JPS5918468U - Parts removal device - Google Patents

Parts removal device

Info

Publication number
JPS5918468U
JPS5918468U JP11316082U JP11316082U JPS5918468U JP S5918468 U JPS5918468 U JP S5918468U JP 11316082 U JP11316082 U JP 11316082U JP 11316082 U JP11316082 U JP 11316082U JP S5918468 U JPS5918468 U JP S5918468U
Authority
JP
Japan
Prior art keywords
removal device
component
parts removal
parts
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11316082U
Other languages
Japanese (ja)
Inventor
三尾　宏行
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP11316082U priority Critical patent/JPS5918468U/en
Publication of JPS5918468U publication Critical patent/JPS5918468U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａは従来の電子部品の取外し装置を示す斜視図、
第１図すは第１図ａの電子部品の取外し装置の使用例を
示す側面図、第２図は本考案の一実施例の取外し装置を
示す側面図である。 尚図において、１・・・・・・加熱用チップ、２・・・
・・・使用する際に半田を流入する溝、３，１４・・・
・・・ヒーター、４．１７・・・・・・プリント板、５
，１８・・・・・・電子部品、Ａ・・・・・・力方向、
１１・・・・・・リード加熱用チップ、１２・・・・・
・半田流入用溝、１３・・・・・・部品位置出し穴、１
５・・・・・・吸引機、１６・・・・・・高さ調整可能
な吸引口、Ｂ・・・・・・プリント板から電子部品まで
の高さ。FIG. 1a is a perspective view showing a conventional electronic component removal device;
FIG. 1 is a side view showing an example of the use of the electronic component removal device shown in FIG. 1a, and FIG. 2 is a side view showing an example of the removal device of the present invention. In the figure, 1... heating chip, 2...
... Grooves into which solder flows when in use, 3, 14...
... Heater, 4.17 ... Printed board, 5
, 18...Electronic component, A...Force direction,
11... Lead heating chip, 12...
・Solder inflow groove, 13...Component positioning hole, 1
5...Suction machine, 16...Height adjustable suction port, B...Height from printed board to electronic components.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 部品のリードがこの部品と同じ取付けがわで半田付けさ
れている前記部品を取外すための取外し装置において、
前記部品のリードを加熱する手段と前記部品を吸引保持
する手段とを備えていることを特徴とする部品取外し装
置。In a removal device for removing the component, the lead of the component is soldered to the same mounting point as the component,
A component removal device characterized by comprising means for heating leads of the component and means for suctioning and holding the component.
JP11316082U 1982-07-26 1982-07-26 Parts removal device Pending JPS5918468U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11316082U JPS5918468U (en) 1982-07-26 1982-07-26 Parts removal device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11316082U JPS5918468U (en) 1982-07-26 1982-07-26 Parts removal device

Publications (1)

Publication Number Publication Date
JPS5918468U true JPS5918468U (en) 1984-02-04

Family

ID=30262055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11316082U Pending JPS5918468U (en) 1982-07-26 1982-07-26 Parts removal device

Country Status (1)

Country Link
JP (1) JPS5918468U (en)

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