−ビス（２・３−エポキシプロポ
キシ）ジフエニルエーテル、１・４−ビス（２・
３−エポキシプロポキシ）シクロヘキセン、ビス
（３・４−エポキシ−６−メチルシクロヘキシル
メチル）アジペート、１・２−ジオキシベンゼン
あるいはレゾルシノール、多価フエノールまたは
多価アルコールとエピクロルヒドリンとを縮合さ
せて得られるエポキシグリシジルエーテルあるい
はポリグリシジルエステル、ノボラツク型フエノ
ール樹脂とエピクロルヒドリンとを縮合させて得
られるエポキシノボラツク、過酸化法によりエポ
キシ化したエポキシ化ポリオレフイン、エポキシ
化ポリブタジエン、オルガノポリシロキサンとエ
ポキシ樹脂とを縮合させて得られるエポキシ変性
オルガノポリシロキサン、トリ（グリシジル）イ
ソシアヌレート、さらには式
あるいは
で示されるエポキシ基含有シロキサン単位を１分
子中に２個以上有するオルガノポリシロキサンな
どが例示される。
なお、上記した(イ)成分の使用にあたつて、モノ
エポキシ化合物を適宜併用することは差支えな
く、このモノエポキシ化合物としてはスチレンオ
キシド、シクロヘキセンオキシド、プロピレンオ
キシド、メチルグリシジルエーテル、エチルグリ
シジルエーテル、フエニルグリシジルエーテル、
アリルグリシジルエーテル、オクチレンオキシ
ド、ドデセンオキシドなどが例示される。
つぎに、(ロ)成分としてのフエノール・ノボラツ
ク樹脂は、従来から知られているものであつて、
このものは硫酸、塩酸あるいはりん酸などの酸を
触媒としてフエノールとホルムアルデヒドを反応
させることによつて得られる、一般式
で示されるものである。
この(ロ)成分の使用量についてはとくに限定はな
いが、最終的に得られる本発明に係る組成物を用
いて封止した成形品に適当な機械的強度を付与す
る目的からは、上記(イ)成分のエポキシ当量とこの
(ロ)成分の水酸基当量との比が0.1〜10の範囲とな
るような量とすることが好ましい。
さらに、本発明において使用される(ハ)成分であ
る硬化用触媒としては、一般にエポキシ化合物の
硬化に用いられている種々のものを使用すること
ができ、これにはイミダゾール、２−メチルイミ
ダゾール、２−エチルイミダゾール、２・４−ジ
メチルイミダゾール、２−エチル−４−チルイミ
ダゾール、２−ウンデシルイミダゾール、２−ヘ
プタデシルイミダゾール、１−ビニル−２−メチ
ルイミダゾール、２−フエニル−４・５−ジヒド
ロキシメチルイミダゾール、２−フエニルイミダ
ゾール、２−フエニル−４−メチルイミダゾール
などのイミダゾール類、トリエチルアミン、ジエ
チレントリアミン、トチエチレンテトラミン、ジ
エチルアミノプロピルアミン、Ｎ−アミノエチル
ピペラジン、ビス（４−アミノ−３−メチルシク
ロヘキシル）メタン、メタキシリレンアミン、メ
ンタンジアミン、３・９−ビス（３−アミノプロ
ピル）−２・４・８・10−テトラオキサスピロ
（５・５）ウンデカンなどのアミン系化合物ある
いはトリエチルアミンとBF3とからなる錯化合物
などが例示される。
この硬化剤は、その使用にあたつては必ずしも
１種類のみに限定されるものではなく、それら硬
化剤が有する硬化性能などに応じて２種以上を併
用してもよい。
この(ハ)成分の使用量は、実用的な硬化速度を達
成する観点などから上記(イ)成分100重量部に対し
て0.1〜10重量部の範囲とすることがよい。
また、本発明において使用される(ニ)成分は、ア
クリジン、１・２−ナフトキノン、アリザリンま
たはこれらの誘導体、例えばアリザリンブルーか
ら選択されるものであつて、このものは電子部品
を封止した場合アルミニウム配線や電極などの腐
蝕を著しく減少させる効果を有するほか、本発明
の組成物を用いて電子部品を封止する際の成型時
において流動性向上剤としての機能も有する。
この(ニ)成分の使用量は上記(イ)成分100重量部に
対して0.01〜20重量部の範囲とされるが、これは
その使用量が0.01重量部よりも少ないとアルミニ
ウムなどの金属に対する腐食防止効果を本発明の
組成物に付与することができず、反面それが多す
ぎると硬化およびのび成形に要する時間が長くな
つて実用的および経済的に不利となるからであ
る。
なお、本発明においてこの(ニ)成分の代わりにそ
れら化合物と類似の性質を有する化合物（例えば
無機インヒビターまたはアミン化合物、いおう化
合物などの有機インヒビター）を使用し、これを
用いて電子部品を封止すると、無機インヒビター
を使用した場合には耐湿特性、とくに電子部品の
体積固有抵抗を著しく変化させるという不利を有
し、またアミン化合物は毒性を有し、さらにいお
う化合物はアルミニウムなどを腐食するという問
題をもつているのでこれらは使用に供することが
できない。
本発明に係る組成物は、従来シリコーンゴム組
成物の調製などに使用されている公知の混練装
置、例えばロール、ニーダーなどを用いることに
よつて容易に調製することができるが、本発明の
組成物には必要に応じてシリカ、タルクあるいは
酸化チタンなどの無機質充てん剤を添加配合して
もよい。
なお、上記したような無機質充てん剤を使用す
るにあたつては、組成物中の主要成分であるエポ
キシ樹脂との密着性を良好にする目的でシランカ
ツプリング剤あるいはその他加工助剤などを併用
してもよく、これらの使用によつて本発明の目的
は何ら損われることはない。
以下に本発明の実施例をあげるが、各例中の
「部」はすべて「重量部」を示したものである。
実施例
下記の表に示すような種類の(1)エポキシ樹脂、
(2)フエノール・ノボラツク樹脂、(3)アクリジン、
１・２−ナフトキノン、アリザリンまたはアリザ
リンブルー、(4)無機質充てん剤、(5)シランカツプ
リング剤および(6)滑剤を６インチロールを使用し
温度80〜90℃で５分間混練したのち、これらの
各々に同表に示すような各種硬化剤を添加しさら
に２分間混練し電子部品封止用エポキシ樹脂組成
物を得た。
上記で得たエポキシ樹脂組成物について、アル
ミニウムに対する腐食性を下記のようにして調べ
たところ、下記の表に示すような結果が得られ
た。
腐食性の測定方法
膜厚１μ、線巾10μのアルミニウム蒸着膜のパ
ターン10本を有するシリコン・チツプを14ピン
ICフレームにマウントしたのち、上記で得た組
成物を用いトランスフアー成形により封止した。
この封止チツプを温度121℃の水蒸気加圧缶にい
れ、直流50Vのバイアス電圧をかけ、時間の経過
とアルミニウムの腐食によるチツプの不良率を正
規確率紙にプロツトし平均寿命時間を求め、これ
を腐食性とした。
また、前記組成物の流動性（FMMI規格のスパ
