JPS6130274U - Parts removal device - Google Patents
Parts removal deviceInfo
- Publication number
- JPS6130274U JPS6130274U JP11405784U JP11405784U JPS6130274U JP S6130274 U JPS6130274 U JP S6130274U JP 11405784 U JP11405784 U JP 11405784U JP 11405784 U JP11405784 U JP 11405784U JP S6130274 U JPS6130274 U JP S6130274U
- Authority
- JP
- Japan
- Prior art keywords
- removal device
- parts removal
- printed board
- terminal piece
- bonding chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【図面の簡単な説明】
第j図は本考案の一実施例を示し、a図は斜視図、bl
,b2図は側面図、第2図は従来の取り外しを説明した
a図は斜視図、b図は側面図を示す。
図において、1はプリント板、2はコネクタ、3はネジ
、4は半田、5は半田ゴテ、11は台板、12は金具、
13はチップホルダ、14はホンデイングチップ、15
はスピンドル機構、を示す。[Brief Description of the Drawings] Figure J shows an embodiment of the present invention, Figure A is a perspective view, and Figure BL is a perspective view.
, b2 are side views, FIG. 2 is a perspective view explaining conventional removal, and FIG. 2 is a perspective view, and b is a side view. In the figure, 1 is a printed board, 2 is a connector, 3 is a screw, 4 is solder, 5 is a soldering iron, 11 is a base plate, 12 is a metal fitting,
13 is a tip holder, 14 is a Hondaing tip, 15
indicates a spindle mechanism.
Claims (1)
り実装された電子部品を取り外す部品取外装置であって
、該プリント板を装着する合板と、該半田を溶融するよ
う該端子片を挾持する間隙が設けられたボンデイングチ
ツプと、該ボンデイングチツプを上昇および降下する駆
動手段とを具備したことを特徴とする部品取外装置。A component removal device that removes an electronic component mounted by soldering a terminal piece to the land of a printed board, which clamps the terminal piece between the plywood to which the printed board is mounted and the solder. A component removal device comprising a bonding chip provided with a gap and a drive means for raising and lowering the bonding chip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11405784U JPS6130274U (en) | 1984-07-26 | 1984-07-26 | Parts removal device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11405784U JPS6130274U (en) | 1984-07-26 | 1984-07-26 | Parts removal device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6130274U true JPS6130274U (en) | 1986-02-24 |
JPH0225252Y2 JPH0225252Y2 (en) | 1990-07-11 |
Family
ID=30673085
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11405784U Granted JPS6130274U (en) | 1984-07-26 | 1984-07-26 | Parts removal device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6130274U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007035693A (en) * | 2005-07-22 | 2007-02-08 | Fujitsu Ltd | Method of removing connector and removing jig |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4851845A (en) * | 1971-10-28 | 1973-07-20 | ||
JPS5873188A (en) * | 1981-10-27 | 1983-05-02 | 富士通株式会社 | Device for automatically removing electronic part from printed board |
-
1984
- 1984-07-26 JP JP11405784U patent/JPS6130274U/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4851845A (en) * | 1971-10-28 | 1973-07-20 | ||
JPS5873188A (en) * | 1981-10-27 | 1983-05-02 | 富士通株式会社 | Device for automatically removing electronic part from printed board |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007035693A (en) * | 2005-07-22 | 2007-02-08 | Fujitsu Ltd | Method of removing connector and removing jig |
Also Published As
Publication number | Publication date |
---|---|
JPH0225252Y2 (en) | 1990-07-11 |
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