JPH0356648B2 - - Google Patents
Info
- Publication number
- JPH0356648B2 JPH0356648B2 JP60170142A JP17014285A JPH0356648B2 JP H0356648 B2 JPH0356648 B2 JP H0356648B2 JP 60170142 A JP60170142 A JP 60170142A JP 17014285 A JP17014285 A JP 17014285A JP H0356648 B2 JPH0356648 B2 JP H0356648B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- mold
- substrate
- card
- movable pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 46
- 239000011347 resin Substances 0.000 claims description 46
- 239000000758 substrate Substances 0.000 claims description 32
- 238000004519 manufacturing process Methods 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 3
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 21
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 21
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- MINPZZUPSSVGJN-UHFFFAOYSA-N 1,1,1,4,4,4-hexachlorobutane Chemical class ClC(Cl)(Cl)CCC(Cl)(Cl)Cl MINPZZUPSSVGJN-UHFFFAOYSA-N 0.000 description 4
- 101150049492 DVR gene Proteins 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C45/14073—Positioning or centering articles in the mould using means being retractable during injection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C45/14073—Positioning or centering articles in the mould using means being retractable during injection
- B29C2045/14081—Positioning or centering articles in the mould using means being retractable during injection centering means retracted by the injection pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C2045/14163—Positioning or centering articles in the mould using springs being part of the positioning means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、樹脂基体の一面に基板を有してな
る樹脂成形体の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a resin molded body having a substrate on one side of a resin base.
以下、樹脂成形体としてICカードを例にとり
説明する。ここでICカードとは、従来の磁気ス
トライプ付のキヤツシユカード等に代わつて用い
られるものであり、カードの基体内にメモリIC
やCPUその他の半導体片を内蔵し、従来の磁気
ストライプ付カードに比べて数桁以上の大容量の
記憶能力を持たせることができるほか、任意の演
算機能を持たせることができるものである。
Hereinafter, an IC card will be explained as an example of the resin molded body. The term "IC card" here refers to a card that is used in place of a conventional cash card with a magnetic stripe, and has a memory IC inside the base of the card.
It has a built-in CPU, CPU, and other semiconductor chips, and can have a storage capacity several orders of magnitude higher than that of conventional cards with magnetic stripes, and can also be equipped with arbitrary arithmetic functions.
第２図はこのようなICカードの要部を示す断
面構成図であり、図において、６は塩化ビニール
等の樹脂を成形してなるカード基体、２はこのカ
ード基体６内に収納されたプリント基板（以下
PCBと記す）、１０はこのPCB２上に固着された
ICモジユールであり、これはメモリIC及びCPU
等のICチツプ１、配線３、及び上記ICチツプ１
と配線３とを樹脂封止するプリコート部４からな
つている。以下、このICモジユール１０とこれ
が固着されたPCB２とをICモジユール付PCB２
と記す。また、５ａ，５ｂは上記カード基体６の
両面に形成されたラミネートフイルム、７はカー
ド読取り機との接点部である。 FIG. 2 is a cross-sectional configuration diagram showing the main parts of such an IC card. In the figure, 6 is a card base made of resin such as vinyl chloride, and 2 is a print housed in this card base 6. Substrate (hereinafter
PCB), 10 is fixed on this PCB2
IC module, which includes memory IC and CPU
etc. IC chip 1, wiring 3, and the above IC chip 1
and wiring 3 are sealed with resin. Below, this IC module 10 and the PCB 2 to which it is fixed are referred to as PCB 2 with IC module.
It is written as Further, 5a and 5b are laminated films formed on both sides of the card base 6, and 7 is a contact portion with a card reader.
次に上記ICカードの従来の製造方法を第３図
に従つて説明する。まず第３図ａで示すように、
PCB２上にICチツプ１等を実装し、これらをエ
ポキシ樹脂等でプリコートしてICモジユール１
０を形成する。一方、第３図ｂに示すように、上
記ICモジユール付PCB２の収納される凹部６ａ
を有するカード基体６を射出成形により形成す
る。そしてこのカード基体６の凹部６ａにICモ
ジユール１０をはめ込み、両者をプレスして接着
し、第２図に示すようなICカードを形成する。 Next, a conventional method of manufacturing the above-mentioned IC card will be explained with reference to FIG. First, as shown in Figure 3a,
IC chips 1 etc. are mounted on PCB 2, and these are pre-coated with epoxy resin etc. to form IC module 1.
form 0. On the other hand, as shown in FIG.
