JPS61268415A - Manufacture of resin-molded body - Google Patents
Manufacture of resin-molded bodyInfo
- Publication number
- JPS61268415A JPS61268415A JP11094485A JP11094485A JPS61268415A JP S61268415 A JPS61268415 A JP S61268415A JP 11094485 A JP11094485 A JP 11094485A JP 11094485 A JP11094485 A JP 11094485A JP S61268415 A JPS61268415 A JP S61268415A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- card
- substrate
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C2045/14155—Positioning or centering articles in the mould using vacuum or suction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、樹脂基体の少なくとも一面に基板を有して
なる樹脂成形体の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a resin molded body having a substrate on at least one surface of a resin base.
（従来の技術〕
以下、樹脂成形体としてＩＣカードを例にとり説明する
。ここでＩＣカードとは、従来の磁気ストライプ付のキ
ャッシュカード等に代わって用いられるものであり、カ
ードの基体内にメモリＩＣやＣＰＵその他の半導体片を
内蔵し、従来の磁気ストライプ付カードに比べて数桁以
上の大容量の記憶能力を持たせることができるほか、任
意の演算機能を持たせることができるものである。(Prior Art) In the following, an explanation will be given using an IC card as an example of a resin molded body.The IC card is used in place of a conventional cash card with a magnetic stripe, and has a memory inside the base of the card. It has a built-in IC, CPU, and other semiconductor chips, and can have a storage capacity several orders of magnitude higher than that of conventional cards with magnetic stripes, and can also be equipped with arbitrary arithmetic functions. .
第２図はこのようなＩＣカードの要部を示す断面構成図
であり、図において、６は塩化ビニール等の樹脂を成形
してなるカード基体、２はこのカード基体６内に収納さ
れたプリント基板（以−下ＰＣＢと記す）、１０はこの
ＰＣＢ２上に固着されたＩＣモジュールであり、これは
メモリＩＣ及びＣＰＵ等のＩＣチップ１．配線３．及び
上記ＩＣチップ１と配線３とを樹脂封止するプリコート
部４からなっている。以下、このＩＣモジュール１０と
これが固着されたＰＣＢ２とをＩＣモジュール付ＰＣＢ
２と記す。また、５ａ、５ｂは上記カード基体６の両面
に形成されたラミネートフィルム、７はカード読取り機
との接点部である。FIG. 2 is a cross-sectional configuration diagram showing the main parts of such an IC card. In the figure, 6 is a card base made of resin such as vinyl chloride, and 2 is a print housed in this card base 6. A substrate (hereinafter referred to as PCB) 10 is an IC module fixed on this PCB 2, which includes IC chips 1. such as a memory IC and a CPU. Wiring 3. and a precoat section 4 for sealing the IC chip 1 and the wiring 3 with resin. Hereinafter, this IC module 10 and the PCB 2 to which it is fixed will be referred to as a PCB with an IC module.
It is written as 2. Further, 5a and 5b are laminated films formed on both sides of the card base 6, and 7 is a contact portion with a card reader.
次に上記ＩＣカードの従来の製造方法を第３図に従って
説明する。まず第３図ｆａｌで示すように、ＰＣＢ２上
にＩＣチップ１等を実装し、これらをエポキシ樹脂等で
プリコートしてＩＣモジュール１０を形成する。一方、
第３図（ｂ）に示すように、上記ＩＣモジュール付ＰＣ
Ｂ２の収納される凹部６ａを有するカード基体６を射出
成形により形成する。そしてこのカード基体６の凹部６
ａにＩＣモジュール１０をはめ込み、両者をプレスして
接着し、第２図に示すようなＩＣカードを形成する。Next, a conventional method for manufacturing the above-mentioned IC card will be explained with reference to FIG. First, as shown in FIG. 3 fal, the IC chip 1 and the like are mounted on the PCB 2 and precoated with epoxy resin or the like to form the IC module 10. on the other hand,
As shown in FIG. 3(b), the above-mentioned PC with an IC module
A card base 6 having a recess 6a in which B2 is accommodated is formed by injection molding. And the recess 6 of this card base 6
The IC module 10 is fitted into the a, and both are pressed and bonded together to form an IC card as shown in FIG.