イラルフロー値）および封止後の硬度（成形３分
後、バーコール硬度計使用）を調べその結果を同
表に示した。
The present invention relates to an epoxy resin composition for encapsulating electronic components. In recent years, resin encapsulation methods have been widely adopted in which semiconductor elements such as transistors, ICs, and LSIs, and electronic components such as resistors and capacitors are encapsulated using silicone resin or epoxy resin materials. Among them, epoxy resin materials are widely used as sealing materials because they provide excellent airtightness and are inexpensive. However, the epoxy resin, which is the main component of the above-mentioned materials, is generally contaminated with trace amounts of ionic impurities such as Na + and Cl - during the manufacturing process, and it is extremely difficult to prevent the contamination of these impurities. However, if moisture is absorbed into a molded product made of a sealing material containing an epoxy resin containing such impurities, it may cause damage to transistors, ICs, or LSIs that use vapor-deposited metal films such as aluminum for wiring and electrodes. In devices, it has the disadvantage of corroding and deteriorating the deposited film,
This is one of the major causes of lowering the reliability of epoxy resin sealing materials. At present, it is extremely difficult to reliably remove the above-mentioned impurities even by methods such as washing the resin with water or vacuum distillation. On the other hand, silicone resins can withstand use at high temperatures, but the adhesive surface with metals partially peels off, resulting in a decline in physical properties. The present invention aims to provide a novel epoxy resin composition for encapsulating electronic components which eliminates the conventional disadvantages as described above, and which comprises (a) an epoxy resin, and (b) a hydroxyl group in one molecule. (c) a curing catalyst; and (d) at least one selected from acridine, 1,2-naphthoquinone, alizarin, and derivatives thereof. The epoxy resin composition consisting of the above-mentioned components (a) to (d) can be used to encapsulate various electronic components having aluminum wiring or aluminum electrodes, but the theoretical basis is not clear, but conventional In addition to having the remarkable effect of being able to significantly prevent corrosion of wiring or electrodes compared to the epoxy resin encapsulating material known from , the composition has extremely excellent fluidity during molding. Hereinafter, the epoxy resin composition for encapsulating electronic components according to the present invention will be explained in detail. First, the epoxy resin that is the main component in the present invention is not particularly limited in terms of molecular structure, molecular weight, etc., as long as it is a compound that has at least two epoxy bonds in its molecule.