A card base 6 having the following properties is formed by injection molding. Then, the IC module 10 is fitted into the recess 6a of the card base 6, and the two are pressed and bonded together to form an IC card as shown in FIG.
しかるに、上記のような従来のICカードの製
造方法では、カードの厚み寸法を精度良くするた
めに、又PCB２と基体６との嵌合部において隙
間が生じたり表面に段差が生じたりしないよう
に、PCB２と基体６のそれぞれを精度良く仕上
げる必要があり、その製造は困難である。特に
ICモジユール１０のプリコート部４を所望の形
状寸法にすることは非常に困難であり、従つて従
来の製造方法では精度の良いICカードを得るこ
とができないという問題があつた。
However, in the conventional IC card manufacturing method as described above, in order to improve the accuracy of the card thickness dimension, and to prevent gaps from forming at the fitting part between the PCB 2 and the base 6 and steps from forming on the surface. , it is necessary to finish each of the PCB 2 and the base 6 with high precision, and manufacturing thereof is difficult. especially
It is very difficult to form the precoated portion 4 of the IC module 10 into a desired shape and size, and therefore, there is a problem in that it is not possible to obtain a highly accurate IC card using conventional manufacturing methods.
さらに従来の製造方法では、ICモジユール付
PCB２とカード基体６とを粘着シートにより接
着するようにしており、その接着強度は低く、耐
久性にも乏しい。また両者を接着した際、その嵌
合部分に隙間が生じると、そこから水等が侵入し
て接着部分が剥離することがあり、カードの信頼
性が低いという問題があつた。 Furthermore, with conventional manufacturing methods,
The PCB 2 and the card base 6 are bonded together using an adhesive sheet, which has low adhesive strength and poor durability. Further, when the two are bonded together, if a gap is created in the fitting portion, water or the like may enter through the gap and the bonded portion may peel off, resulting in a problem that the reliability of the card is low.
この発明は、かかる点に鑑みてなされたもの
で、ICカード等の樹脂成形体の製造が従来に比
し非常に容易になるとともに、信頼性の高い樹脂
成形体を得ることのできる樹脂成形体の製造方法
を提供することを目的としている。 This invention has been made in view of the above points, and it is possible to manufacture resin molded products such as IC cards much more easily than before, and also to make it possible to obtain highly reliable resin molded products. The purpose is to provide a manufacturing method for.
この発明に係る樹脂成形体の製造方法は、電子
部品等を搭載した回路基板を樹脂封止して樹脂成
形体を製造するための金型として、その内面の所
定位置に出没可能な基板位置決め用可動ピンを有
するものを用い、上記基板の金型内での位置決め
を、上記基板に形成した貫通孔に上記可動ピンを
挿入して行い、樹脂充填時には上記可動ピンを退
却させて上記基板の貫通孔内にも樹脂が充填され
るようにしたものである。
The method for manufacturing a resin molded body according to the present invention is used as a mold for manufacturing a resin molded body by resin-sealing a circuit board mounted with electronic components, etc., and is used for positioning a board that can be retracted from a predetermined position on the inner surface of the mold. Using a device with a movable pin, the substrate is positioned within the mold by inserting the movable pin into a through hole formed in the substrate, and when filling with resin, the movable pin is retreated to allow the substrate to penetrate through the substrate. The holes are also filled with resin.
この発明においては、ICカードにおけるカー
ド基体等の樹脂基体を射出成形する際、その金型
内に基板を設置してこれを一体成形するので、従
来のように両者を高精度に仕上げる必要がなく、
しかも樹脂基体と基板とが接着工程なしに強固に
接着され、さらに上記金型内に基板を設置する
際、基板の金型内での位置決めを、上記基板に形
成した貫通孔に上記可動ピンを挿入して行うの
で、容易に精度良く基板がセツトされる。
In this invention, when injection molding a resin substrate such as a card substrate for an IC card, the substrate is placed in the mold and molded integrally, so there is no need to finish both with high precision as in the past. ,
Moreover, the resin base and the substrate are firmly bonded without an adhesive process, and furthermore, when installing the substrate in the mold, the movable pin is inserted into the through hole formed in the substrate to position the substrate in the mold. Since the board is inserted, the board can be set easily and accurately.
またこのように該金型内の可動ピン及び基板の
貫通孔を用いて位置決めを行つた後の樹脂充填時
には、上記可動ピンを没入させて上記基板の貫通
孔内にも樹脂が充填されるようにしたので、上記
基板貫通孔に充填された樹脂のアンカー効果によ
り基板と樹脂基体とを強固に結合することができ
る。 Furthermore, when filling the resin after positioning using the movable pin in the mold and the through hole of the substrate, the movable pin is recessed so that the resin is also filled into the through hole of the substrate. Therefore, the substrate and the resin base can be firmly bonded by the anchor effect of the resin filled in the substrate through-hole.
以下、本発明の実施例を図について説明する。
第１図は本発明の一実施例による樹脂成形体の製
造方法を示す図であり、本実施例方法は、ICカ
ードの製造において、カード基体を射出成形する
際、その金型にICモジユール付PCBを設置して
おき、該PCBを一体成形するようにしたもので
ある。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram showing a method for manufacturing a resin molded body according to an embodiment of the present invention. In the method of this embodiment, when a card base is injection molded in the production of an IC card, an IC module is attached to the mold. A PCB is installed in advance and the PCB is integrally molded.
ここで、本実施例の製造方法を実現するための
装置について、第１図を用いて簡単に説明する。
第１図ｂにおいて、１１，１２はそれぞれの中央
部に凹部１１ａ，１２ａが成形された上金型、下
金型であり、該両金型１１，１２を型合わせした
とき、その両凹部１１ａ，１２ａによりカード基
体１３と同形状の空間が形成されるようになつて
いる。そして上記下金型１２には、ICモジユー
ル付PCB２の載置される個所に、複数の位置決
め用の可動ピン１５が出没自在に設けられてお
り、この可動ピン１５はばね１６により、所定の
圧力でPCB２の厚みとほぼ同量だけ金型内に突
出している。またPCB２にはこの可動ピン１５
が挿通する貫通孔２ａが形成されている。なお、
１４はカード基体成形用の樹脂が注入される注入
口、１７は可動ピン１５のストツパーである。 Here, an apparatus for realizing the manufacturing method of this embodiment will be briefly explained using FIG. 1.
In FIG. 1b, reference numerals 11 and 12 indicate an upper mold and a lower mold each having a recess 11a and 12a formed in the center thereof. , 12a, a space having the same shape as the card base 13 is formed. The lower mold 12 is provided with a plurality of movable pins 15 for positioning so as to be freely protrusive and retractable at the location where the PCB 2 with the IC module is placed. It protrudes into the mold by approximately the same amount as the thickness of PCB2. Also, this movable pin 15 is on PCB2.
A through hole 2a is formed through which the through hole 2a is inserted. In addition,
Reference numeral 14 indicates an injection port through which resin for molding the card base is injected, and reference numeral 17 indicates a stopper for the movable pin 15.
次に本実施例の製造方法を第１図ａ〜ｃに従つ
て詳細に説明する。 Next, the manufacturing method of this embodiment will be explained in detail with reference to FIGS. 1a to 1c.
まず、第１図ａに示すように、ICモジユール
付PCB２を、可動ピン１５が該PCB２の貫通孔
２ａに入るようにして下金型１２の所定位置に載
置する。この状態で、第１図ｂに示すように、上
金型１１と下金型１２とを型合わせし、図示しな
いプランジヤにより樹脂を注入口１４から型内に
射出して該樹脂によりICモジユール付PCB２を
一体成形する。 First, as shown in FIG. 1a, the PCB 2 with the IC module is placed in a predetermined position of the lower mold 12 so that the movable pin 15 enters the through hole 2a of the PCB 2. In this state, as shown in FIG. 1b, the upper mold 11 and the lower mold 12 are aligned, and resin is injected into the mold from the injection port 14 using a plunger (not shown) to attach the IC module. PCB2 is integrally molded.
この際、可動ピン１５はばね１６により所定の
圧力で押されているので、樹脂があまり充填され
ていない射出成形の初期においては第１図ａに示
した位置のままであり、ICモジユール付PCB２
を金型内の所定位置に固定している。そして射出
成形の完了直前になると、金型内には樹脂がほぼ
充満するので該金型内の圧力は上昇し、これによ
り可動ピン１５はばね１６のばね力に抗して第１
図ｂに示すようにカードの表面に相当する下金型
１２の表面と面一になる位置まで後退させられ、
ストツパー１７に当つて停止する。従つて該可動
ピン１５の挿入されていたPCB２の貫通孔２ａ
にも樹脂が充填され、これによりICモジユール
付PCB２は一体成形される。ここで、射出成形
完了直前では、樹脂が金型内に充満しているの
で、可動ピン１５を後退させてもPCB２が移動
するようなことはなく、PCB２は精度良く一体
成形されることとなる。 At this time, since the movable pin 15 is pressed with a predetermined pressure by the spring 16, it remains in the position shown in FIG.
is fixed at a predetermined position within the mold. Then, just before the injection molding is completed, the mold is almost filled with resin, so the pressure inside the mold increases, and this causes the movable pin 15 to move against the spring force of the spring 16 to the first position.
As shown in FIG. b, it is retracted to a position flush with the surface of the lower mold 12 corresponding to the surface of the card,
It hits the stopper 17 and stops. Therefore, the through hole 2a of the PCB 2 into which the movable pin 15 was inserted
The PCB 2 with the IC module is integrally molded. Here, just before the injection molding is completed, the mold is filled with resin, so even if the movable pin 15 is moved back, the PCB 2 will not move, and the PCB 2 will be integrally molded with high precision. .
そして所定時間後に型を分離して一体成形され
たカード基体１３を取り出す。そして必要に応じ
て該カード基体１３の両面に第１図ｃに示すよう
に化粧用のラミネートフイルム５ａ，５ｂを貼付
する。 After a predetermined time, the mold is separated and the integrally molded card base 13 is taken out. If necessary, decorative laminate films 5a and 5b are attached to both sides of the card base 13 as shown in FIG. 1c.
このような本実施例によれば、ICモジユール
付PCB２を金型内にセツトし、射出成形で１シ
ヨツトでカード化するようにしたので、従来の製
造方法における接着工程なしに両者を強固に接着
させることができ、カードの信頼性は著しく向上
する。またこのような一体成形によれば、ICモ
ジユール１０に寸法誤差があつても該寸法誤差は
樹脂によりカバーできるので、従来のようにIC
モジユールとカード基体１３（金型）の各々の寸
法を高精度にする必要は全くなく、ただICモジ
ユールがカード基体１３の厚み以内となるよう管
理するだけでよい。特にICモジユール１０のプ
リコート部４の寸法に精度が不要なので、その製
造は従来に比べ非常に容易となり、大幅なコスト
ダウンを図ることができる。 According to this embodiment, the PCB 2 with the IC module is set in the mold and made into a card by injection molding in one shot, so the two can be firmly bonded together without the gluing process of conventional manufacturing methods. This greatly improves the reliability of the card. Furthermore, according to such integral molding, even if there is a dimensional error in the IC module 10, the dimensional error can be covered by the resin, so that the IC module 10 can be
There is no need to make the dimensions of the module and the card base 13 (mold) highly accurate; it is only necessary to manage the IC module so that it is within the thickness of the card base 13. In particular, since the dimensions of the precoated portion 4 of the IC module 10 do not require precision, manufacturing thereof is much easier than in the past, and costs can be significantly reduced.
また本実施例では、下金型１２に可動ピン１５
を設けているので、これとPCB２の孔２ａとを
利用して該PCB２の金型内へのセツトを容易に、
しかも高精度に行うことができ、外部接触用の端
子等の位置もずれたりすることはない。 In addition, in this embodiment, the movable pin 15 is attached to the lower mold 12.
Since this is provided, the PCB 2 can be easily set into the mold by using this and the hole 2a of the PCB 2.
Furthermore, this can be done with high precision, and the position of external contact terminals, etc. will not shift.
さらにこの可動ピン１５は、樹脂充填時にはそ
の充填圧力により後退し、樹脂がPCB２の貫通
孔２ａにも充填されるので、該貫通孔２ａに充填
された樹脂のアンカー効果によりPCB２とカー
ド基体１３とをより強固に結合させることがで
き、カードの信頼性も飛躍的に向上できる。また
可動ピン１５は金型内表面位置まで退却するた
め、PCB２の表面をフラツトにでき、PCB２に
残る可動ピン１５の痕跡は、エジエクトピンによ
る痕跡程度にとどめることができる。 Furthermore, when the movable pin 15 is filled with resin, it retreats due to the filling pressure, and the resin is also filled in the through hole 2a of the PCB 2, so that the anchor effect of the resin filled in the through hole 2a causes the PCB 2 and the card base 13 to connect. can be more firmly connected, and the reliability of the card can be dramatically improved. Further, since the movable pin 15 retreats to the inner surface position of the mold, the surface of the PCB 2 can be made flat, and the traces of the movable pin 15 remaining on the PCB 2 can be limited to the extent of traces caused by the eject pin.
さらには、上記可動ピン１５の突出量はPCB
２の水平面内での移動を阻止できる程度であれば
十分であり、PCB２の厚さに関係なく可動ピン
１５の突出量を一定に設定することができ、金型
の設計上有利であり、またその構造も簡単にでき
る。 Furthermore, the amount of protrusion of the movable pin 15 is determined from the PCB.
It is sufficient to prevent the movable pin 15 from moving in the horizontal plane, and the amount of protrusion of the movable pin 15 can be set constant regardless of the thickness of the PCB 2, which is advantageous in terms of mold design. Its structure is also easy to make.
またさらに可動ピンはその先端全面で樹脂充填
圧を受けるような構造となつているため、可動ピ
ンの後退を円滑にすることができる。 Furthermore, since the movable pin is structured so that the entire tip thereof receives the resin filling pressure, the movable pin can be smoothly retreated.
なお、上記実施例では可動ピンを後退させる手
段として、該可動ピンに所定の圧力をかけてお
き、金型内の圧力が上昇したとき自動的に後退さ
せるようにしたが、この可動ピンを後退させる手
段は上記実施例構造に限られるものではない。即
ち、例えば樹脂を注入するプランジヤの圧力を測
定しておき、その圧力が所定の圧力になつたとき
可動ピンを後退させるようにしてもよく、また、
樹脂の注入開始からの経過時間を測定しておき、
樹脂がほぼ充満したと思われる時間に可動ピンを
後退させるようにしてもよい。 In the above embodiment, as a means for retracting the movable pin, a predetermined pressure is applied to the movable pin so that the movable pin is automatically retracted when the pressure inside the mold increases. The means for doing so is not limited to the structure of the above embodiment. That is, for example, the pressure of the plunger that injects the resin may be measured, and the movable pin may be moved back when the pressure reaches a predetermined value.
Measure the elapsed time from the start of resin injection,
The movable pin may be moved back at a time when it is considered that the resin is almost filled.
また、上記実施例では本発明をICカードの製
造方法に適用した場合について説明したが、本発
明は樹脂基体の一面に基板を有してなる樹脂成形
体の製造方法の全てに適用できるものである。 In addition, although the above embodiment describes the case where the present invention is applied to a method of manufacturing an IC card, the present invention can be applied to all methods of manufacturing a resin molded body having a substrate on one side of a resin base. be.
以上のように、本発明によれば、基板を金型内
に配置し、これに樹脂を充填し、上記基板を樹脂
封止して樹脂成形体を製造する方法において、上
記金型を、その内面の所定位置に出没可能な基板
位置決め用可動ピンを有するものを用い、上記基
板の金型内での位置決めを、上記基板に形成した
貫通孔に上記可動ピンを挿通して行い、樹脂充填
時には上記可動ピンを没入させて上記基板の貫通
孔内にも樹脂が充填されるようにしたので、従来
に比し製造が非常に容易になるとともに、これに
より製造される樹脂成形体の信頼性を著しく向上
でき、しかも基板を容易に高精度にセツトできる
効果がある。また上記基板貫通孔に充填された樹
脂のアンカー効果により基板と樹脂基体とを強固
に結合することができる効果もある。
As described above, according to the present invention, in the method of manufacturing a resin molded body by arranging a substrate in a mold, filling the mold with resin, and sealing the substrate with resin, the mold is Using a device having a movable pin for positioning the substrate that can be retracted and retracted from a predetermined position on the inner surface, the substrate is positioned in the mold by inserting the movable pin into a through hole formed in the substrate, and when filling the resin. By recessing the movable pin, the through-hole of the substrate is also filled with resin, which makes manufacturing much easier than before, and improves the reliability of the resin molded product. This is a significant improvement and has the effect of allowing the substrate to be easily set with high precision. Further, the anchor effect of the resin filled in the substrate through-hole allows the substrate and the resin base to be firmly bonded.
第１図ａないしｃは本発明の一実施例による
ICカードの製造方法を説明するための図、第２
図は一般的なICカードの断面構成図、第３図ａ，
ｂは従来のICカードの製造方法を説明するため
の図である。
２……プリント基板（PCB）、２ａ……貫通
孔、１０……ICモジユール、１１……上金型、
１２……下金型、１３……カード基体、１５……
可動ピン、１６……ばね。なお図中同一符号は同
一又は相当部分を示す。
Figures 1a to 1c are according to an embodiment of the present invention.
Diagram for explaining the manufacturing method of IC cards, Part 2
The figure is a cross-sectional diagram of a general IC card, Figure 3a,
b is a diagram for explaining a conventional IC card manufacturing method. 2... Printed circuit board (PCB), 2a... Through hole, 10... IC module, 11... Upper mold,
12... Lower mold, 13... Card base, 15...
Movable pin, 16...spring. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
填し、上記基板を樹脂封止して樹脂成形体を製造
する方法において、 上記金型として、その内面の所定位置に出没可
能な基板位置決め用可動ピンを有するものを用
い、 上記基板の金型内での位置決めを、上記基板に
形成した貫通孔に上記可動ピンを挿通して行い、 樹脂充填時には上記可動ピンを没入させて上記
基板の貫通孔内にも樹脂が充填されるようにした
ことを特徴とする樹脂成形体の製造方法。[Scope of Claims] 1. A method for manufacturing a resin molded body by placing a substrate in a mold, filling the mold with resin, and sealing the substrate with resin, wherein the mold includes an inner surface of the mold. The substrate is positioned in the mold by inserting the movable pin into a through hole formed in the substrate, and when filling the resin, the A method for manufacturing a resin molded article, characterized in that a movable pin is recessed so that resin is also filled into the through hole of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60170142A JPS6230012A (en) | 1985-07-31 | 1985-07-31 | Manufacture of resin molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60170142A JPS6230012A (en) | 1985-07-31 | 1985-07-31 | Manufacture of resin molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6230012A JPS6230012A (en) | 1987-02-09 |
| JPH0356648B2 true JPH0356648B2 (en) | 1991-08-28 |
Family
ID=15899446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60170142A Granted JPS6230012A (en) | 1985-07-31 | 1985-07-31 | Manufacture of resin molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6230012A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2774605B1 (en) * | 1998-02-10 | 2000-05-05 | Salomon Sa | METHOD FOR MANUFACTURING A RIGID ELEMENT FOR STRUCTURING A SPORTS ARTICLE |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5753322B2 (en) * | 1975-08-25 | 1982-11-12 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5753322U (en) * | 1980-09-13 | 1982-03-27 |
-
1985
- 1985-07-31 JP JP60170142A patent/JPS6230012A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5753322B2 (en) * | 1975-08-25 | 1982-11-12 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6230012A (en) | 1987-02-09 |
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