JPS58150862U - Chip parts mounting device - Google Patents
Chip parts mounting deviceInfo
- Publication number
- JPS58150862U JPS58150862U JP4756882U JP4756882U JPS58150862U JP S58150862 U JPS58150862 U JP S58150862U JP 4756882 U JP4756882 U JP 4756882U JP 4756882 U JP4756882 U JP 4756882U JP S58150862 U JPS58150862 U JP S58150862U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- double
- mounting device
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のチップ部品取付装置の断面図、第2図は
この考案のチップ部品取付装置の一実施例の断面図、第
3図はこの考案のチップ部品取付装置における両面プリ
ント基板にチップ部品を埋め込んだ状態を示す断面図、
第4図は第3図の埋“め込まれたチップを半田付けした
状態を示す平面図である。
11・・・・・・両面プリント基板、12.14・・・
・・・導体、13,15.16・・・・・・チップ部品
、13a。
13b、 15a、 15b、 16a、 1
6b=電極、17.18・・・・・・半田。FIG. 1 is a sectional view of a conventional chip component mounting device, FIG. 2 is a sectional view of an embodiment of the chip component mounting device of this invention, and FIG. 3 is a chip mounted on a double-sided printed circuit board in the chip component mounting device of this invention. A cross-sectional view showing the state in which the parts are embedded,
FIG. 4 is a plan view showing the state in which the embedded chip shown in FIG. 3 is soldered. 11... Double-sided printed circuit board, 12.14...
...Conductor, 13,15.16...Chip component, 13a. 13b, 15a, 15b, 16a, 1
6b=electrode, 17.18...solder.
Claims (1)
れチップ部品をマウントし、上記両面プリント基板の所
定個所に別のチップ部品を埋め込み、この別のチップ部
品の一方の電極を両面プリント基板の一方の導体に係止
させた状態で半田付けしてこの一方の面のチップ部品と
ともに回路を形成し、上記別のチップ部品の他方の電極
を両面プリント基板の他方の面の導体と半田付けしてな
ることを特徴とするチップ部品取付装置。Chip components are mounted at predetermined locations on the front and back surfaces of the double-sided printed circuit board, another chip component is embedded in the predetermined location of the double-sided printed circuit board, and one electrode of this other chip component is connected to one conductor of the double-sided printed circuit board. A circuit is formed with the chip component on one side by soldering it in a state where it is fixed to the board, and the other electrode of the other chip component is soldered to the conductor on the other side of the double-sided printed circuit board. A chip component mounting device featuring:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4756882U JPS58150862U (en) | 1982-04-01 | 1982-04-01 | Chip parts mounting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4756882U JPS58150862U (en) | 1982-04-01 | 1982-04-01 | Chip parts mounting device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58150862U true JPS58150862U (en) | 1983-10-08 |
Family
ID=30058521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4756882U Pending JPS58150862U (en) | 1982-04-01 | 1982-04-01 | Chip parts mounting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58150862U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6310550U (en) * | 1986-07-09 | 1988-01-23 |
-
1982
- 1982-04-01 JP JP4756882U patent/JPS58150862U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6310550U (en) * | 1986-07-09 | 1988-01-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6052660U (en) | Printed board | |
JPS58150862U (en) | Chip parts mounting device | |
JPS6057159U (en) | Electronic components for through-hole printed circuit boards | |
JPS596865U (en) | Electrical component | |
JPS5939971U (en) | Printed board | |
JPS59121175U (en) | terminal mounting device | |
JPS5996870U (en) | printed wiring board | |
JPS5822763U (en) | Mounting device for chip-shaped parts | |
JPS6066068U (en) | Chip parts mounting device | |
JPS59161673U (en) | thick film integrated circuit | |
JPS59149662U (en) | Electrical component mounting device | |
JPS6094861U (en) | printed circuit device | |
JPS6013772U (en) | Printed circuit board for mounting chipped components | |
JPS5956773U (en) | Component mounting structure for double-sided through-hole board | |
JPS59149476U (en) | Spark extinguishing circuit board installed in motor rotor | |
JPS58138370U (en) | LSI package spacer | |
JPS6042761U (en) | printed circuit board equipment | |
JPS599568U (en) | Electronic component mounting structure | |
JPS58189542U (en) | Chip carrier mounting structure | |
JPS5952658U (en) | Chip parts mounted printed circuit board | |
JPS5998671U (en) | Printed board | |
JPS58196869U (en) | Electrical component mounting structure on printed wiring board | |
JPS58193662U (en) | multilayer printed wiring board | |
JPS6085864U (en) | Chip component mounting structure on printed circuit board | |
JPS5858327U (en) | chip parts |