JPH0455931B2 - - Google Patents
Info
- Publication number
- JPH0455931B2 JPH0455931B2 JP60095267A JP9526785A JPH0455931B2 JP H0455931 B2 JPH0455931 B2 JP H0455931B2 JP 60095267 A JP60095267 A JP 60095267A JP 9526785 A JP9526785 A JP 9526785A JP H0455931 B2 JPH0455931 B2 JP H0455931B2
- Authority
- JP
- Japan
- Prior art keywords
- roller
- lead wire
- adhesive tape
- base material
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002390 adhesive tape Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 19
- 238000003825 pressing Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 27
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 238000002788 crimping Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000007906 compression Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Packages (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電子部品連、殊にリード線が同一方
向に突出した所謂ラジアルリード形電子部品を帯
状基材上に多数並べてその上から接着テープで固
定した電子部品連の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a series of electronic components, particularly a large number of so-called radial lead type electronic components in which lead wires protrude in the same direction, which are arranged on a strip-shaped base material and then covered with an adhesive tape. The present invention relates to a method for manufacturing a series of fixed electronic components.
従来の技術
第５図に示すように、双方のリード線１１が同
一方向に突出する所謂ラジアルリード形電子部品
１は、通常、送り孔２１付きのテーピング台紙の
ような帯状基材２の上に該リード線１１を載置
し、その上から接着テープ３で固定することによ
つて、該ラジアルリード形電子部品１が千個ない
し５千個程度連なる電子部品連Ｅに構成され、リ
ール等に巻取られている。BACKGROUND TECHNOLOGY As shown in FIG. 5, a so-called radial lead type electronic component 1 in which both lead wires 11 protrude in the same direction is usually mounted on a strip-shaped base material 2 such as a taping board with feed holes 21. By placing the lead wire 11 and fixing it with adhesive tape 3 from above, the radial lead type electronic component 1 is configured into an electronic component chain E consisting of about 1,000 to 5,000 pieces, and is attached to a reel or the like. It is rolled up.
ところで、このような電子部品連Ｅは、これま
で第６図に示すように、電子部品のリード線１１
を帯状基材２に載置して圧着ローラ４に連続供給
する一方、熱風Ｂをあてて粘着性を持たせた接着
テープ３を斜め上方から連続供給し、該リード線
１１を圧着ローラ４の凹溝部４１に嵌めながらそ
のローラ面４２で接着テープ３を帯状基材２に圧
着することによつて、連続適に製造されていた。 By the way, as shown in FIG.
is placed on the strip-shaped base material 2 and continuously supplied to the pressure roller 4, while the adhesive tape 3, which has been made sticky by applying hot air B, is continuously supplied diagonally from above, and the lead wire 11 is attached to the pressure roller 4. The adhesive tape 3 was continuously manufactured by pressing the adhesive tape 3 onto the strip-shaped base material 2 with the roller surface 42 while fitting it into the groove 41.
しかしながら、かかる製造方法によれば次のよ
うな問題があつた。 However, this manufacturing method has the following problems.
発明が解決しようとする問題点
即ち、電子部品のリード線１１を横ずれなく堅
固に固定するためには、接着テープ３に充分な粘
着性をもたせること、及び第７図に示すように接
着テープ３のリード線被覆部３１の両側を圧着ロ
ーラ４の凹溝４１両側の角部４３で強く押圧して
リード線被覆部３１とリード線１１の接着強度を
高めることが必要となる。Problems to be Solved by the Invention Namely, in order to securely fix the lead wires 11 of electronic components without lateral displacement, the adhesive tape 3 must have sufficient adhesiveness, and the adhesive tape 3 must have sufficient adhesiveness as shown in FIG. It is necessary to strongly press both sides of the lead wire covering part 31 with the corners 43 on both sides of the concave groove 41 of the pressure roller 4 to increase the adhesive strength between the lead wire covering part 31 and the lead wire 11.
しかしながら、上記の製造方法では接着テープ
３に熱風Ｂをあてて加熱する手段を採用している
関係上、たとえ圧着前に該テープ３を充分に加熱
しても、熱容量の大きい圧着ローラ４に接すると
すぐに冷えるため、該テープ３に良好な粘着性を
もたせることが困難であつた。しかも、圧着ロー
ラ４の凹溝４１両側の角度４３が帯状基材２に食
い込んで強くテープ３を押圧できるように凹溝底
面４４とテープ３のリード線被覆部３１との間に
適当な隙間をもうけているため、圧着時にリード
線被覆部３１は凹溝底面４４によつてリード線１
１に押圧されず、単にリード線被覆部３１の引張
力によつて弱く押圧されるだけとなり、リード線
被覆部１１とリード線３１との接着強度も不充分
であつた。以上のことから、従来の製造方法で
は、電子部品を横ずれなく堅固にテーピング固定
した信頼性の高い電子部品連Ｅを得ることが容易
でないという問題があつた。 However, since the above manufacturing method employs a method of heating the adhesive tape 3 by applying hot air B to it, even if the tape 3 is sufficiently heated before crimping, it will not come into contact with the crimping roller 4, which has a large heat capacity. Since the tape 3 cools down quickly, it was difficult to provide the tape 3 with good adhesiveness. In addition, an appropriate gap is provided between the groove bottom surface 44 and the lead wire covering portion 31 of the tape 3 so that the angles 43 on both sides of the groove 41 of the pressure roller 4 can bite into the strip-shaped base material 2 and press the tape 3 strongly. During crimping, the lead wire sheathing portion 31 is attached to the lead wire 1 by the concave groove bottom surface 44.
1, but was only weakly pressed by the tensile force of the lead wire covering section 31, and the adhesive strength between the lead wire covering section 11 and the lead wire 31 was also insufficient. From the above, the conventional manufacturing method has a problem in that it is not easy to obtain a highly reliable electronic component series E in which electronic components are securely taped and fixed without lateral displacement.
問題点を解決するための手段
本発明の製造方法は、上記の問題点を解決する
ために、帯状基材と接着テープとの間に電子部品
のテーピング部を挟み、該テーピング部が嵌る凹
溝をローラ面に備えた熱圧着ローラにより接着テ
ープを帯状基材に圧着した後、加圧ローラにより
更に押圧することを要旨とするものである。Means for Solving the Problems In order to solve the above-mentioned problems, the manufacturing method of the present invention sandwiches the taping portion of an electronic component between a strip base material and an adhesive tape, and provides a concave groove into which the taping portion fits. The gist of this method is to press the adhesive tape onto a strip-shaped base material using a thermocompression roller having a pressure roller on the roller surface, and then further press the adhesive tape using a pressure roller.
以下、実施例を挙げて本発明を詳述する。 Hereinafter, the present invention will be explained in detail with reference to Examples.
実施例
第１図は本発明の一実施例の説明図であつて、
これによれば、電子部品のテーピング部、つまり
リード線１１を表面に載置した帯状基材２が熱圧
着ロール５に連続供給される。この帯状基材２
は、第５図に示すような送り孔２１付きのテーピ
ング台紙等からなるものである。これと同時に斜
め上方からは接着テープ３が連続供給され、該テ
ープ３と帯状基材２との間に電子部品のリード線
１１が上下から挟まれて、熱圧着ローラ５により
熱圧着一体化される。Embodiment FIG. 1 is an explanatory diagram of an embodiment of the present invention.
According to this, the strip-shaped base material 2 on which the taping portion of the electronic component, that is, the lead wire 11 is placed on the surface, is continuously supplied to the thermocompression roll 5. This strip-shaped base material 2
This is made of a taping mount or the like with a feed hole 21 as shown in FIG. At the same time, the adhesive tape 3 is continuously supplied from diagonally above, and the lead wire 11 of the electronic component is sandwiched between the tape 3 and the strip-shaped base material 2 from above and below, and is thermocompression-bonded and integrated by the thermocompression roller 5. Ru.
この熱圧着ローラ５は、ローラの側面に熱風を
吹き付け、或いはローラにヒータを埋設し該ヒー
タにて加熱するといつた手法によつて常にローラ
面が接着テープ３の接着材の熱融点以上の温度に
保たれたもので、第２図に拡大して示すように、
ローラ面には接着テープ３との剥離性に優れた四
弗化エチレン等の耐熱性合成樹脂被膜５１が形成
され、また圧着得に電子部品のリード線１１が嵌
る凹溝５２も所定間隔をあけて形成されている。
そのため、供給されてくる接着テープ３が圧着前
にこの熱圧着ローラ５に接触すると、熱軟化して
良好な粘着性をもち、この状態は該テープ３が帯
状基材２に圧着されて熱圧着ローラ５から剥離す
るまで持続する。従つて、接着テープ３の帯状基
材２に対する接着強度は、従来の熱風加熱の場合
に比べるとはるかに大であり、またローラ面から
の該テープ３の剥離性は前記の合成樹脂被膜５１
の働きにより頗る良好である。 The thermocompression roller 5 is manufactured by blowing hot air onto the side surface of the roller, or by embedding a heater in the roller and heating it with the heater, so that the roller surface is always kept at a temperature higher than the melting point of the adhesive material of the adhesive tape 3. As shown in the enlarged view in Figure 2,
A heat-resistant synthetic resin film 51 made of tetrafluoroethylene or the like that has excellent releasability from the adhesive tape 3 is formed on the roller surface, and grooves 52 into which lead wires 11 of electronic components are fitted are also spaced at predetermined intervals. It is formed by
Therefore, when the supplied adhesive tape 3 comes into contact with this thermocompression roller 5 before compression bonding, it becomes thermally softened and has good adhesive properties. It continues until it peels off from the roller 5. Therefore, the adhesive strength of the adhesive tape 3 to the strip base material 2 is much higher than that in the case of conventional hot air heating, and the releasability of the tape 3 from the roller surface is higher than that of the synthetic resin coating 51.
It is very good due to the function of
けれども、接着テープ３のリード線被覆部３１
と熱圧着ローラ５の凹溝底面５３との間には従来
と同様の隙間が設けられ、圧着時に凹溝５２の両
側の角部５４が帯状基材２に食い込んで強くテー
プ３を押圧できるようにしてあるので、該テープ
３のリード線被覆部３１が圧着時に凹溝底面５３
によつて押圧されることはなく、従つてまだ接着
強度が充分ではない。そこで、本発明方法では第
１図に示すように、圧着後、更にこのリード線被
覆部３１を加圧ローラ６で押圧してリード線１１
に密着させると共に、好ましくはこの押圧力によ
りリード線被覆部３１を第４図に破線で示すよう
に内側に変形させて接着面積を増加することによ
つて、接着強度を高めている。 However, the lead wire covering portion 31 of the adhesive tape 3
A gap similar to the conventional one is provided between the groove bottom surface 53 of the thermocompression bonding roller 5, and the corners 54 on both sides of the groove 52 bite into the strip base material 2 during pressure bonding so that the tape 3 can be strongly pressed. Since the lead wire covering portion 31 of the tape 3 is crimped, the bottom surface 53 of the concave groove is
Therefore, the adhesive strength is not yet sufficient. Therefore, in the method of the present invention, as shown in FIG.
The bonding strength is increased by bringing the lead wire covering portion 31 into close contact with the lead wire and, preferably, by this pressing force, the lead wire covering portion 31 is deformed inward as shown by the broken line in FIG. 4 to increase the bonding area.
かかる加圧ローラ６としては、ローラ面が適度
に弾性変形可能なゴムローラ等が好適であり、こ
のようなゴムローラを用いると、第３図に拡大し
て示すように、ローラ面６１が押圧時に凹変形し
てリード線被覆部３１の上半分をほぼ均等に押圧
するので接着強度が大幅に向上し、またクツシヨ
ン作用によつてリード線被覆部３１やリード線１
１の破損等を防止する利点がある。 As the pressure roller 6, a rubber roller or the like whose roller surface can be appropriately elastically deformed is suitable. When such a rubber roller is used, the roller surface 61 becomes concave when pressed, as shown in an enlarged view in FIG. Since the upper half of the lead wire covering part 31 is deformed and pressed almost evenly, the adhesive strength is greatly improved, and the lead wire covering part 31 and the lead wire 1 are
This has the advantage of preventing damage to the item 1.
作用及び効果
以上のように、帯状基材２と接着テープ３との
間に電子部品１のリード線（テーピング部）１１
を挟み、該リード線１１が嵌る凹溝５２をローラ
面に備えた熱圧着ローラ５により接着テープ３を
帯状基材２に圧着した後、加圧ローラ６により更
に押圧する構成とすれば、接着テープ３が圧着前
にこの熱圧着ローラ５で充分に加熱されて軟化
し、圧着後該ローラから剥離するまで良好な粘着
性を維持するので、接着テープ３の帯状基材２に
対する接着強度は従来の熱風加熱の場合に比べて
はるかに大きくなる。しかも、圧着後には、該テ
ープ３のリード線被覆部３１が加圧ローラ６によ
つて更に押圧されてリード線１１に密着し、且つ
接着面積も増加するので、リード線１１を一層強
固にテーピング固定することが可能となる。従つ
て、本判明の製造方法によつて得られる電子部品
連Ｅは、リード線１１が強固にテーピング固定さ
れているので、電子部品連Ｅの横ずれや脱落が皆
無に等しく、頗る信頼性の高いものとなる。Function and Effect As described above, the lead wire (taping part) 11 of the electronic component 1 is placed between the strip base material 2 and the adhesive tape 3.
If the adhesive tape 3 is pressed onto the strip base material 2 by a thermocompression roller 5 having a concave groove 52 on the roller surface in which the lead wire 11 is inserted, and then further pressed by a pressure roller 6, the adhesive tape 3 can be bonded. Since the tape 3 is sufficiently heated and softened by the thermo-compression roller 5 before pressing, and maintains good adhesion until it is peeled off from the roller after pressing, the adhesive strength of the adhesive tape 3 to the strip-shaped base material 2 is the same as that of the conventional one. This is much larger than in the case of hot air heating. Furthermore, after crimping, the lead wire covering portion 31 of the tape 3 is further pressed by the pressure roller 6 and comes into close contact with the lead wire 11, and the adhesion area also increases, so that the lead wire 11 can be taped even more firmly. It becomes possible to fix it. Therefore, since the lead wires 11 are firmly fixed with taping, the electronic component chain E obtained by the manufacturing method disclosed in the present invention has almost no lateral displacement or falling off, and has extremely high reliability. Become something.
第１図は本発明の一実施例の説明図、第２図は
熱圧着ローラによる熱圧着工程の説明図、第３図
は加圧ローラによる押圧工程の説明図、第４図は
押圧時におけるリード線被覆部の変形状態の説明
図、第５図は電子部品連の一例を示す斜視図、第
６図は従来法の説明図、第７図は同従来法におけ
る圧着状態の説明図である。
１……電子部品、１１……テーピング部（リー
ド線）、２……帯状基材、３……接着テープ、５
……熱圧着ローラ、５２……凹溝、６……加圧ロ
ール。
Fig. 1 is an explanatory diagram of one embodiment of the present invention, Fig. 2 is an explanatory diagram of a thermocompression bonding process using a thermocompression bonding roller, Fig. 3 is an explanatory diagram of a pressing process using a pressure roller, and Fig. 4 is an explanatory diagram of the pressing process during pressing. FIG. 5 is a perspective view showing an example of a series of electronic components; FIG. 6 is an explanatory diagram of a conventional method; FIG. 7 is an explanatory diagram of a crimped state in the conventional method. . DESCRIPTION OF SYMBOLS 1... Electronic component, 11... Taping part (lead wire), 2... Band-shaped base material, 3... Adhesive tape, 5
...Thermocompression roller, 52 ... Concave groove, 6 ... Pressure roll.
Claims (1)
ーピング部を挟み、該テーピング部が嵌る凹溝を
ローラ面に備えた熱圧着ローンにより接着テープ
を帯状基材に圧着した後、加圧ローラにより更に
押圧することを特徴とする、電子部品連の製造方
法。1. After sandwiching the taping part of the electronic component between the band-shaped base material and the adhesive tape and pressing the adhesive tape onto the band-shaped base material using a thermocompression roller having a groove on the roller surface into which the taping part fits, the pressure roller A method for manufacturing a series of electronic components, characterized by further pressing the series with
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9526785A JPS61259913A (en) | 1985-05-02 | 1985-05-02 | Manufacture of electronic part run |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9526785A JPS61259913A (en) | 1985-05-02 | 1985-05-02 | Manufacture of electronic part run |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61259913A JPS61259913A (en) | 1986-11-18 |
| JPH0455931B2 true JPH0455931B2 (en) | 1992-09-04 |
Family
ID=14132988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9526785A Granted JPS61259913A (en) | 1985-05-02 | 1985-05-02 | Manufacture of electronic part run |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61259913A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03133711A (en) * | 1989-10-20 | 1991-06-06 | Yunitetsuku:Kk | Method and device for taping lead type electronic component |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5711519A (en) * | 1980-06-25 | 1982-01-21 | Toshiba Corp | Constituent for elastic surface wave resonator |
| JPS5757855A (en) * | 1980-09-22 | 1982-04-07 | Hitachi Ltd | Aluminum material for sintering |
-
1985
- 1985-05-02 JP JP9526785A patent/JPS61259913A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5711519A (en) * | 1980-06-25 | 1982-01-21 | Toshiba Corp | Constituent for elastic surface wave resonator |
| JPS5757855A (en) * | 1980-09-22 | 1982-04-07 | Hitachi Ltd | Aluminum material for sintering |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61259913A (en) | 1986-11-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |