JPS61268416A - Manufacture of resin-molded part - Google Patents
Manufacture of resin-molded partInfo
- Publication number
- JPS61268416A JPS61268416A JP11094585A JP11094585A JPS61268416A JP S61268416 A JPS61268416 A JP S61268416A JP 11094585 A JP11094585 A JP 11094585A JP 11094585 A JP11094585 A JP 11094585A JP S61268416 A JPS61268416 A JP S61268416A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- card
- mold
- substrate
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0097—Glues or adhesives, e.g. hot melts or thermofusible adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、樹脂基体内に基板を有してなる樹脂成形体
の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a resin molded body having a substrate within a resin base.
以下、樹脂成形体としてＩＣカードを例にとり説明する
。ここでＩＣカードとは、従来の磁気ストライブ付のキ
ャッシュカード等に代わって用いられるものであり、カ
ードの基体内にメモリＩＣやＣＰＵその他の半導体片を
内蔵し、従来の磁気ストライプ付カードに比べて数桁以
上の大容量の記憶能力を持たせることができるほか、任
意の演算機能を持たせることができるものである。Hereinafter, an IC card will be explained as an example of the resin molded body. Here, an IC card is used in place of a conventional cash card with a magnetic stripe, etc., and has a memory IC, CPU, and other semiconductor pieces built into the base of the card, and is different from a conventional card with a magnetic stripe. In addition to being able to have a storage capacity that is several orders of magnitude larger than that of other devices, it can also be provided with arbitrary arithmetic functions.
第２図はこのようなＩＣカードの要部を示す断面構成図
であり、図において、６は塩化ビニール等の樹脂を成形
してなるカード基体、２はこのカード基体６内に収納さ
れたプリント基板（以下ＰＣＢと記す）、１０はこのＰ
ＧＥ１上に固着されたＩＣモジュールであり、これはメ
モリＩＣ及びＣＰＵ等のＩＣチップ１．配線３．及び上
記ＩＣチップ１と配線３とを樹脂封止するプリコート部
４からなっている。以下、このＩＣモジュール１０とこ
れが固着されたＰＧＥ２とをＩＣモジュール付ＰＣＢ２
と記す。また、５ａ、５ｂは上記カード基体６の両面に
形成されたラミネートフィルム、７はカード読取り機と
の接点部である。FIG. 2 is a cross-sectional configuration diagram showing the main parts of such an IC card. In the figure, 6 is a card base made of resin such as vinyl chloride, and 2 is a print housed in this card base 6. Board (hereinafter referred to as PCB), 10 is this P
This is an IC module fixed on the GE1, which includes IC chips 1. such as a memory IC and a CPU. Wiring 3. and a precoat section 4 for sealing the IC chip 1 and the wiring 3 with resin. Hereinafter, this IC module 10 and the PGE 2 to which it is fixed will be shown on the IC module attached PCB 2.
It is written as Further, 5a and 5b are laminated films formed on both sides of the card base 6, and 7 is a contact portion with a card reader.
次に上記ＩＣカードの従来の製造方法を第３図に従って
説明する。まず第３図ｉａ）で示すように、ＰＧＥ１上
にＩＣチップ１等を実装し、これらをエポキシ樹脂等で
プリコートしてＩＣモジュール１０を形成する。一方、
第３図（ｂｌに示すように、上記ＩＣモジュール付Ｐ
ＣＢ ２の収納される凹部６ａを有するカード基体６を
射出成形により形成する。そしてこのカード基体６の四
部６ａにＩＣモジュール１０をはめ込み、両者をプレス
して接着し、第２図に示すようなＩＣカードを形成する
。Next, a conventional method for manufacturing the above-mentioned IC card will be explained with reference to FIG. First, as shown in FIG. 3 ia), the IC chip 1 and the like are mounted on the PGE 1, and these are precoated with epoxy resin or the like to form the IC module 10. on the other hand,
Figure 3 (as shown in bl), the P with the above IC module
A card base 6 having a recess 6a in which the CB 2 is accommodated is formed by injection molding. Then, the IC module 10 is fitted into the four parts 6a of the card base 6, and the two parts are pressed and bonded together to form an IC card as shown in FIG.