diglycidyl ether of bis(4-hydroxyphenyl)propane or its halide, butadiene diepoxide, vinylcyclohexene dioxide, diglycidyl ether of resorcin;
1,4-bis(2,3-epoxypropoxy)benzene, 4,4'-bis(2,3-epoxypropoxy) diphenyl ether, 1,4-bis(2,
Epoxy obtained by condensing epichlorohydrin with 3-epoxypropoxy)cyclohexene, bis(3,4-epoxy-6-methylcyclohexylmethyl)adipate, 1,2-dioxybenzene, resorcinol, polyhydric phenol or polyhydric alcohol Glycidyl ether or polyglycidyl ester, epoxy novolak obtained by condensing novolac type phenolic resin and epichlorohydrin, epoxidized polyolefin epoxidized by peroxidation method, epoxidized polybutadiene, condensing organopolysiloxane and epoxy resin The resulting epoxy-modified organopolysiloxane, tri(glycidyl)isocyanurate, and also the formula or Examples include organopolysiloxanes having two or more epoxy group-containing siloxane units in one molecule. In addition, when using the above-mentioned component (a), there is no problem in using a monoepoxy compound as appropriate, and examples of this monoepoxy compound include styrene oxide, cyclohexene oxide, propylene oxide, methyl glycidyl ether, ethyl glycidyl ether, phenyl glycidyl ether,
Examples include allyl glycidyl ether, octylene oxide, and dodecene oxide. Next, the phenolic novolac resin as the component (b) is conventionally known, and
This product is obtained by reacting phenol and formaldehyde using an acid such as sulfuric acid, hydrochloric acid, or phosphoric acid as a catalyst, and has the general formula This is shown in . There is no particular limitation on the amount of this component (b) to be used, but for the purpose of imparting appropriate mechanical strength to the molded article finally obtained sealed using the composition according to the present invention, the above (b) component is used. b) The epoxy equivalent of the component and this
The amount is preferably such that the ratio to the hydroxyl equivalent of component (b) is in the range of 0.1 to 10. Furthermore, as the curing catalyst used in the present invention, component (iii), various catalysts that are generally used for curing epoxy compounds can be used, including imidazole, 2-methylimidazole, 2-ethylimidazole, 2,4-dimethylimidazole, 2-ethyl-4-tylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1-vinyl-2-methylimidazole, 2-phenyl-4,5- Imidazoles such as dihydroxymethylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, triethylamine, diethylenetriamine, triethylenetetramine, diethylaminopropylamine, N-aminoethylpiperazine, bis(4-amino-3-methyl Amine compounds such as cyclohexyl)methane, metaxylyleneamine, menthanediamine, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro(5,5)undecane, or triethylamine and BF. A complex compound consisting of 3 and the like is exemplified. The use of this curing agent is not necessarily limited to only one type, but two or more types may be used in combination depending on the curing performance of the curing agent. The amount of component (c) used is preferably in the range of 0.1 to 10 parts by weight per 100 parts by weight of component (a) from the viewpoint of achieving a practical curing speed. In addition, component (2) used in the present invention is selected from acridine, 1,2-naphthoquinone, alizarin, or derivatives thereof, such as alizarin blue, and this component is used when electronic components are sealed. In addition to having the effect of significantly reducing corrosion of aluminum wiring and electrodes, it also functions as a fluidity improver during molding when electronic parts are sealed using the composition of the present invention. The amount of component (2) to be used is in the range of 0.01 to 20 parts by weight per 100 parts by weight of component (a) above, but this means that if the amount used is less than 0.01 part by weight, it will cause damage to metals such as aluminum. This is because it is not possible to impart a corrosion-inhibiting effect to the composition of the present invention, and on the other hand, if the amount is too large, the time required for curing and stretch forming becomes longer, which is disadvantageous from a practical and economic point of view. In addition, in the present invention, a compound having properties similar to those compounds (for example, an inorganic inhibitor or an organic inhibitor such as an amine compound or a sulfur compound) is used instead of this (2) component, and electronic components are sealed using this. Therefore, when inorganic inhibitors are used, they have the disadvantage of significantly changing the moisture resistance properties, especially the volume resistivity of electronic components, and amine compounds are toxic, and furthermore, these compounds corrode aluminum and other materials. These cannot be used because they have . The composition according to the present invention can be easily prepared by using a known kneading device, such as a roll or a kneader, which has been conventionally used for preparing silicone rubber compositions. If necessary, an inorganic filler such as silica, talc or titanium oxide may be added to the product. In addition, when using the above-mentioned inorganic fillers, a silane coupling agent or other processing aids may be used in combination to improve adhesion to the epoxy resin, which is the main component in the composition. However, the purpose of the present invention is not impaired in any way by using these. Examples of the present invention are given below, and all "parts" in each example indicate "parts by weight." Examples (1) Epoxy resins of the types shown in the table below,
(2) Phenol novolac resin, (3) acridine,
1,2-naphthoquinone, alizarin or alizarin blue, (4) an inorganic filler, (5) a silane coupling agent, and (6) a lubricant were kneaded using a 6-inch roll at a temperature of 80 to 90°C for 5 minutes. Various curing agents as shown in the table were added to each of the above and kneaded for further 2 minutes to obtain an epoxy resin composition for encapsulating electronic parts. The epoxy resin composition obtained above was examined for its corrosion resistance to aluminum as described below, and the results shown in the table below were obtained. Corrosion measurement method A 14-pin silicon chip with 10 patterns of aluminum evaporated film with a film thickness of 1μ and a line width of 10μ
After mounting it on an IC frame, it was sealed by transfer molding using the composition obtained above.
