JPS614490U - Heat sink for electronic components - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ， ｂ， Ｃは、それぞれ本考案の実施例によ
る放熱板の斜視図、上面図、側面図、第２図ａ， ｂは
、それぞれ従来の放熱板の斜視図、側面図である。 第３図ａ， ｂ〜第６図ａ， ｂは、それぞれ本考案の
他の実施例による放熱板の上面図、側面図である。 １，１′・・・・・・放熱板、２・・・・・・電子部品
、２１・・・・・・リード部、３，４−−−−−−ネジ
、５・・・・・・プリント基板、６・・・・・・溝部、
６′・・・・・・凹部、７・・・・・・棒状部材、７１
・・・・・・筒状部材、８・・・・・・穴部。1A, B, and C are a perspective view, a top view, and a side view of a heat sink according to an embodiment of the present invention, and FIGS. 2A and 2B are a perspective view and a side view, respectively, of a conventional heat sink. . FIGS. 3a and 3b to 6a and 6b are a top view and a side view, respectively, of heat sinks according to other embodiments of the present invention. 1, 1'...Heat sink, 2...Electronic component, 21...Lead part, 3, 4---Screw, 5...・Printed circuit board, 6...Groove section,
6'... Recessed portion, 7... Rod-shaped member, 71
...... Cylindrical member, 8... Hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品が取り付けられる放熱板において、固定具によ
りプリント基板へ押え付けられ、この固定具を前記プリ
ン、ト基板のハンダ付け面でハンダ付けすることによっ
て装着されることを特徴とする電子部品の放熱板。Heat dissipation for electronic components, characterized in that the heat dissipation plate to which electronic components are attached is pressed onto a printed circuit board by a fixture, and is mounted by soldering the fixture to the soldering surface of the printed circuit board. Board.