しかるに、上記のような従来のＩＣカードの製造方法で
は、カードの厚み寸法を精度良くするために、又ＰＣＢ
２と基体６との嵌合部において隙間が生じたり表面に段
差が生じたりしないようにするために、ＰＣＢ２と基体
６のそれぞれを精度良く仕上げる必要があり、その製造
は困難である。However, in the conventional IC card manufacturing method as described above, in order to improve the accuracy of the card thickness, it is necessary to
In order to prevent a gap from forming at the fitting portion between the PCB 2 and the base body 6 and a step from occurring on the surface, it is necessary to finish each of the PCB 2 and the base body 6 with high precision, which is difficult to manufacture.
特にＩＣモジュール１０のプリコート部４を所望の形状
寸法にすることは非常に困難であり、従って従来の製造
方法では精度の良いＩＣカードを得ることができないと
いう問題があった。In particular, it is very difficult to form the precoat portion 4 of the IC module 10 into a desired shape and size, and therefore, there is a problem in that it is not possible to obtain a highly accurate IC card using conventional manufacturing methods.
さらに従来の製造方法では、ＩＣモジュール付ＰＣＢ２
とカード基体６とを粘着シートにより接着するようにし
ており、その接着強度は低く、耐久性にも乏しい。また
両面を接着した際、その嵌合部分に隙間が生じると、そ
こから水等が侵入して接着部分カリ１１離することがあ
り、カードの信頼性が低いという問題があった。Furthermore, in the conventional manufacturing method, PCB2 with IC module
and the card base 6 are bonded together using an adhesive sheet, which has low adhesive strength and poor durability. Further, when the two sides are bonded together, if a gap is created in the fitting portion, water or the like may enter through the gap and cause the bonded portion 11 to separate, resulting in a problem that the reliability of the card is low.
この発明は、かかる点に鑑みてなされたもので、ＩＣカ
ード等の樹脂成形体の製造が従来に比し非常に容易にな
るとともに、信頼性の高い樹脂成形体を得ることのでき
る樹脂成形体の製造方法を提供することを目的としてい
る。This invention has been made in view of the above points, and it is possible to manufacture resin molded products such as IC cards much more easily than before, and to obtain highly reliable resin molded products. The purpose is to provide a manufacturing method for.
この発明に係る樹脂成形体の製造方法は、適当な融点と
接着力を有する熱可塑性樹脂でコーティングされた基板
を金型内の所定位置に設定し、該金型内に樹脂を射出し
て上記基板を該樹脂により一体形成するようにしたもの
である。The method for producing a resin molded article according to the present invention includes setting a substrate coated with a thermoplastic resin having an appropriate melting point and adhesive strength at a predetermined position in a mold, injecting the resin into the mold, and then The substrate is integrally formed with the resin.
この発明においては、Ｔ’Ｃカードにおけるカード基体
等の樹脂基体を射出成形する際、金型内に表面を熱可塑
性樹脂でコーティングした基板を設置して該基板を一体
成形するので、従来のように両者を高精度に仕上げる必
要がなく製造が容易となり、しかも上記熱可塑性樹脂が
接着剤として作 −用するので、上記樹脂基体と基板
とが接着工程なしに強固に接着される。In this invention, when injection molding a resin substrate such as a card substrate in a T'C card, a substrate whose surface is coated with a thermoplastic resin is placed in a mold and the substrate is integrally molded, unlike the conventional method. There is no need to finish both with high precision, making manufacturing easier, and since the thermoplastic resin acts as an adhesive, the resin base and the substrate can be firmly bonded without an adhesive process.
以下、本発明の実施例を図について説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第１図は本発明の一実施例による樹脂成形体の製造方法
を示す図であり、本実施例方法は、ＩＣカードの製造に
おいて、カード基体を射出成形する際、金型内にその表
面に熱可塑性樹脂がコーティングされたＩＣモジュール
付ＰＣＢを設置しておき、該Ｐ’ＣＢを一体成形するよ
うにしたものである。FIG. 1 is a diagram showing a method for manufacturing a resin molded body according to an embodiment of the present invention. In the method of this embodiment, when injection molding a card base in the production of an IC card, the surface of the resin molded body is injected into the mold. A PCB with an IC module coated with thermoplastic resin is installed, and the P'CB is integrally molded.
ここで、本実施例の製造方法を実現するための装置につ
いて、第１図を用いて簡単に説明する。Here, an apparatus for realizing the manufacturing method of this embodiment will be briefly explained using FIG. 1.
第１図（ｂ）において、１１．１２はそれぞれその中央
部に凹部１１ａ’、１２ａが成形された上金型。In FIG. 1(b), reference numerals 11 and 12 indicate upper molds in which recesses 11a' and 12a are formed in the center, respectively.
下金型であり、該両金型１１．１２を型合わせしたとき
、その両凹部１１ａ、１２ａによりカード基体１３と同
形状の空間が形成されるようになっている。そして上記
下金型１２には、■ｃモジュール付ＰＣＢ２の載置され
る個所に吸着用の孔１２ｂが設けられており、この吸着
孔１２ｂは真空ポンプ（図示せず）に接続されている。This is a lower mold, and when both molds 11 and 12 are brought together, a space having the same shape as the card base 13 is formed by both recesses 11a and 12a. The lower mold 12 is provided with a suction hole 12b at a location on which the PCB 2 with the c module is placed, and this suction hole 12b is connected to a vacuum pump (not shown).
なお、１４はカード基体成形用の樹脂が注入される注入
口である。Note that 14 is an injection port into which resin for card base molding is injected.
次に本実施例の製造方法を第１図（ａｌ〜（Ｃ１に従っ
てより詳細に説明する。Next, the manufacturing method of this example will be explained in more detail according to FIGS.
まず、第１図ｆａｔに示すように、ＩＣモジュール付Ｐ
ＣＢ２の、カード基体と接する面全体に適当な融点と接
着力を有するホットメルト接着剤等の熱可塑性樹脂を薄
くコーティングする。そしてこのＩＣモジュール付ＰＣ
Ｂ２を所定位置に載置する。そして真空ポンプを作動さ
せ、吸着用孔１２ｂを介して上記ｒｃモジュール付ＰＣ
Ｂ２を吸引固定する。この状態で、第１図（ｂｌに示す
ように、上金型１１と下金型１２とを型合わせし、図示
しなしくプランジャにより熱可塑性樹脂等のパッケージ
樹脂を注入口１４から型内に射出して該樹脂によりｒｃ
モジュール付ＰＣＢ ２を一体成形する。First, as shown in FIG.
The entire surface of the CB2 in contact with the card base is thinly coated with a thermoplastic resin such as a hot melt adhesive having an appropriate melting point and adhesive strength. And this PC with IC module
Place B2 in a predetermined position. Then, the vacuum pump is activated, and the PC with the rc module is
B2 is fixed by suction. In this state, as shown in FIG. rc by injection and resin
The module-equipped PCB 2 is integrally molded.
ここで、通常射出成形に用いられる樹脂は離型剤を含ん
でおり、従ってＩＣモジュール付ＰＣＢ２を直接樹脂、
％体と一体成形しようとすれば、両者の接着強度が小さ
くなってしまう恐れがある。ところが、本実施例では、
前述のようにＰＣＢ２のカード基体と接する面全体に接
着用の熱可塑性樹脂をコーティングし一体成形するので
、射出成形時にこの樹脂が熔融し、これによりＰＣＢ２
とカード基体の密着性が向上する。Here, the resin normally used for injection molding contains a mold release agent, so the PCB 2 with the IC module is directly molded with the resin.
If it is attempted to be integrally molded with the aluminum alloy, there is a risk that the adhesive strength between the two will be reduced. However, in this example,
As mentioned above, since the entire surface of PCB2 in contact with the card base is coated with adhesive thermoplastic resin and integrally molded, this resin melts during injection molding, and as a result, PCB2
This improves the adhesion of the card base.
そして所定時間後に型を分離して一体成形されたカード
基体１３を取り出し、該カード基体１３の両面に第１図
（Ｃ）に示すように化粧用のラミネートフィルム５ａ、
５ｂを貼付する。After a predetermined period of time, the mold is separated and the integrally molded card base 13 is taken out, and a decorative laminate film 5a, as shown in FIG.
Attach 5b.
このような本実施例によれば、ＩＣモジュール付ＰＣＢ
２を金型内にセットし、射出成形で１シヨソ１へでカー
ド化するようにしたので、従来の製造方法におけるＩＣ
モジュールとカード基板との接着工程を省略することが
できる。またこのような一体形成によれば、ＩＣモジュ
ール１０に寸法誤差があっても該寸法誤差は樹脂により
カバーできるので、従来のようにＩＣモジュール１ｏと
カード基体１３ （金型）の各々の寸法を高精度にする
必要は全くなく、ただＩＣモジュールがカード基体１３
の厚み以内となるよう管理するだけでよい。特にＩＣモ
ジュール１０のプリコート部４０寸法に精度が不要なの
で、その製造は従来に比べ非常に容易となり、大幅なコ
ストダウンを図ることができる。According to this embodiment, the PCB with IC module
2 is set in a mold and made into a card by injection molding, making it possible to create a card by injection molding.
The step of bonding the module and card board can be omitted. Moreover, according to such integral formation, even if there is a dimensional error in the IC module 10, the dimensional error can be covered by the resin, so that the respective dimensions of the IC module 1o and the card base 13 (mold) can be adjusted as usual. There is no need for high precision; it is just that the IC module is the card base 13.
All you have to do is manage it so that the thickness is within . In particular, since precision is not required for the dimensions of the precoat portion 40 of the IC module 10, its manufacture is much easier than in the past, and costs can be significantly reduced.
またこのような製造方法によれば、ＰＣＢ２とカード基
体６との接着強度は従来の粘着シートに比し大きくなる
だけでなく、ＰＣＢ２に接着用の熱可塑性樹脂をコーテ
ィングした後射出成形するので、ＰＣＢ２とカード基体
１３との密着性は向上し、接着強度は著しく増加し、し
かも両者の嵌合部に隙間が生じたりすることもないので
、カードの信頼性は著しく向上する。Moreover, according to such a manufacturing method, not only is the adhesive strength between the PCB 2 and the card base 6 greater than that of a conventional adhesive sheet, but also because the PCB 2 is injection molded after being coated with a thermoplastic resin for adhesive. The adhesion between the PCB 2 and the card base 13 is improved, the adhesive strength is significantly increased, and there is no gap between the two, so the reliability of the card is significantly improved.
さらに、従来装置ではＩＣモジュール１０．ＰＣＢ２の
形状が異なれば、それに応じてカード基体１３の形状、
即ち金型を偏向する必要があったが本実施例ではｒｃカ
ード全体の形状が変更されない限り全て共通の金型で製
造することができる。Furthermore, in the conventional device, the IC module 10. If the shape of the PCB 2 is different, the shape of the card base 13,
That is, it was necessary to deflect the mold, but in this embodiment, all RC cards can be manufactured using a common mold as long as the shape of the entire RC card is not changed.
なお、上記実施例ではカード基体の一部にＩＣモジュー
ル付ＰＣＢを一体成形した場合について説明したが、こ
れは、カード基体の片側全面に一体成形するようにして
もよいのは勿論である。またＰＣＢは下金型だけでなく
上金型にも設置するようにしてもよく、さらにＰＣＢを
スペーサ等を介して両金型の中間に設置するようにして
もよい。In the above embodiment, a case has been described in which the PCB with an IC module is integrally molded on a part of the card base, but it goes without saying that it may be integrally molded on one entire surface of the card base. Further, the PCB may be installed not only in the lower mold but also in the upper mold, and furthermore, the PCB may be installed between the two molds via a spacer or the like.
また、上記実施例では本発明をＩＣカードの製造方法に
適用した場合について説明したが、本発明は樹脂基体内
に基板を有してなる樹脂成形体の製造方法の全てに適用
できるものである。Further, in the above embodiments, the case where the present invention is applied to a method for manufacturing an IC card has been described, but the present invention can be applied to all methods for manufacturing a resin molded body having a substrate within a resin base. .
以上のように、本発明によれば、樹脂基体内に基板を有
してなる樹脂成形体の製造方法において、上記基板に接
着用の熱可塑性樹脂をコーティングした後、該基板を金
型内に設定し、この金型内に樹脂を射出して上記基板を
該樹脂により一体成形するようにしたので、従来に比し
製造が非常に容易になるとともに、基板と樹脂基体との
接着強度は著しく大きくなり、これにより製造される樹
脂成形体の信重頁性を著しく向上できる効果がある。As described above, according to the present invention, in the method for manufacturing a resin molded article having a substrate within a resin base, after coating the substrate with a thermoplastic resin for adhesion, the substrate is placed in a mold. By injecting resin into this mold and integrally molding the board with the resin, manufacturing is much easier than before, and the adhesive strength between the board and the resin base is significantly improved. This has the effect of significantly improving the reliability of the resin molded product produced.