This sealed chip was placed in a steam pressurized can at a temperature of 121°C, a DC bias voltage of 50 V was applied, and the defect rate of the chip due to the passage of time and aluminum corrosion was plotted on normal probability paper to determine the average life time. was considered corrosive. In addition, the fluidity (spiral flow value according to FMMI standard) and hardness after sealing (3 minutes after molding, using a Barcall hardness meter) of the composition were investigated and the results are shown in the same table.
【表】
エピコート 1001：
シエル化学社製エポキシ樹脂、エポキシ当量
500
ECN−1280：
チバガイギー社製エポキシ樹脂、エポキシ当量
230
EPPN−201：
日本化薬社製エポキシ樹脂、エポキシ当量180
MP−120：
群栄化学社製フエノール・ノボラツク樹脂、
OH当量100
TD−2093：
大日本インキ社製フエノール・ノボラツク樹
脂、OH当量110
KBM−402、KBM−403：
信越化学社製シランカツプリング剤[Table] Epicote 1001: Epoxy resin manufactured by Ciel Chemical Co., Ltd., epoxy equivalent
500 ECN−1280: Ciba Geigy epoxy resin, epoxy equivalent
230 EPPN−201: Epoxy resin manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent weight 180 MP−120: Phenol novolac resin manufactured by Gunei Chemical Co., Ltd.
OH equivalent 100 TD-2093: Phenol novolac resin manufactured by Dainippon Ink, OH equivalent 110 KBM-402, KBM-403: Silane coupling agent manufactured by Shin-Etsu Chemical
Claims (1)
ノール・ノボラツク樹脂、 (ハ) 硬化用触媒 および (ニ) アクリジン、１・２−ナフトキノン、アリザ
リンおよびこれらの誘導体から選択される少く
とも１種 からなる電子部品封止用エポキシ樹脂組成物。[Scope of Claims] 1 (a) an epoxy resin, (b) a phenolic novolak resin having at least two hydroxyl groups in one molecule, (c) a curing catalyst, and (d) acridine, 1,2-naphthoquinone, An epoxy resin composition for encapsulating electronic components comprising at least one selected from alizarin and derivatives thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP763580A JPS56104926A (en) | 1980-01-25 | 1980-01-25 | Epoxy resin composition for sealing electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP763580A JPS56104926A (en) | 1980-01-25 | 1980-01-25 | Epoxy resin composition for sealing electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56104926A JPS56104926A (en) | 1981-08-21 |
| JPS6136772B2 true JPS6136772B2 (en) | 1986-08-20 |
Family
ID=11671280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP763580A Granted JPS56104926A (en) | 1980-01-25 | 1980-01-25 | Epoxy resin composition for sealing electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56104926A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6360775U (en) * | 1986-10-09 | 1988-04-22 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0735468B2 (en) * | 1985-09-11 | 1995-04-19 | 日本合成ゴム株式会社 | Phenol resin composition |
| WO2022043421A1 (en) * | 2020-08-28 | 2022-03-03 | Basf Coatings Gmbh | Solvent-borne, two-pack, anticorrosion coating composition |
-
1980
- 1980-01-25 JP JP763580A patent/JPS56104926A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6360775U (en) * | 1986-10-09 | 1988-04-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56104926A (en) | 1981-08-21 |
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