しかるに、上記のような従来のＩＣカードの製造方法で
は、カードの厚み寸法を精度良くするために、又ＰＣＢ
２と基体６との嵌合部において隙間が生じたり表面に段
差が生じたりしないようにするために、ＰＣＢ２と基体
６のそれぞれを精度良く仕上げる必要があり、その製造
は困難である。However, in the conventional IC card manufacturing method as described above, in order to improve the accuracy of the card thickness, it is necessary to
In order to prevent a gap from forming at the fitting portion between the PCB 2 and the base body 6 and a step from occurring on the surface, it is necessary to finish each of the PCB 2 and the base body 6 with high precision, which is difficult to manufacture.
特にＩＣモジュール１０のプリコート部４を所望の形状
寸法にすることは非常に困難であり、従って従来の製造
方法では精度の良いＩＣカードを得ることができないと
いう問題があった。In particular, it is very difficult to form the precoat portion 4 of the IC module 10 into a desired shape and size, and therefore, there is a problem in that it is not possible to obtain a highly accurate IC card using conventional manufacturing methods.
さらに従来の製造方法では、ＩＣモジュール付ＰＣＢ２
とカード基体６とを粘着シートにより接着するようにし
ており、その接着強度は低く、耐久性にも乏しい。また
両面を接着した際、その嵌合部分に隙間が生じると、そ
こから水等が侵入して接着部分が剥離することがあり、
カードの信頼性が低いという問題があった。Furthermore, in the conventional manufacturing method, PCB2 with IC module
and the card base 6 are bonded together using an adhesive sheet, which has low adhesive strength and poor durability. Also, if there is a gap in the mating part when both sides are glued together, water etc. may enter through there and the bonded part may peel off.
There was a problem that the reliability of the card was low.
この発明は、かかる点に鑑みてなされたもので、ＩＣカ
ード等の樹脂成形体の製造が従来に比し非常に容易にな
るとともに、信頼性の高い樹脂成形体を得ることのでき
る樹脂成形体の製造方法を提供することを目的としてい
る。This invention has been made in view of the above points, and it is possible to manufacture resin molded products such as IC cards much more easily than before, and to obtain highly reliable resin molded products. The purpose is to provide a manufacturing method for.
この発明に係る樹脂成形体の製造方法は、位置決め用突
起及び基板吸着用孔の形成された金型内に基板を設置す
るとともに、該基板を上記吸着用孔を介して真空ポンプ
により吸引固定し、上記金型内に樹脂を射出して上記基
板を該樹脂により一体成形するようにしたものである。In the method for manufacturing a resin molded body according to the present invention, a substrate is placed in a mold in which a positioning protrusion and a substrate suction hole are formed, and the substrate is suctioned and fixed by a vacuum pump through the suction hole. , a resin is injected into the mold and the substrate is integrally molded with the resin.
Ｃ作用〕
この発明においては、ＩＣカードにおけるカード基体等
の樹脂基体を射出成形する際、その金型内に基板を設置
してこれを一体成形するので、従来のように両者を高精
度に仕上げる必要がなく、しかも樹脂基体と基板とが接
着工程なしに強固に接着され、さらに上記金型内に基板
を設置する際、該金型内に形成された突起を利用して位
置決めを行ない、バキュームによりこれを吸引固定する
ので、容易に精度良く基板がセットされる。C Effect] In this invention, when injection molding a resin substrate such as a card substrate in an IC card, the substrate is placed in the mold and molded integrally, so that both can be finished with high precision as in the past. In addition, the resin base and the substrate are firmly bonded without any bonding process, and when the substrate is placed in the mold, the protrusions formed in the mold are used for positioning, and the vacuum Since this is fixed by suction, the substrate can be set easily and accurately.
以下、本発明の実施例を図について説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例による樹脂成形体の製造方法
を示す図であり、本実施例方法は、ＩＣカードの製造に
おいて、カード基体を射出成形する際、その金型内にＩ
Ｃモジュール付ＰＣＢを設置しておき、該ＰＣＢを一体
成形するようにしたものである。FIG. 1 is a diagram showing a method for manufacturing a resin molded body according to an embodiment of the present invention. In the method of this embodiment, when injection molding a card base in the production of an IC card, an I.
A PCB with a C module is installed in advance, and the PCB is integrally molded.
ここで、本実施例の製造方法を実現するための装置につ
いて、第１図を用いて簡単に説明する。Here, an apparatus for realizing the manufacturing method of this embodiment will be briefly explained using FIG. 1.
第１図（１））において、１１．１２はそれぞれその中
央部に凹部１１ａ、１２ａが成形された上金型。In FIG. 1 (1)), 11 and 12 are upper molds in which concave portions 11a and 12a are respectively formed in their central portions.
下金型であり、該両金型１１，１２を型合わせしたとき
、その両凹部１１ａ、１２ａによりカード基体１３と同
形状の空間が形成されるようになっている。そして上記
下金型１２には、ＩＣモジュール付ＰＣＢ２の載置され
る個所に、位置決め用の突起１２Ｃ及び吸着用の孔１２
ｂが設けられており、この吸着孔１２ｂは真空ポンプ（
図示せず）に接続されている。なお、１４はカード基体
成形用の樹脂が注入される注入口である。This is a lower mold, and when the molds 11 and 12 are brought together, a space having the same shape as the card base 13 is formed by the recesses 11a and 12a. The lower mold 12 has a positioning protrusion 12C and a suction hole 12 at the location where the IC module attached PCB 2 is placed.
b is provided, and this suction hole 12b is connected to a vacuum pump (
(not shown). Note that 14 is an injection port into which resin for card base molding is injected.
次に本実施例の製造方法を第１図（ａ）〜（Ｃ１に従っ
てより詳細に説明する。Next, the manufacturing method of this example will be explained in more detail with reference to FIGS. 1(a) to (C1).
まず、第１図（ａ）に示すように、下金型１２の所定位
置に位置決め用突起１２ｃを利用してＩＣモジュール付
ＰＣＢ２を載置するとともに、真空ポンプにより吸着用
孔１２ｂを介して上記ＩＣモジュール付ＰＣＢ２を吸引
固定する。この状態で、第１図（ｂ）に示すように、上
金型１１と下金型１２とを型合わせし、図示しないプラ
ンジャにより樹脂を注入口１４から型内に射出して該樹
脂によりＩＣモジュール付ＰＣＢ２を一体成形する。そ
して所定時間後に型を分離して一体成形されたカード基
体１３を取り出し、該カード基体１３の両面に第１図（
Ｃ）に示すように化粧用のラミネートフィルム５ａ、５
ｂを貼付する。First, as shown in FIG. 1(a), the IC module-equipped PCB 2 is placed on a predetermined position of the lower mold 12 using the positioning protrusion 12c, and the The PCB2 with IC module is fixed by suction. In this state, as shown in FIG. 1(b), the upper mold 11 and the lower mold 12 are aligned, and resin is injected into the mold from the injection port 14 using a plunger (not shown), and the resin is used to form an IC. The module-equipped PCB 2 is integrally molded. After a predetermined period of time, the mold is separated and the integrally molded card base 13 is taken out.
As shown in C), cosmetic laminate films 5a, 5
Paste b.
このような本実施例によれば、ＩＣモジュール付ＰＣＢ
２を金型内にセットし、射出成形で１シヨツトでカード
化するようにしたので、従来の製造方法における接着工
程なしに両者を強固に接着させることができ、カードの
信頼性は著しく向上する。またこのような一体形成によ
れば、ＩＣモジュール１０に寸法誤差があっても該寸法
誤差は樹脂によりカバーできるので、従来のようにＩＣ
モジュール１０とカード基体１３（金型）の各々の寸法
を高精度にする必要は全くなく、ただＩＣモジュールが
カード基体】３の厚み以内となるよう管理するだけでよ
い。特にＩＣモジュール１０のプリコート部４の寸法に
精度が不要なので、その製造は従来に比べ非常に容易と
なり、大幅なコストダウンを図ることができる。According to this embodiment, the PCB with IC module
2 is set in a mold and made into a card by injection molding in one shot, so it is possible to firmly bond the two without the gluing process of conventional manufacturing methods, and the reliability of the card is significantly improved. . Moreover, according to such integral formation, even if there is a dimensional error in the IC module 10, the dimensional error can be covered by the resin, so that the IC module 10 can be
There is no need to make the dimensions of the module 10 and the card base 13 (mold) highly accurate; it is only necessary to control the thickness of the IC module so that it is within the thickness of the card base 13. In particular, since there is no need for precision in the dimensions of the precoat portion 4 of the IC module 10, its manufacture is much easier than in the past, and costs can be significantly reduced.
また本実施例では、下金型１２に位置決め用突起１２ｃ
を設けているのでＰＣＢの金型内へのセントが容易に、
しかも高精度に行なえ、外部接触用の端子等の位置もず
れたりすることはない。さらにこの突起１２ｃを設けた
ことにより、成形後の完成品には第１図（Ｃ１に示すよ
うな凹部１５が形成され、これをカードの表、裏の識別
等に利用することもできる。In addition, in this embodiment, the lower mold 12 has a positioning protrusion 12c.
Since it is provided, it is easy to insert the PCB into the mold.
Furthermore, this can be done with high precision, and the positions of external contact terminals, etc. will not shift. Further, by providing the protrusion 12c, a recess 15 as shown in FIG. 1 (C1) is formed in the finished product after molding, and this can be used to identify the front and back of the card.
なお、上記実施例ではカード基体の一部にＩＣモジュー
ル付ＰＣＢを一体成形した場合について説明したが、こ
れは、カード基体の片側全面に一体成形するようにして
もよく、またＰＣＢは下金型だけでなく上金型にも設置
するようにしてもよい。In addition, in the above embodiment, the case where the PCB with the IC module is integrally molded on a part of the card base was explained, but this may also be integrally molded on the entire surface of one side of the card base, or the PCB may be integrally molded on the entire surface of one side of the card base. It may also be installed not only in the upper mold but also in the upper mold.
また、上記実施例では本発明をＩＣカードの製造方法に
適用した場合について説明したが、本発明は樹脂基体の
少な（とも−面に基板を有してなる樹脂成形体の製造方
法の全てに適用できるものである。Furthermore, in the above embodiments, the case where the present invention is applied to a method for manufacturing an IC card has been described, but the present invention can be applied to any method for manufacturing a resin molded body having a small number of resin substrates (both sides having a substrate on the negative side). It is applicable.
以上のように、本発明によれば、樹脂基体の少なくとも
一面に基板を有してる樹脂成形体の製造方法において、
基板位置決め用突起の形成された金型内に基板を設置す
るとともにこれを真空ポンプにより吸引固定し、この金
型内に樹脂を射出して上記基板を該樹脂により一体成形
するようにしたので、従来に比し製造が非常に容易にな
るとともに、これにより製造される樹脂成形体の信頼性
を著しく向上でき、しかも基板を容易に高精度にセット
できる効果がある。As described above, according to the present invention, in the method for manufacturing a resin molded body having a substrate on at least one surface of the resin base,
The substrate is placed in a mold in which substrate positioning protrusions are formed, and is suctioned and fixed by a vacuum pump, and resin is injected into the mold to integrally mold the substrate with the resin. Manufacturing is much easier than in the past, and the reliability of the resin molded body thus manufactured can be significantly improved, and the substrate can be easily set with high precision.