第１図ｆａ）ないしくＣ１は本発明の一実施例によるＩ
Ｃカードの製造方法を説明するための図、第２図は一般
的なＩＣカードの断面構成図、第３図（ａ）。
（ｂ）は従来のＩＣカードの製造方法を説明するための
図である。
２・・・プリント基板（ＰＣＢ） 、１０・・・ＩＣモ
ジュール、１１・・・上金型、１２・・・下金型、１３
・・・カード基体、１５・・・接着用熱可塑性樹脂。
なお図中同一符号は同−又は相当部分を示す。FIG. 1 fa) or C1 is an I according to an embodiment of the present invention.
FIG. 2 is a diagram for explaining the manufacturing method of a C card, and FIG. 3(a) is a cross-sectional configuration diagram of a general IC card. (b) is a diagram for explaining a conventional IC card manufacturing method. 2... Printed circuit board (PCB), 10... IC module, 11... Upper mold, 12... Lower mold, 13
... Card base, 15 ... Thermoplastic resin for adhesion. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
方法であって、上記基板の樹脂基体と接する面全体に所
定の融点と接着力を有する熱可塑性樹脂を被覆し、該基
板を金型内の所定位置に設定し、該金型内に樹脂を射出
して上記基板を該樹脂により一体成形することを特徴と
する樹脂成形体の製造方法。(1) A method for manufacturing a resin molded body having a substrate within a resin base, wherein the entire surface of the substrate in contact with the resin base is coated with a thermoplastic resin having a predetermined melting point and adhesive strength, and the substrate A method for manufacturing a resin molded body, comprising: setting the substrate at a predetermined position in a mold, injecting resin into the mold, and integrally molding the substrate with the resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11094585A JPS61268416A (en) | 1985-05-23 | 1985-05-23 | Manufacture of resin-molded part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11094585A JPS61268416A (en) | 1985-05-23 | 1985-05-23 | Manufacture of resin-molded part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61268416A true JPS61268416A (en) | 1986-11-27 |
Family
ID=14548533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11094585A Pending JPS61268416A (en) | 1985-05-23 | 1985-05-23 | Manufacture of resin-molded part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61268416A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0913791A1 (en) * | 1997-10-30 | 1999-05-06 | Navitas Co., Limited | Method for manufacturing card product and manufacturing apparatus therefor |
| WO2003005296A1 (en) | 2001-07-04 | 2003-01-16 | Rafsec Oy | An injection moulded product and a method for its manufacture |
| KR100819295B1 (en) | 2005-04-22 | 2008-04-02 | 가부시키가이샤 덴소 | Electronic circuit device and manufacturing method of the same |
| CN111645271A (en) * | 2020-06-12 | 2020-09-11 | 瑞声科技(新加坡)有限公司 | Injection mold for manufacturing basin stand structure of sound production device |
| US11433581B2 (en) | 2019-11-08 | 2022-09-06 | Aptiv Technologies Limited | Injection molding a device such as a cable holder with an integrated wireless tagging foil |
-
1985
- 1985-05-23 JP JP11094585A patent/JPS61268416A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0913791A1 (en) * | 1997-10-30 | 1999-05-06 | Navitas Co., Limited | Method for manufacturing card product and manufacturing apparatus therefor |
| US6090323A (en) * | 1997-10-30 | 2000-07-18 | Navitas Co., Ltd. | Method for manufacturing card product |
| WO2003005296A1 (en) | 2001-07-04 | 2003-01-16 | Rafsec Oy | An injection moulded product and a method for its manufacture |
| JP2004533947A (en) * | 2001-07-04 | 2004-11-11 | ラフセック オサケ ユキチュア | Injection molded product and method of manufacturing the same |
| KR100819295B1 (en) | 2005-04-22 | 2008-04-02 | 가부시키가이샤 덴소 | Electronic circuit device and manufacturing method of the same |
| US7458823B2 (en) | 2005-04-22 | 2008-12-02 | Denso Corporation | Electronic circuit device and manufacturing method of the same |
| US7604765B2 (en) | 2005-04-22 | 2009-10-20 | Denso Corporation | Electronic circuit device and manufacturing method of the same |
| US11433581B2 (en) | 2019-11-08 | 2022-09-06 | Aptiv Technologies Limited | Injection molding a device such as a cable holder with an integrated wireless tagging foil |
| CN111645271A (en) * | 2020-06-12 | 2020-09-11 | 瑞声科技(新加坡)有限公司 | Injection mold for manufacturing basin stand structure of sound production device |
| CN111645271B (en) * | 2020-06-12 | 2022-04-29 | 瑞声科技(新加坡)有限公司 | Injection mold for manufacturing basin stand structure of sound production device |
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