JPS61259913A - Manufacture of electronic part run - Google Patents
Manufacture of electronic part runInfo
- Publication number
- JPS61259913A JPS61259913A JP9526785A JP9526785A JPS61259913A JP S61259913 A JPS61259913 A JP S61259913A JP 9526785 A JP9526785 A JP 9526785A JP 9526785 A JP9526785 A JP 9526785A JP S61259913 A JPS61259913 A JP S61259913A
- Authority
- JP
- Japan
- Prior art keywords
- roller
- lead wire
- adhesive tape
- base material
- shaped base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Packages (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上夏姐里分！
本発明は、電子部品連、殊にリード線が同一方向に突出
した所謂ラジアルリード形電子部品を帯状基材上に多数
並べてその上から接着テープで固定した電子部品連の製
造方法に関する。[Detailed Description of the Invention] Industrial Summer Limin! The present invention relates to a method for producing a series of electronic components, particularly a series of electronic components in which a large number of so-called radial lead type electronic components with lead wires protruding in the same direction are arranged on a strip-shaped base material and fixed thereon with an adhesive tape.
ｌ米坐及■
第５図に示すように、双方のリード線１１が同一方向に
突出する所謂ラジアルリード形電子部品１は、通常、送
り孔２１付きのテーピング台紙のような帯状基材２の上
に該リード線１１を載置し、その上から接着テープ３で
固定することによって、該ラジアルリード形電子部品ｌ
が子側ないし５千個程度連なる電子部品連已に構成され
、リール等に巻取られている。As shown in FIG. 5, a so-called radial lead type electronic component 1 in which both lead wires 11 protrude in the same direction is usually mounted on a strip-shaped base material 2 such as a taping mount with a feed hole 21. By placing the lead wire 11 on top and fixing it with adhesive tape 3 from above, the radial lead type electronic component l
It is composed of a series of about 5,000 electronic components, and is wound on a reel or the like.
ところで、このような電子部品連Ｅは、これまで第６図
に示すように、電子部品のリード線１１を帯状基材２に
載置して圧着ローラ４に連続供給する一方、熱風Ｂをあ
てて粘着性を持たせた接着テープ３を斜め上方から連続
供給し、該リード線１１を圧着ローラ４の凹溝部４１に
嵌めながらそのローラ面４２で接着テープ３を帯状基材
２に圧着することによって、連続的に製造されていた。By the way, as shown in FIG. 6, such an electronic component series E has hitherto had a lead wire 11 of an electronic component placed on a strip-shaped base material 2 and continuously supplied to a pressure roller 4, while being exposed to hot air B. The adhesive tape 3 that has been made sticky is continuously fed diagonally from above, and the adhesive tape 3 is pressed onto the strip-shaped base material 2 with the roller surface 42 while the lead wire 11 is fitted into the concave groove 41 of the pressure roller 4. It was manufactured continuously by
しかしながら、かかる製造方法によれば次のような問題
があった。However, this manufacturing method has the following problems.
（°゛ と る 占 ゛即ち、電子部
品のリード線１１を横ずれなく堅固に固定するためには
、接着テープ３に充分な粘着性をもたせること、及び第
７図に示すように接着テープ３のリード線被覆部３１の
両側を圧着口−ラ４の凹溝４１両側の角部４３で強く押
圧してリード線被覆部３１とリード線１１との接着強度
を高めることが必要となる。(In other words, in order to securely fix the lead wires 11 of electronic components without lateral displacement, the adhesive tape 3 must have sufficient adhesiveness, and the adhesive tape 3 must have sufficient adhesion as shown in FIG. It is necessary to strongly press both sides of the lead wire covering part 31 with the corners 43 on both sides of the groove 41 of the crimp opening 4 to increase the adhesive strength between the lead wire covering part 31 and the lead wire 11.