第１図（ａ）ないしくＣ１は本発明の一実施例によるＩ
Ｃカードの製造方法を説明するための図、第２図は一般
的なＩＣカードの顔面構成図、第３図（ａ）。
（ｂｌは従来のＩＣカードの製造方法を説明するための
図である。
２・・・プリント基板（ＰＣＥ） 、１０・・・ＩＣモ
ジュール、１１・・・上金型、１２・・・下金型、１２
ｂ・・・基板吸着用孔、１２ｃ・・・基板位置決め用突
起、１３・・・カード基体。
なお図中同一符号は同−又は相当部分を示す。
第１図
１２ｂ ｔｏ： Ｉ ＣＩｆ： 、／Ｊ、−／’
第２図
第３図
手続補正書（１釦
昭和６０年１０月 ７日
２、発明の名称
樹脂成形体の製造方法
３、補正をする者
事件との関係 特許出願人
住 所 東京都千代田区丸の内二丁目２番３号名 称
（６０１） 三菱電機株式会社（外１名）代表者志岐
守哉
４、代理人 郵便番号５３２
住 所 大阪市淀用区宮原４丁目１番４５号５、補正の
対象
明細書の発明の詳細な説明の欄、及び図面の簡単な説明
の欄、及び図面（第１図）
６、補正の内容
（１ン 明細書第７頁第３行の「取り出し、該」を「
取り出す（第１図（Ｃ））。また必要に応じて」に訂正
する。
（２）同第７頁第４行の「第１図（Ｃ）」を「第１図（
ｄ）」に訂正する。
（３） 同第９頁第１２行のｒ ｆｃ） Ｊをｒ ｆ
ｄｌ Ｊに訂正する。
（４）第１図ｔａ＋ないしくＣ）を別紙の通り訂正する
。
（５）第１図ｆｄ）を別紙の通り追加する。
以上
第１図
＋２ｂ １０： ＩＣｆシュー／Ｌ１３：、７Ｊ
’４体
第１図FIG. 1(a) or C1 is an I according to an embodiment of the present invention.
FIG. 2 is a diagram for explaining the manufacturing method of a C card, and FIG. 3(a) is a diagram showing the face configuration of a general IC card. (bl is a diagram for explaining the conventional IC card manufacturing method. 2... Printed circuit board (PCE), 10... IC module, 11... Upper mold, 12... Lower mold Type, 12
b...Board adsorption hole, 12c...Board positioning protrusion, 13...Card base. Note that the same reference numerals in the figures indicate the same or equivalent parts. Figure 1 12b to: I CIf: , /J, -/'
Figure 2 Figure 3 Procedural amendment (1 button October 7, 1985 2, Name of the invention Method for manufacturing resin molded articles 3, Relationship with the case of the person making the amendment Patent applicant address Marunouchi, Chiyoda-ku, Tokyo 2-2-3 Name
(601) Mitsubishi Electric Corporation (1 other person) Representative Moriya Shiki 4, Agent Postal code 532 Address 4-1-45-5, Miyahara, Yodoyo-ku, Osaka City Details of the invention in the specification subject to amendment Explanation column, brief explanation column of drawings, and drawings (Figure 1)
Take it out (Fig. 1(C)). Also, revise as necessary. (2) Change “Figure 1 (C)” to “Figure 1 (C)” on page 7, line 4 of the same page.
d)”. (3) r fc on page 9, line 12) J to r f
Correct to dl J. (4) Correct ta+ or C) in Figure 1 as shown in the attached sheet. (5) Add Figure 1 fd) as shown in the attached sheet. Above Figure 1 + 2b 10: ICf shoe/L13:, 7J
'Four bodies Figure 1
Claims (1)
脂成形体の製造方法であって、上記基板を、その所定位
置に基板位置決め用突起及び基板吸着用孔が形成された
金型内に設置するとともに、上記基板吸着用孔に接続さ
れた真空ポンプを作動させて該基板を吸引固定し、上記
金型内に樹脂を射出して上記基板を該樹脂により一体成
形することを特徴とする樹脂成形体の製造方法。(1) A method for manufacturing a resin molded body having a substrate on at least one surface of a resin base, wherein the substrate is placed in a mold in which substrate positioning protrusions and substrate suction holes are formed at predetermined positions. When installed, a vacuum pump connected to the substrate suction hole is operated to suction and fix the substrate, and a resin is injected into the mold to integrally mold the substrate with the resin. A method for producing a resin molded body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11094485A JPS61268415A (en) | 1985-05-23 | 1985-05-23 | Manufacture of resin-molded body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11094485A JPS61268415A (en) | 1985-05-23 | 1985-05-23 | Manufacture of resin-molded body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61268415A true JPS61268415A (en) | 1986-11-27 |
| JPH0559807B2 JPH0559807B2 (en) | 1993-09-01 |
Family
ID=14548508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11094485A Granted JPS61268415A (en) | 1985-05-23 | 1985-05-23 | Manufacture of resin-molded body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61268415A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01141014U (en) * | 1988-03-24 | 1989-09-27 | ||
| JPH0329311U (en) * | 1989-04-18 | 1991-03-22 | ||
| WO2003069012A1 (en) * | 2002-02-14 | 2003-08-21 | National Institute Of Water & Atmospheric Research Limited | Method and apparatus for the manufacture of a tag |
| US7458823B2 (en) | 2005-04-22 | 2008-12-02 | Denso Corporation | Electronic circuit device and manufacturing method of the same |
| EP2386401A1 (en) * | 2010-05-11 | 2011-11-16 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having antenna pattern embedde therein, and mold therefor and mthod of manufacturing thereof |
| EP2386400A1 (en) * | 2010-05-11 | 2011-11-16 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having antenna pattern frame embedded therein, mold therefor and method of manufacturing thereof |
| US8773314B2 (en) | 2010-02-25 | 2014-07-08 | Samsung Electro-Mechanics Co., Ltd. | Antenna pattern frame, case of electronic device and mould for manufacturing the same |
| US8976074B2 (en) | 2010-05-11 | 2015-03-10 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having low frequency antenna pattern embedded therein, mold therefor and method of manufacturing thereof |
-
1985
- 1985-05-23 JP JP11094485A patent/JPS61268415A/en active Granted
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01141014U (en) * | 1988-03-24 | 1989-09-27 | ||
| JPH0540979Y2 (en) * | 1988-03-24 | 1993-10-18 | ||
| JPH0329311U (en) * | 1989-04-18 | 1991-03-22 | ||
| WO2003069012A1 (en) * | 2002-02-14 | 2003-08-21 | National Institute Of Water & Atmospheric Research Limited | Method and apparatus for the manufacture of a tag |
| AU2003206473B2 (en) * | 2002-02-14 | 2008-08-28 | Ensid Investments Ltd | Method and apparatus for the manufacture of a tag |
| US7458823B2 (en) | 2005-04-22 | 2008-12-02 | Denso Corporation | Electronic circuit device and manufacturing method of the same |
| US8773314B2 (en) | 2010-02-25 | 2014-07-08 | Samsung Electro-Mechanics Co., Ltd. | Antenna pattern frame, case of electronic device and mould for manufacturing the same |
| EP2386401A1 (en) * | 2010-05-11 | 2011-11-16 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having antenna pattern embedde therein, and mold therefor and mthod of manufacturing thereof |
| EP2386400A1 (en) * | 2010-05-11 | 2011-11-16 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having antenna pattern frame embedded therein, mold therefor and method of manufacturing thereof |
| US8711041B2 (en) | 2010-05-11 | 2014-04-29 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having antenna pattern embedded therein and mold and method for manufacturing the same |
| US8976074B2 (en) | 2010-05-11 | 2015-03-10 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having low frequency antenna pattern embedded therein, mold therefor and method of manufacturing thereof |
| US9266266B2 (en) | 2010-05-11 | 2016-02-23 | Samsung Electro-Mechanics Co., Ltd. | Case of electronic device having antenna pattern frame embedded therein, mold therefor and method of manufacturing thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0559807B2 (en) | 1993-09-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |