JPS61268418A - Manufacture of resin-molded part - Google Patents

Manufacture of resin-molded part

Info

Publication number
JPS61268418A
JPS61268418A JP60110948A JP11094885A JPS61268418A JP S61268418 A JPS61268418 A JP S61268418A JP 60110948 A JP60110948 A JP 60110948A JP 11094885 A JP11094885 A JP 11094885A JP S61268418 A JPS61268418 A JP S61268418A
Authority
JP
Japan
Prior art keywords
resin
mold
card
board
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60110948A
Other languages
Japanese (ja)
Other versions
JPH06353B2 (en
Inventor
Tsugio Kurisu
栗栖　次男
Shojiro Kotai
小鯛　正二郎
Masatoshi Kimura
正俊 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ryoden Kasei Co Ltd
Mitsubishi Electric Corp
Original Assignee
Ryoden Kasei Co Ltd
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ryoden Kasei Co Ltd, Mitsubishi Electric Corp filed Critical Ryoden Kasei Co Ltd
Priority to JP60110948A priority Critical patent/JPH06353B2/en
Publication of JPS61268418A publication Critical patent/JPS61268418A/en
Publication of JPH06353B2 publication Critical patent/JPH06353B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B29C33/14—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall
    • B29C33/18—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels against the mould wall using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14155—Positioning or centering articles in the mould using vacuum or suction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Credit Cards Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE:To easily and highly accurately manufacture a resin-molded part, on one surface of which a board is precisely positioned, by a method wherein the board is set in a mold, which has rail-shaped projections for positioning the board nd, after that, resin is injected in the mold. CONSTITUTION:The manufacture of an IC card is taken for example; firstly, a printed wiring board 2 having an IC module 10 thereon is set in a lower mold 12 having rail-shaped projections (in the direction perpendicular to the page). Secondly, an upper mold 11 is put on the mold 12 so as to inject resin in the molds 11 and 12 in order to mold a card substrate 13. The board 2 can be easily and highly accurately set. The board 2 may be set by suction through a suction hole 12b provided on the lower mold.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、樹脂基体の一面に基板を有してなる樹脂成
形体の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a resin molded body having a substrate on one surface of a resin base.

〔従来の技術〕[Conventional technology]

以下、樹脂成形体としてＩＣカードを例にとり説明する
。ここでＩＣカードとは、従来の磁気ストライプ付のキ
ャッシュカード等に代わって用いられるものであり、カ
ードの基体内にメモリＩＣやＣＰＵその他の半導体片を
内蔵し、従来の磁気ストライプ付カードに比べて数桁以
上の大容量の記憶能力を持たせることができるほか、任
意の演算機能を持たせることができるものである。Hereinafter, an IC card will be explained as an example of the resin molded body. Here, IC cards are used in place of conventional cash cards with magnetic stripes, etc., and have memory ICs, CPUs, and other semiconductor pieces built into the base of the card, and are more sophisticated than conventional cards with magnetic stripes. In addition to being able to have a large storage capacity of several digits or more, it can also be provided with arbitrary arithmetic functions.

第３図はこのようなＩＣカードの要部を示す断面構成図
であり、図において、６は塩化ビニール等の樹脂を成形
してなるカード基体、２はこのカード基体６内に収納さ
れたプリント基板（以下ＰＣＢと記す）、１０はこのＰ
ＣＢ’２上に固着されたＩＣモジュールであり、これは
メモリＩＣ及びＣＦ）Ｕ等の■ｃチップ１．配線３．及
び上記ＩＣ≠ツブ１と配線３とを樹脂封止するプリコー
ト部４からなっている。以下、このＩＣモジュール１０
とこれが固着されたＰＣＢ２とをＩＣモジュール付ＰＣ
Ｂ２と記す。また、５．ｉ、５ｂは上記カード基体６の
両面に形成されたラミネートフィルム、７はカード読取
り機との接点部であり、図では便宜上１個しか示してい
ないが、通常この接点部は複数形成されている。FIG. 3 is a cross-sectional configuration diagram showing the main parts of such an IC card. In the figure, 6 is a card base made of resin such as vinyl chloride, and 2 is a print housed in this card base 6. Board (hereinafter referred to as PCB), 10 is this P
This is an IC module fixed on CB'2, which includes memory ICs, CF) U, etc. c chips 1. Wiring 3. and a precoat portion 4 for sealing the IC≠tube 1 and wiring 3 with resin. Below, this IC module 10
and PCB2 to which this is fixed to a PC with an IC module.
It is written as B2. Also, 5. i and 5b are laminated films formed on both sides of the card base 6, and 7 is a contact portion with the card reader. Although only one contact portion is shown in the figure for convenience, usually a plurality of these contact portions are formed. .

次に上記ＩＣカードの従来の製造方法を第４図に従って
説明する。まず第４図ｉａｌで示すように、ＰＧＥ１上
にＩＣチップ１等を実装し、これらをエポキシ樹脂等で
プリコートしてＩＣモジュール１０を形成する。一方、
第４図（ｂ）に示すように、上記ＩＣモジュール付ＰＣ
Ｂ２の収納される凹部６ａを有するカード基体６を射出
成形により形成する。そしてこのカード基体６の凹部６
ａにＩＣモジュール１０をはめ込み、両者をプレスして
接着し、第２図に示すようなＩＣカードを形成する。Next, a conventional method of manufacturing the above-mentioned IC card will be explained with reference to FIG. First, as shown in FIG. 4 ial, the IC chip 1 and the like are mounted on the PGE 1 and precoated with epoxy resin or the like to form the IC module 10. on the other hand,
As shown in FIG. 4(b), the PC with the above IC module
A card base 6 having a recess 6a in which B2 is accommodated is formed by injection molding. And the recess 6 of this card base 6
The IC module 10 is fitted into the a, and both are pressed and bonded together to form an IC card as shown in FIG.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかるに、上記のような従来のＩＣカードの製造方法で
は、カードの厚み寸法を精度良くするために、又ＰＣＢ
２と基体６との嵌合部において隙間が生じたり表面に段
差が生じたりしないようにするために、ＰＧＥ２と基体
６のそれぞれを精度良く仕上げる必要があり、その製造
は困難である。However, in the conventional IC card manufacturing method as described above, in order to improve the accuracy of the card thickness, it is necessary to
In order to prevent gaps from forming at the fitting portion between the PGE 2 and the base 6 and steps from forming on the surface, it is necessary to finish each of the PGE 2 and the base 6 with high precision, which is difficult to manufacture.

特にＩＣモジュール１０のプリコート部４を所望の形状
寸法にすることは非常に困難であり、従って従来の製造
方法では精度の良いＩＣカードを得ることができないと
いう問題があった。In particular, it is very difficult to form the precoat portion 4 of the IC module 10 into a desired shape and size, and therefore, there is a problem in that it is not possible to obtain a highly accurate IC card using conventional manufacturing methods.

さらに従来の製造方法では、ＩＣモジュール付ＰＣＢ２
とカード基体６とを粘着シートにより接着するようにし
ており、その接着強度は低く、耐久性にも乏しい。また
両面を接着した際、その嵌合部分に隙間が生しると、そ
こから水等が侵入して接着部分が剥離することがあり、
カートの信頼性が低いという問題があった。Furthermore, in the conventional manufacturing method, PCB2 with IC module
and the card base 6 are bonded together using an adhesive sheet, which has low adhesive strength and poor durability. Also, if there is a gap in the mating area when both sides are glued together, water may enter through there and the bonded area may peel off.
There was a problem with the cart being unreliable.

この発明は、かかる点に鑑みてなされたもので、ＩＣカ
ード等の樹脂成形体の製造が従来に比し非常に容易にな
るとともに、信頼性の高い樹脂成形体を得ることのでき
る樹脂成形体の製造方法を提供することを目的としてい
る。This invention has been made in view of the above points, and it is possible to manufacture resin molded products such as IC cards much more easily than before, and to obtain highly reliable resin molded products. The purpose is to provide a manufacturing method for.

〔問題点を解決するための手段〕[Means for solving problems]

この発明に係る樹脂成形体の製造方法は、基板位置決め
用のレール状突起が形成された金型内に基板を設置し、
該金型内に樹脂を射出して上記基板を該樹脂により一体
成形するようにしたものである。The method for manufacturing a resin molded body according to the present invention includes placing a substrate in a mold in which rail-like protrusions for positioning the substrate are formed;
A resin is injected into the mold, and the substrate is integrally molded with the resin.

〔作用〕[Effect]

この発明においては、樹脂基体を射出成形する際、基板
位置決め用のレール状突起が形成された金型内に該レー
ル状突起を利用して基板を設置し、該基板を樹脂により
一体成形するので、従来のように両者を高精度に仕上げ
る必要がなく、しかも金型内に基板を簡単に精度良くセ
ットして樹脂基体と基板とが接着工程なしに強固に接着
される。In this invention, when injection molding a resin base, the board is placed in a mold in which rail-like projections for positioning the board are formed, and the board is integrally molded with resin. There is no need to finish both with high precision as in the conventional method, and the resin base and the board can be firmly bonded together without any bonding process by simply setting the substrate in the mold with high precision.

〔実施例〕〔Example〕

以下、本発明の実施例を図について説明する。 Embodiments of the present invention will be described below with reference to the drawings.

第１図は本発明の一実施例による樹脂成形体の製造方法
を示す図であり、本実施例方法は、ＩＣカードの製造に
おいて、カード基体を射出成形する際、その金型内にＩ
Ｃモジュール付ＰＣＢを設置しておき、該ＰＣＢを一体
成形するようにしたものである。FIG. 1 is a diagram showing a method for manufacturing a resin molded body according to an embodiment of the present invention. In the method of this embodiment, when injection molding a card base in the production of an IC card, an I.
A PCB with a C module is installed in advance, and the PCB is integrally molded.

ここで、本実施例の製造方法を実現するための装置につ
いて、第１図を用いて簡単に説明する。Here, an apparatus for realizing the manufacturing method of this embodiment will be briefly explained using FIG. 1.

第１図（ｂ）において、１１．１２はそれぞれその中央
部に凹部１１ａ、Ｉ２ａが成形された上金型。In FIG. 1(b), reference numerals 11 and 12 designate upper molds in which recesses 11a and I2a are formed in their central parts, respectively.

下金型であり、該両金型１１．１２を型合わせしたとき
、その両凹部１１ａ、１２ａによりカード基体１３と同
形状の空間が形成されるようになっている。そして上記
下金型１２には、ＩＣモジュー゛ル付ＰＣＢ２の載置さ
れる個所に、基板位置決め用のレール状突起１２ｃが図
中紙面に対して垂直な方向に、即ちカードの長手方向に
沿って２本形成されている。またこの２本のレール状突
起１２ｃで挟まれる領域には複数（図では１個所しか示
していない）の吸着用の孔１２ｂが設けられており、こ
の吸着用孔１２ｂは真空ポンプ（図示せず）に接続され
ている。なお、１４はカード基体成形用の樹脂が注入さ
れる注入口である。This is a lower mold, and when both molds 11 and 12 are brought together, a space having the same shape as the card base 13 is formed by both recesses 11a and 12a. The lower mold 12 has a rail-like protrusion 12c for positioning the board at a location where the IC module attached PCB 2 is placed in a direction perpendicular to the plane of the paper in the figure, that is, along the longitudinal direction of the card. Two lines are formed. In addition, a plurality of suction holes 12b (only one is shown in the figure) are provided in the area sandwiched between the two rail-like protrusions 12c. )It is connected to the. Note that 14 is an injection port into which resin for card base molding is injected.

次に本実施例の製造方法を第１図（ａｌ〜（Ｃ）に従っ
てより詳細に説明する。Next, the manufacturing method of this example will be explained in more detail with reference to FIGS.

まず、第１図ｆａｌに示すように、レール状突起１２ｃ
を利用してＩＣモジュール付ＰＣＢ２を載置する。そし
て真空ポンプを作動させ、吸着用孔１２ｂを介して上記
ＩＣモジュール付ＰＣ，Ｂ２を吸引固定する。この状態
で、第１図（ｂｌに示すように、上金型１１と下金型１
２とを型合わせし、図示しないプランジャにより樹脂を
注入口１４から型内に射出して該樹脂によりＩＣモジュ
ール付ＰＣＢ２を一体成形する。そして所定時間後に型
を分離して一体成形されたカード基体１３を取り出し、
該カード基体１３の両面に第１図（Ｃ１に示すように化
粧用のラミネートフィルム５ａ、５ｂを貼付する。この
ようにして形成されたＩＣカードの平面図を第２図に示
す。図中、１５は下金型１２のレール状突起１２Ｃによ
り形成されたレール状溝である。First, as shown in FIG. 1, the rail-shaped protrusion 12c
The IC module attached PCB 2 is placed using the PCB 2. Then, the vacuum pump is operated to suction and fix the PC with IC module B2 through the suction hole 12b. In this state, as shown in FIG.
2 are molded together, resin is injected into the mold from the injection port 14 using a plunger (not shown), and the PCB 2 with the IC module is integrally molded with the resin. After a predetermined time, the mold is separated and the integrally molded card base 13 is taken out.
Cosmetic laminate films 5a and 5b are attached to both sides of the card base 13 as shown in FIG. 1 (C1). A plan view of the IC card thus formed is shown in FIG. 2. In the figure, Reference numeral 15 denotes a rail-shaped groove formed by the rail-shaped projection 12C of the lower mold 12.

このような本実施例によれば、ＩＣモジュール付ＰＣＢ
２を金型内にセントし、射出成形で１シヨツトでカード
化するようにしたので、従来の製造方法における接着工
程なしに両者を強固に接着させることができ、カードの
信頼性は著しく向上する。またこのような一体形成によ
れば、ＩＣモジュール１０に寸法誤差があっても該寸法
誤差は樹脂によりカバーできるので、従来のようにＩＣ
モジュール１０とカード基体１３（金型）の各々の寸法
を高精度にする必要は全くなく、ただＩＣモジュールが
カード基体１３の厚み以内となるよう管理するだけでよ
い。特にＩＣモジュール１０のプリコート部４の寸法に
精度が不要なので、その製造は従来に比べ非常に容易と
なり、大幅なコストダウンを図ることができる。According to this embodiment, the PCB with IC module
2 into a mold and molded into a card in one shot by injection molding, it is possible to firmly bond the two without the gluing process of conventional manufacturing methods, significantly improving the reliability of the card. . Moreover, according to such integral formation, even if there is a dimensional error in the IC module 10, the dimensional error can be covered by the resin, so that the IC module 10 can be
There is no need to make the dimensions of the module 10 and the card base 13 (mold) highly accurate; it is only necessary to manage the IC module so that the thickness is within the thickness of the card base 13. In particular, since there is no need for precision in the dimensions of the precoat portion 4 of the IC module 10, its manufacture is much easier than in the past, and costs can be significantly reduced.

また本実施例では、下金型１２にレール状突起１２ｃを
設け、これによりＰＣＢ２の位置決めを行なうようにし
たので、ＰＣＢ２の金型内へのセントが容易に、しかも
高精度に行なえ、外部接触用の端子の位置ずれ等を防止
することができる。In addition, in this embodiment, the lower mold 12 is provided with a rail-like protrusion 12c, which positions the PCB 2. Therefore, the PCB 2 can be easily and accurately placed into the mold, and external contact can be easily achieved. It is possible to prevent misalignment of the terminals for use.

さらにこのレール状突起１２ｃを設けたことにより、成
形後の完成品には第２図で示すようにレール状の溝１５
が形成され、従ってカードリーダ側にこのレール状溝１
５に嵌合するガイドレールを設けておけば、これらによ
りＩＣカードが裏１表逆にリーグへ挿入されることもな
く、該操作を防止することができる。Furthermore, by providing this rail-shaped protrusion 12c, the finished product after molding has a rail-shaped groove 15 as shown in FIG.
Therefore, this rail-shaped groove 1 is formed on the card reader side.
By providing a guide rail that fits into the IC card 5, it is possible to prevent the IC card from being inserted into the league with the back side reversed, and this operation can be prevented.

なお、上記実施例ではカード基体の片側−面にＩＣモジ
ュール付ＰＣＢを一体成形した場合について説明したが
、これは、カード基体の両面に一体成形するようにして
もよい。In the above embodiment, a case has been described in which the PCB with an IC module is integrally molded on one side of the card base, but it may be integrally molded on both sides of the card base.

また、上記実施例では本発明をＩＣカードの製造方法に
適用した場合について説明したが、本発明は樹脂基体の
一面に基板を有してなる樹脂成形体の製造方法の全てに
適用できるものである。Further, in the above embodiments, the case where the present invention is applied to a method of manufacturing an IC card has been described, but the present invention can be applied to all methods of manufacturing a resin molded body having a substrate on one side of a resin base. be.

〔発明の効果〕〔Effect of the invention〕

以上のように、本発明によれば、樹脂基体の少なくとも
一面に基板を有してなる樹脂成形体の製造方法において
、基板位置決め用のレール状突起が形成された金型内に
基板を設置し、この金型内に樹脂を射出して上記基板を
該樹脂により一体成形するようにしたので、従来に比し
製造が非常に容易になり、しかもこれにより製造される
樹脂成形体の信頼性及び精度を著しく向上できる効果が
ある。As described above, according to the present invention, in a method for manufacturing a resin molded body having a substrate on at least one surface of a resin base, the substrate is placed in a mold in which rail-like protrusions for positioning the substrate are formed. Since the resin is injected into this mold and the substrate is integrally molded with the resin, manufacturing is much easier than in the past, and the reliability and reliability of the resin molded body manufactured thereby are improved. This has the effect of significantly improving accuracy.

【図面の簡単な説明】[Brief explanation of drawings]

第１図（ａｌないしｔｃ＋は本発明の一実施例による■
′　Ｃカードの製造方法を説明するための図、第２図は
該方法により製造されたＩＣカードの平面図、第３図は
一般的なＩＣカードの断面構成図、第４図（ａｌ、　（
ｂ）は従来のＩＣカードの製造方法を説明するための図
である。 ２・・・プリント基板（’ＰＣＢ）　、１０・・・ＩＣ
モジュール、１１・・・上金型、１２・・・下金型、１
２ｃ・・・レール状突起、１３・・・カード基体。 なお図中同一符号は同−又は相当部分を示す。FIG. 1 (al to tc+ are according to one embodiment of the present invention)
' Figure 2 is a plan view of an IC card manufactured by the method, Figure 3 is a cross-sectional diagram of a general IC card, Figure 4 is a diagram for explaining the method of manufacturing a C card, (
b) is a diagram for explaining a conventional IC card manufacturing method. 2...Printed circuit board ('PCB), 10...IC
Module, 11... Upper mold, 12... Lower mold, 1
2c...Rail-like projection, 13...Card base. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

【特許請求の範囲】[Claims] （１）樹脂基体の一面に基板を有してなる樹脂成形体の
製造方法であって、上記基板を、その所定位置に基板位
置決め用のレール状突起が形成された金型内に設置し、
該金型内に樹脂を射出して上記基板を該樹脂により一体
成形することを特徴とする樹脂成形体の製造方法。(1) A method for manufacturing a resin molded body having a substrate on one surface of a resin base, the substrate being placed in a mold in which a rail-like protrusion for positioning the substrate is formed at a predetermined position,
A method for manufacturing a resin molded body, comprising injecting a resin into the mold and integrally molding the substrate with the resin.
JP60110948A 1985-05-23 1985-05-23 Method for manufacturing resin molded body Expired - Lifetime JPH06353B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60110948A JPH06353B2 (en) 1985-05-23 1985-05-23 Method for manufacturing resin molded body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60110948A JPH06353B2 (en) 1985-05-23 1985-05-23 Method for manufacturing resin molded body

Publications (2)

Publication Number Publication Date
JPS61268418A true JPS61268418A (en) 1986-11-27
JPH06353B2 JPH06353B2 (en) 1994-01-05

Family

ID=14548602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60110948A Expired - Lifetime JPH06353B2 (en) 1985-05-23 1985-05-23 Method for manufacturing resin molded body

Country Status (1)

Country Link
JP (1) JPH06353B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03296A (en) * 1989-05-27 1991-01-07 Mitsubishi Kasei Corp Substrate for ic card and preparation thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03296A (en) * 1989-05-27 1991-01-07 Mitsubishi Kasei Corp Substrate for ic card and preparation thereof

Also Published As

Publication number Publication date
JPH06353B2 (en) 1994-01-05

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