しかしながら、上記の製造方法では接着テープ３に熱風
Ｂをあてて加熱する手段を採用している関係上、たとえ
圧着前に該テープ３を充分に加熱しても、熱容量の大き
い圧着ローラ４に接するとすぐに冷えるため、該テープ
３に良好な粘着性をもたせることが困難であった。しか
も、圧着ローラ４の凹溝４１両側の角部４３が帯状基材
２に食い込んで強くテープ３を押圧できるように凹溝底
面４４とテープ３のリード線被覆部３１との間に適当な
隙間をもうけているため、圧着時にリード線被覆部３Ｉ
は凹溝底面４４によってリード線１１に押圧されず、単
にリード線被覆部３１の引張力によって弱く押圧される
だけとなり、リード線被覆部１１とリード線３１との接
着強度も不充分であった。以上のことから、従来の製造
方法では、電子部品を横ずれなく堅固にチルピング固定
した信頼性の高い電子部品連Ｅを得ることが容易でない
という問題があった。However, since the above manufacturing method employs a method of heating the adhesive tape 3 by applying hot air B to it, even if the tape 3 is sufficiently heated before crimping, it will not come into contact with the crimping roller 4, which has a large heat capacity. Since the tape 3 cools down quickly, it is difficult to provide the tape 3 with good adhesiveness. In addition, an appropriate gap is provided between the groove bottom surface 44 and the lead wire covering portion 31 of the tape 3 so that the corners 43 on both sides of the groove 41 of the pressure roller 4 can bite into the band-shaped base material 2 and press the tape 3 strongly. Because it has a lead wire covering part 3I during crimping,
was not pressed against the lead wire 11 by the groove bottom surface 44, but was only weakly pressed by the tensile force of the lead wire covering section 31, and the adhesive strength between the lead wire covering section 11 and the lead wire 31 was also insufficient. . From the above, the conventional manufacturing method has a problem in that it is not easy to obtain a highly reliable electronic component series E in which electronic components are securely fixed by tilting without lateral displacement.
。 占ｆＪ７！ るための ９
本発明の製造方法は、上記の問題点を解決するために、
帯状基材と接着テープとの間に電子部品のテーピング部
を挟み、該テーピング部が嵌る凹溝をローラ面に備えた
熱圧着ローラにより接着テープを帯状基材に圧着した後
、加圧ローラにより更に押圧することを要旨とするもの
である。. Fortune fJ7! 9 In order to solve the above problems, the manufacturing method of the present invention has the following steps:
The taping part of the electronic component is sandwiched between the band-shaped base material and the adhesive tape, and the adhesive tape is pressed onto the band-shaped base material using a thermocompression roller having a groove on the roller surface into which the taping part fits, and then the pressure roller is used to press the adhesive tape onto the band-shaped base material. The gist of this is to press further.
以下、実施例を挙げて本発明を詳述する。Hereinafter, the present invention will be explained in detail with reference to Examples.
裏施凱
第１図は本発明の一実施例の説明図であって、これによ
れば、電子部品のテーピング部、つまりリード線１１を
表面に載置した帯状基材２が熱圧着ロール５に連続供給
される。この帯状基材２は、第５図に示すような送り孔
２１付きのテーピング台紙等からなるものである。これ
と同時に斜め上方からは接着テープ３が連続供給され、
該テープ３と帯状基材２との間に電子部品のリード線１
１が上下から挟まれて、熱圧着ローラ５により熱圧着一
体化される。FIG. 1 is an explanatory view of one embodiment of the present invention, in which a band-shaped base material 2 on which a taping portion of an electronic component, that is, a lead wire 11 is placed on the surface, is rolled by a thermocompression roll 5. Continuously supplied. This strip-shaped base material 2 is made of a taping mount or the like with feed holes 21 as shown in FIG. At the same time, adhesive tape 3 is continuously supplied from diagonally above.
A lead wire 1 of an electronic component is placed between the tape 3 and the strip base material 2.
1 are sandwiched from above and below, and are thermocompression bonded and integrated by a thermocompression roller 5.
この熱圧着ローラ５は、ローラの側面に熱風を吹き付け
、或いはローラにヒータを埋設し該ヒータにて加熱する
といった手法によって常にローラ面が接着テープ３の接
着材の熱融点以上の温度に保たれたもので、第２図に拡
大して示すように、ローラ面には接着テープ３との剥離
性に優れた四弗化エチレン等の耐熱性合成樹脂被膜５１
が形成され、また圧着時に電子部品のリード線１１が嵌
る凹溝５２も所定間隔をあけて形成されている。The thermocompression roller 5 has a roller surface that is always kept at a temperature higher than the melting point of the adhesive material of the adhesive tape 3 by blowing hot air onto the side surface of the roller or by embedding a heater in the roller and heating it with the heater. As shown in an enlarged view in FIG. 2, the roller surface is coated with a heat-resistant synthetic resin coating 51 such as tetrafluoroethylene that has excellent peelability from the adhesive tape 3.
are formed, and concave grooves 52 into which lead wires 11 of electronic components fit during crimping are also formed at predetermined intervals.
そのため、供給されてくる接着テープ３が圧着前にこの
熱圧着ローラ５に接触すると、熱軟化して良好な粘着性
をもち、この状態は該テープ３が帯状基材２に圧着され
て熱圧着ローラ５から剥離するまで持続する。従って、
接着テープ３の帯状基材２に対する接着強度は、従来の
熱風加熱の場合に比べるとはるかに大であり、またロー
ラ面からの該テープ３の剥離性は前記の合成樹脂波１！
５１の働きにより頗る良好である。Therefore, when the supplied adhesive tape 3 comes into contact with this thermocompression roller 5 before compression bonding, it becomes thermally softened and has good adhesive properties. It continues until it peels off from the roller 5. Therefore,
The adhesive strength of the adhesive tape 3 to the strip-shaped base material 2 is much higher than that in the case of conventional hot air heating, and the peelability of the tape 3 from the roller surface is comparable to that of the synthetic resin wave 1!
It is extremely good due to the action of 51.
けれども、接着テープ３のリード線被覆部３１と熱圧着
ローラ５の凹溝底面５３との間には従来と同様の隙間が
設けられ、圧着時に凹溝５２の両側の角部５４が帯状基
材２に食い込んで強くテープ３を押圧できるようにしで
あるので、該テープ３のリード線被覆部３１が圧着時に
凹溝底面５３によって押圧されることはなく、従ってま
だ接着強度が充分ではない。そこで、本発明方法では第
１図に示すように、圧着後、更にこのリード線被覆部３
１を加圧ローラ６で押圧してリード線１１に密着させる
と共に、好ましくはこの押圧力によりリード線被覆部３
１を第４図に破線で示すように内側に変形させて接着面
積を増加することによって、接着強度を高めている。However, a gap is provided between the lead wire covering portion 31 of the adhesive tape 3 and the groove bottom surface 53 of the thermocompression bonding roller 5, as in the conventional case, and the corner portions 54 on both sides of the groove 52 are attached to the strip-shaped base material during pressure bonding. Since the lead wire covering part 31 of the tape 3 is not pressed by the bottom surface 53 of the concave groove during crimping, the adhesive strength is not yet sufficient. Therefore, in the method of the present invention, as shown in FIG.
1 is pressed by a pressure roller 6 to bring it into close contact with the lead wire 11, and preferably the lead wire covering portion 3 is pressed by this pressing force.
1 is deformed inward as shown by the broken line in FIG. 4 to increase the bonding area, thereby increasing the bonding strength.
かかる加圧ローラ６としては、ローラ面が適度に弾性変
形可能なゴムローラ等が好適であり、このようなゴムロ
ーラを用いると、第３図に拡大して示すように、ローラ
面６１が押圧時に回度形してリード線被覆部３１の上半
分をほぼ均等に押圧するので接着強度が大幅に向上し、
またクッション作用によってリード線被覆部３１やリー
ド線１１の破損等を防止する利点がある。As the pressure roller 6, a rubber roller or the like whose roller surface can be appropriately elastically deformed is suitable. When such a rubber roller is used, the roller surface 61 rotates when pressed, as shown in an enlarged view in FIG. Since the upper half of the lead wire covering part 31 is pressed almost evenly, the adhesive strength is greatly improved.
Further, there is an advantage that the lead wire covering portion 31 and the lead wire 11 are prevented from being damaged due to the cushioning effect.
昨月りばぢＬ展
以上のように、帯状基材２と接着テープ３との間に電子
部品１のリード線（テーピング部）１１を挟み、該リー
ド線１１が嵌る凹溝５２をローラ面に備えた熱圧着ロー
ラ５により接着テープ３を帯状基材２に圧着した後、加
圧ローラ６により更に押圧する構成とすれば、接着テー
プ３が圧着前にこの熱圧着ローラ５で充分に加熱されて
軟化し、圧着後該ローラから剥離するまで良好な粘着性
を維持するので、接着テープ３の帯状基材２に対する接
着強度は従来の熱風加熱の場合に比べてはるかに大きく
なる。しかも、圧着後には、該テープ３のリード線被覆
部３１が加圧ローラ６によって更に押圧されてリード線
１１に密着し、且つ接着面積も増加するので、リード線
１１を一層強固にテーピング固定することが可能となる
。従って、本発明の製造方法によって得られる電子部品
連Ｅは、リード線１１が強固にテーピング固定されてい
るので、電子部品連Ｅの横ずれや脱落が皆無に等しく、
頗る信頼性の高いものとなる。Last month's Ribaji L Exhibition As described above, the lead wire (taping part) 11 of the electronic component 1 is sandwiched between the strip-shaped base material 2 and the adhesive tape 3, and the concave groove 52 into which the lead wire 11 fits is placed on the roller surface. If the adhesive tape 3 is pressed onto the band-shaped base material 2 by the thermocompression roller 5 provided in the above, and then further pressed by the pressure roller 6, the adhesive tape 3 is sufficiently heated by the thermocompression roller 5 before being crimped. Since the adhesive tape 3 is softened and maintains good adhesion until it is peeled off from the roller after being crimped, the adhesive strength of the adhesive tape 3 to the strip base material 2 is much greater than in the case of conventional hot air heating. Furthermore, after crimping, the lead wire covering portion 31 of the tape 3 is further pressed by the pressure roller 6 and comes into close contact with the lead wire 11, and the adhesion area also increases, so that the lead wire 11 can be fixed even more firmly with the taping. becomes possible. Therefore, in the electronic component chain E obtained by the manufacturing method of the present invention, since the lead wire 11 is firmly fixed with taping, there is almost no lateral displacement or falling off of the electronic component chain E.
It becomes extremely reliable.
第１図は本発明の一実施例の説明図、第２図は熱圧着ロ
ーラによる熱圧着工程の説明図、第３図は加圧ローラに
よる押圧工程の説明図、第４図は押圧時におけるリード
線被覆部の変形状態の説明図、第５図は電子部品連の一
例を示す斜視図、第第６図は従来法の説明図、第７図は
同従来法における圧着状態の説明図である。
１・・・電子部品、１１・・・テーピング部（リード線
）、２・・・帯状基材、３・・・接着テープ、 ５・・
・熱圧着ローラ、５２・・・凹溝、６・・・加圧ロール
。
特許出願人 株式会社村田製作所
代理人 ｆＰ理士 中高 司創
第１図
第２図
第７図Fig. 1 is an explanatory diagram of one embodiment of the present invention, Fig. 2 is an explanatory diagram of a thermocompression bonding process using a thermocompression bonding roller, Fig. 3 is an explanatory diagram of a pressing process using a pressure roller, and Fig. 4 is an explanatory diagram of the pressing process during pressing. FIG. 5 is a perspective view showing an example of a series of electronic components; FIG. 6 is an illustration of a conventional method; and FIG. 7 is an illustration of a crimped state in the conventional method. be. DESCRIPTION OF SYMBOLS 1... Electronic component, 11... Taping part (lead wire), 2... Band-shaped base material, 3... Adhesive tape, 5...
・Thermocompression roller, 52...concave groove, 6...pressure roll. Patent applicant Murata Manufacturing Co., Ltd. Agent fP Physician Tsukasa Nakataka Figure 1 Figure 2 Figure 7
Claims (1)
ング部を挟み、該テーピング部が嵌る凹溝をローラ面に
備えた熱圧着ローラにより接着テープを帯状基材に圧着
した後、加圧ローラにより更に押圧することを特徴とす
る、電子部品連の製造方法。(1) The taping part of the electronic component is sandwiched between the band-shaped base material and the adhesive tape, and the adhesive tape is pressed onto the band-shaped base material using a thermocompression roller having a groove on the roller surface into which the taping part fits, and then A method for manufacturing a series of electronic components, characterized by further pressing with a pressure roller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9526785A JPS61259913A (en) | 1985-05-02 | 1985-05-02 | Manufacture of electronic part run |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9526785A JPS61259913A (en) | 1985-05-02 | 1985-05-02 | Manufacture of electronic part run |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61259913A true JPS61259913A (en) | 1986-11-18 |
| JPH0455931B2 JPH0455931B2 (en) | 1992-09-04 |
Family
ID=14132988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9526785A Granted JPS61259913A (en) | 1985-05-02 | 1985-05-02 | Manufacture of electronic part run |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61259913A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03133711A (en) * | 1989-10-20 | 1991-06-06 | Yunitetsuku:Kk | Method and device for taping lead type electronic component |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5711519A (en) * | 1980-06-25 | 1982-01-21 | Toshiba Corp | Constituent for elastic surface wave resonator |
| JPS5757855A (en) * | 1980-09-22 | 1982-04-07 | Hitachi Ltd | Aluminum material for sintering |
-
1985
- 1985-05-02 JP JP9526785A patent/JPS61259913A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5711519A (en) * | 1980-06-25 | 1982-01-21 | Toshiba Corp | Constituent for elastic surface wave resonator |
| JPS5757855A (en) * | 1980-09-22 | 1982-04-07 | Hitachi Ltd | Aluminum material for sintering |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03133711A (en) * | 1989-10-20 | 1991-06-06 | Yunitetsuku:Kk | Method and device for taping lead type electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0455931B2 (en) | 1992-09-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |