JPS61257749A - Oscillating spindle shaft in automatic surface grinder for semiconductor wafer - Google Patents
Oscillating spindle shaft in automatic surface grinder for semiconductor waferInfo
- Publication number
- JPS61257749A JPS61257749A JP9598985A JP9598985A JPS61257749A JP S61257749 A JPS61257749 A JP S61257749A JP 9598985 A JP9598985 A JP 9598985A JP 9598985 A JP9598985 A JP 9598985A JP S61257749 A JPS61257749 A JP S61257749A
- Authority
- JP
- Japan
- Prior art keywords
- spindle shaft
- cam
- shaft
- semiconductor wafer
- grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、単品毎にカートリッジから送出される広径薄
物ウェハを平面研削盤へ正確に載置し、バキューム吸着
せしめて自動研削する平面研削盤のスピンドル軸に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a spindle shaft of a surface grinding machine that accurately places wide-diameter thin wafers sent out from a cartridge one by one on a surface grinder, vacuums them, and automatically grinds them.
現今における弛まざる技術革新は目覚ましいものがあり
、其の先端技術による開発によって、優れた様々な商品
群が多数送出されている。Today's continuous technological innovation is remarkable, and the development of cutting-edge technology has produced a large number of excellent product groups.
本発明に係る特にこの種のコンピュータ、マイコン等を
搭載した電子関連機器の開発は、実に日進月歩の感があ
り、更により高度な応用技術の開発に鏑を削っている実
状にある。In particular, the development of electronic equipment equipped with computers, microcomputers, etc. of this type according to the present invention seems to be progressing rapidly, and efforts are being made to develop even more advanced applied technologies.
このため半導体ウェハは、より超高度の質性と、小型化
に繋がる或は大量集積回路化の図れるように、広径化、
極薄化が要求されてきつつある。For this reason, semiconductor wafers are becoming wider and wider in order to achieve ultra-high quality, miniaturization, and mass integration of circuits.
There is a growing demand for ultra-thin devices.
従来、半導体ウェハは自動平面研削盤の1等分され枠に
よって形成されたロータリーテーブルの複数箇所のチャ
ックへエヤー吸着され、チャックの回転によって共に回
転し、上部より逆方向に回転するスピンドル軸が降下し
て、下端のカップホイールへ固着したダイヤモンド砥石
によって研削されるが、干渉領域の研削する速度を略均
−化するために、被加工物である半導体ウェハの外周よ
り中心辺まで、即ち、ウェハの略半径分の領域で研削を
され、ダイヤモンド砥石側のスピンドル軸においても軸
心が該ウェハの中心よりずらせて設けており、半導体ウ
ェハの略中心辺は該砥石の最高周蓮度をもつ外周で研削
するように構成されており、双方がお互いに自回転をし
ているため全面を研削することが可能である。Conventionally, semiconductor wafers are divided into equal parts of an automatic surface grinding machine, and are adsorbed with air to chucks at multiple locations on a rotary table formed by a frame, and as the chucks rotate, they rotate together, and a spindle shaft that rotates in the opposite direction descends from the top. The diamond grinding wheel fixed to the cup wheel at the lower end grinds the semiconductor wafer, but in order to approximately equalize the grinding speed of the interference area, the wafer is The spindle shaft on the diamond grinding wheel side is also set so that its axis is offset from the center of the wafer, and the approximate center of the semiconductor wafer is ground at the outer periphery of the grinding wheel with the highest degree of rotation. Since both wheels rotate on their own, it is possible to grind the entire surface.
しかし、この様な方法では砥石の外周部即ち、半導体ウ
ェハの中心点近傍に周速の関係で小突起が残る問題点が
ある。However, this method has the problem that small protrusions remain on the outer periphery of the grinding wheel, that is, near the center point of the semiconductor wafer, due to the circumferential speed.
本発明は上記の事由に着目して、鋭意研鎖の結果、この
問題点を一挙に排除すると共に、広径化、極薄化する半
導体ウェハの精度向上の要望に応じて余りある自動平面
研削盤に創達し、これを供せんとするものである。Focusing on the above-mentioned reasons, the present invention has been developed to eliminate these problems at once as a result of extensive research, and to meet the demand for improving the precision of semiconductor wafers, which are becoming wider in diameter and ultra-thin. It is created on a board and is intended to be offered as an offering.
斯る目的を達成せしめた本発明の半導体ウェハの自動平
面研削盤における揺動スピンドル軸を以下実施例の図面
によって説明する。A swing spindle shaft in an automatic surface grinding machine for semiconductor wafers according to the present invention, which achieves the above object, will be explained below with reference to drawings of embodiments.
第1図は本発明の説明の為の一実施例の全体の概要平面
図であり、第2図は要部説明のための側面図である。FIG. 1 is a general plan view of an entire embodiment for explaining the present invention, and FIG. 2 is a side view for explaining the main parts.
多数枚の半導体ウェハAを単品毎に集積格納して昇降自
在なカートリッジBから、ベルトコンベヤー1によって
送出される半導体ウェハAは、先端に吸着パット2を備
えて半転機能を有する移送アーム3によって吸着、反転
されてプリポジション装置4の面上へ移送される。そし
て、プリポジション装置4で正確な位置決めと洗浄を、
液体の噴流によって行ない、先端にエヤー吸着パット5
を備えた水平方向に回転かつ進退し、並びに昇降可能な
ウェハの移送アーム6によって、平面研削盤本体7のロ
ータ、リーチ−プル8の6等分した枠によって設けられ
た6ケ箇所のチャック9のチャック位1i9aへ正確に
案内され確りとバキューム吸着される。ロータリーテー
ブル8は一定の低速で1/6づつ回転、停止を繰り返し
、チャック9はロータリーテーブル8が停止した時に予
め規定せしめた自回転を始めロータリーテーブル8の回
転中ば自回転を停止する機構である。次いでチャック位
置9aはロータリーテーブル8の回転によって9bの位
置へ移動し、上部より回転するスピンドル軸10自動降
下し下端のカップホイール11へに固着されたダイヤモ
ンド砥石12で最初の荒研削が開始される。Semiconductor wafers A are delivered by a belt conveyor 1 from a cartridge B that stores a large number of semiconductor wafers A individually and can be raised and lowered. It is adsorbed, reversed, and transferred onto the surface of the preposition device 4. Then, the preposition device 4 performs accurate positioning and cleaning.
It is carried out by a jet of liquid, and an air suction pad 5 is attached to the tip.
The wafer transfer arm 6, which can rotate horizontally, move forward and backward, and move up and down, has six chucks 9 provided by the rotor of the surface grinder main body 7, and the frame divided into six equal parts of the reach-pull 8. It is accurately guided to the chuck position 1i9a and firmly vacuumed. The rotary table 8 repeatedly rotates and stops in 1/6 increments at a constant low speed, and the chuck 9 is a mechanism that starts self-rotation according to a predetermined value when the rotary table 8 stops, and stops the self-rotation while the rotary table 8 is rotating. be. Next, the chuck position 9a is moved to the position 9b by the rotation of the rotary table 8, and the spindle shaft 10 rotating from the top is automatically lowered, and the first rough grinding is started with the diamond grinding wheel 12 fixed to the cup wheel 11 at the lower end. .
本発明は前記研削中の被研削物の半導体ウェハAの中心
辺に残留する小突起物を皆無となすためのもので、チャ
ック9は高速で自回転を開始し。The present invention is intended to eliminate any small protrusions remaining on the central side of the semiconductor wafer A that is being ground, and the chuck 9 starts to rotate at high speed.
スピンドル軸10が自動降下して、最初の研削が定めら
れた量の削りしろを任意の微速度の降下量による、該軸
10下端のカップホイール11へ固着したダイヤモンド
砥石12の切り込み量で研削を開始するが、カップホイ
ール型ダイヤモンド砥石12を下端へ固着したスピンド
ル軸10上部の担#13へ内面円筒凹状陥部14を穿設
して、電動モータニ15で駆動する駆動歯車16と、該
歯車16と歯合する他の笠歯車17等と連動して水平方
向へ回転するカム軸18へカム19を国定し、前記担体
13に形成した内面円筒状凹陥部14ヘカム19を挿入
し、該カム19を回転摺動させて、スピンドル軸10に
揺動を与えるもので、揺動によって半導体ウェハの中心
辺に残留する小突起を研削して皆無と成すものである。The spindle shaft 10 is automatically lowered, and the initial grinding is performed by grinding a predetermined amount of cutting margin by the cutting amount of the diamond grinding wheel 12 fixed to the cup wheel 11 at the lower end of the shaft 10 by descending at an arbitrary slow speed. To start, an inner cylindrical concave portion 14 is bored in the support #13 on the upper part of the spindle shaft 10 to which the cup wheel type diamond grinding wheel 12 is fixed to the lower end, and a driving gear 16 driven by an electric motor 15 is formed. The cam 19 is fixed to the cam shaft 18 which rotates horizontally in conjunction with other gears 17 etc. that mesh with the cam 19, and the cam 19 is inserted into the inner cylindrical recess 14 formed in the carrier 13. The spindle shaft 10 is rotated and slid to give swinging motion to the spindle shaft 10, and the swinging grinds away small protrusions remaining on the center side of the semiconductor wafer.
チャック位置9bで研削完了後はスピンドル軸10は上
昇して研削砥石12からウェハAは開放されロータリー
テーブル8の回転によりチャック位置9Cへ移動し、更
に前記方法によって中仕上げ研削を行なうものである。After the grinding is completed at the chuck position 9b, the spindle shaft 10 is raised, the wafer A is released from the grinding wheel 12, and is moved to the chuck position 9C by the rotation of the rotary table 8, where semi-finishing grinding is performed by the method described above.
そして、チャック位置9dでは同様に仕上げの研削を行
なうが、チャック位置9c、9dでも、本発明の揺動ス
ピンドル軸を用いて研削を行なうことは勿論である。Finish grinding is similarly performed at the chuck position 9d, but it goes without saying that the grinding is also performed at the chuck positions 9c and 9d using the swing spindle shaft of the present invention.
次いで、研削を完了した極薄半導体ウェハAはチャック
位置9eで洗浄された後、先端に収納用移送アームの吸
着パット20を備えた水平方向に回転かつ進退し、並び
に昇降可能な収納用移送アーム21で吸着され洗浄及び
乾燥装置22へ移送されて、洗浄並びに乾燥後に収納用
反転アームのエヤー吸着パット23を備える収納用反転
アーム24で収納用ベルトコンベヤ25に載置され収納
カートリッジCの収納枠へ整然と単品毎に順次収納され
る構成を持つ自動平面研削盤である。Next, the ultra-thin semiconductor wafer A that has been ground is cleaned at the chuck position 9e, and then moved to the storage transfer arm, which is equipped with a suction pad 20 of the storage transfer arm at the tip and can rotate horizontally and move forward and backward, as well as move up and down. 21 and transferred to the cleaning and drying device 22, and after cleaning and drying, the storage frame of the storage cartridge C is placed on the storage belt conveyor 25 by the storage reversal arm 24 equipped with the air suction pad 23 of the storage reversal arm. This is an automatic surface grinding machine that has a structure in which each item is stored in an orderly manner.
前記の説明は、半導体ウェハが一枚での研削工程の説明
であるが、ウェハAがカートリッジBよリベルトコンベ
ヤ1を経て、プリポジション5へ移送された時には、次
のウェハはカートリッジBよりベルトコンベヤlで移送
され、前のウェハがロータリーテーブル8のチャック位
置9aへ移送されるのを待機する等、これらの動作を繰
返し連続して行なえる自動送り出し、自動回転機構を有
する構成であり、ロータリーテーブル8に設けたチャッ
ク9位置の各々の位置98〜9fでは夫々作業を同時に
連続して行なうものである。即ち、チャック位置9eで
研削を完了したウェハは洗浄乾燥袋!!22へ移送され
、収納用搬送アーム24で収納用コンベヤ25に載置さ
れ、収納用カートリッジCへ収納されるが、ロータリー
テーブル8のチャック9はチャック位置9fで洗浄をし
、次のウェハ研削のための準備を行なうものである。つ
まり、ウェハは、カートリッジ→ベルトコンベヤ→反転
アーム→プリポジション→チャック位置9a→チャック
位置9b→チャック位置9c→チャック位置9d→チャ
ック位置9e→収納用移送アーム→洗浄乾燥装置→収納
用反転アーム→収納用ベルトコンベヤ→収納用カートリ
ッジと、次々と移送され、研削され、収納される自動平
面研削盤である。The above explanation is about the grinding process for one semiconductor wafer, but when wafer A is transferred from cartridge B to preposition 5 via belt conveyor 1, the next wafer is transferred from cartridge B to belt conveyor 1. The structure has automatic feeding and automatic rotation mechanisms that can repeatedly and continuously perform these operations, such as waiting for the previous wafer to be transferred to the chuck position 9a of the rotary table 8. At each of the positions 98 to 9f of the chuck 9 provided at 8, operations are performed simultaneously and continuously. In other words, the wafer that has been ground at chuck position 9e is placed in a cleaning and drying bag! ! 22, placed on the storage conveyor 25 by the storage transfer arm 24, and stored in the storage cartridge C. However, the chuck 9 of the rotary table 8 is cleaned at the chuck position 9f, and is used for the next wafer grinding. This is to prepare for the In other words, the wafer is transferred from the cartridge to the belt conveyor to the reversing arm to the preposition to the chuck position 9a to the chuck position 9b to the chuck position 9c to the chuck position 9d to the chuck position 9e to the storage transfer arm to the cleaning/drying device to the storage reversal arm. This is an automatic surface grinding machine that transports, grinds, and stores one after another from a storage belt conveyor to a storage cartridge.
本実施例はロータリーテーブルが6等分された枠で構成
であるが、その加工工程、方法等により、等分される枠
の数は任意に設定できるものである。In this embodiment, the rotary table is composed of frames divided into six equal parts, but the number of equal parts can be set arbitrarily depending on the processing process, method, etc.
該研削盤に前記揺動スピンドル軸を用いた本発明は、半
導体ウェハの全面における平坦度を出すために、半導体
ウェハとダイヤモンド砥石の研削時の干渉領域での周速
度のアンバランスに基づく小突起の残留を皆無と成し、
広径化、極薄化する −半導体ウェハの全面高精度の鏡
面研削を可能となさしめたものである。The present invention, which uses the above-mentioned oscillating spindle shaft in the grinding machine, aims to improve the flatness of the entire surface of the semiconductor wafer by reducing small protrusions due to the unbalance of the circumferential speed in the area of interference between the semiconductor wafer and the diamond grindstone during grinding. There will be no residual
Wider diameter, ultra-thin - This makes it possible to perform high-precision mirror polishing on the entire surface of semiconductor wafers.
現在要求される極薄化、広径化、かつ、高精度の平坦度
を求めるために本発明の揺動スピンドル軸は対応して余
り有る画期的な方式であり、高品質、高精度の鏡面を得
ることのできるもので、その貢献度は計りしれないもの
があり、極めて有意義な効果を奏するものである。The oscillating spindle shaft of the present invention is an epoch-making method that can meet the current demands for extremely thin, wide diameter, and highly accurate flatness. It is possible to obtain a mirror surface, and its contribution is immeasurable, and it has an extremely meaningful effect.
第1図は本発明の一実施例の説明のための平面図であり
、第2図はその要部の側面図である。
A−ウェハ、B−カートリッジ、C−収納用カートリッ
ジ、
1−ベルトコンベヤ、2−吸着バット、3−移送アーム
、4−プリポジション、5−エヤー吸着バット、6−移
送アーム、7一平面研削盤本体、8−ロータリーテーブ
ル、9−チャック、9a、9b、9c、9d、9e、9
f−チャック位置、10−スピンドル軸、11−カップ
ホイール、12−ダイヤモンド砥石、13−担体、14
−凹陥部、15−電動モーター、16−駆動歯車、17
−歯車、18−カム軸。
19−カム、2〇−収納用移送アームの吸着バット、2
1−収納用移送アーム、22−洗浄及び乾燥装置、23
−収納用反転アームのエヤー吸着バット、24−収納用
反転アーム、25−収納用ベルトコンベヤ。FIG. 1 is a plan view for explaining one embodiment of the present invention, and FIG. 2 is a side view of the main parts thereof. A-Wafer, B-Cartridge, C-Storage cartridge, 1-Belt conveyor, 2-Suction bat, 3-Transfer arm, 4-Preposition, 5-Air suction bat, 6-Transfer arm, 7 One-plane grinder Main body, 8-rotary table, 9-chuck, 9a, 9b, 9c, 9d, 9e, 9
f-chuck position, 10-spindle axis, 11-cup wheel, 12-diamond grindstone, 13-carrier, 14
- recess, 15 - electric motor, 16 - drive gear, 17
- gear, 18 - camshaft. 19-cam, 20-suction butt of storage transfer arm, 2
1-Transfer arm for storage, 22-Washing and drying device, 23
- Air suction bat of inversion arm for storage, 24 - Inversion arm for storage, 25 - Belt conveyor for storage.
Claims (1)
吸着して低速回転するチャック機構を有し一定の低速で
回転、停止を繰り返すロータリーテーブルへ複数個の半
導体ウェハをチャックして自動研削する平面研削盤であ
って、 下端へカップホィール型ダイヤモンド砥石を固着したス
ピンドル軸の上部担体へ内面円筒状凹陥部を穿設し、電
動モーターで駆動する駆動歯車と、該歯車と歯合する他
の歯車と連動して水平方向へ回転するカム軸へカムを国
定し、前記内面円筒状凹陥部へカムを挿入し、該カムを
回転摺動させて、スピンドル軸を揺動する如く成したこ
とを特徴とする半導体ウェハの自動平面研削盤における
揺動スピンドル軸。[Claims] The device is formed by a frame divided into a plurality of equal parts, has a chuck mechanism that air-chucks thin wafers and rotates at low speed, and chucks a plurality of semiconductor wafers onto a rotary table that repeatedly rotates and stops at a constant low speed. This is a surface grinding machine that performs automatic grinding, and has a spindle shaft with a cup wheel type diamond grinding wheel fixed to its lower end, and an inner cylindrical recessed part bored into the upper carrier, and a drive gear driven by an electric motor, and the gear and the teeth. A cam is fixed to the cam shaft which rotates in the horizontal direction in conjunction with other gears, the cam is inserted into the inner cylindrical recessed part, and the cam is rotated and slid to swing the spindle shaft. A swinging spindle shaft for an automatic surface grinding machine for semiconductor wafers, which is characterized by the following:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9598985A JPS61257749A (en) | 1985-05-08 | 1985-05-08 | Oscillating spindle shaft in automatic surface grinder for semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9598985A JPS61257749A (en) | 1985-05-08 | 1985-05-08 | Oscillating spindle shaft in automatic surface grinder for semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61257749A true JPS61257749A (en) | 1986-11-15 |
Family
ID=14152539
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9598985A Pending JPS61257749A (en) | 1985-05-08 | 1985-05-08 | Oscillating spindle shaft in automatic surface grinder for semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61257749A (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57132965A (en) * | 1981-02-03 | 1982-08-17 | Shibayama Kikai Kk | One pass type multi-head plane grinding, polishing, washing automatic machine |
JPS57156158A (en) * | 1981-03-20 | 1982-09-27 | Hitachi Seiko Ltd | Surface grinder |
JPS6052246A (en) * | 1983-09-01 | 1985-03-25 | Mabuchi Shoten:Kk | Polishing machine |
JPS6243832A (en) * | 1985-08-20 | 1987-02-25 | Fuji Electric Co Ltd | Magnetic recording medium |
-
1985
- 1985-05-08 JP JP9598985A patent/JPS61257749A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57132965A (en) * | 1981-02-03 | 1982-08-17 | Shibayama Kikai Kk | One pass type multi-head plane grinding, polishing, washing automatic machine |
JPS57156158A (en) * | 1981-03-20 | 1982-09-27 | Hitachi Seiko Ltd | Surface grinder |
JPS6052246A (en) * | 1983-09-01 | 1985-03-25 | Mabuchi Shoten:Kk | Polishing machine |
JPS6243832A (en) * | 1985-08-20 | 1987-02-25 | Fuji Electric Co Ltd | Magnetic recording medium |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102507675B1 (en) | Wafer processing method | |
JPH1133886A (en) | Method and device for polishing inside surface of glass disc | |
WO1982003038A1 (en) | One-pass type automatic plane multi-head grinding polishing and cleaning machine | |
US4587765A (en) | Method of an apparatus for grinding work surface | |
JPH01257555A (en) | Grinder | |
JP4065078B2 (en) | Disk mirror chamfering device | |
JPH11347953A (en) | Wafer chamfering grinding wheel | |
JPS61257749A (en) | Oscillating spindle shaft in automatic surface grinder for semiconductor wafer | |
JP4227700B2 (en) | Disk mirror chamfering device system | |
JPS6362650A (en) | Polishing machine | |
JP2011245571A (en) | Machining device | |
JPH11207579A (en) | Double surface grinding method for sheet-like work | |
JPS5845851A (en) | Grinding, carrying and cleaning method and device of wafer | |
JP3007678B2 (en) | Polishing apparatus and polishing method | |
JP2556605B2 (en) | Polishing equipment | |
JPH0358869B2 (en) | ||
JPH0577147A (en) | Surface grinding machine | |
JPH11320358A (en) | Polishing device | |
JP2002254288A (en) | Apparatus and method for finishing work | |
JP2907856B2 (en) | Dressing method of grinding wheel | |
JPS6257462B2 (en) | ||
JPH0413553A (en) | Grinding device | |
JPH0818205B2 (en) | Machine Tools | |
JPS62213954A (en) | Method and device for grinding peripheral surface of hard and brittle material | |
JPS61230853A (en) | Continuous down feeding of semi-conductor wafer on automatic plane grinding machine |