JPS57132965A - One pass type multi-head plane grinding, polishing, washing automatic machine - Google Patents

One pass type multi-head plane grinding, polishing, washing automatic machine

Info

Publication number
JPS57132965A
JPS57132965A JP56013845A JP1384581A JPS57132965A JP S57132965 A JPS57132965 A JP S57132965A JP 56013845 A JP56013845 A JP 56013845A JP 1384581 A JP1384581 A JP 1384581A JP S57132965 A JPS57132965 A JP S57132965A
Authority
JP
Japan
Prior art keywords
polishing
unit
grinding
plane grinding
works
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56013845A
Other languages
Japanese (ja)
Other versions
JPS6243832B2 (en
Inventor
Koichi Hatano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibayama Kikai Co Ltd
Original Assignee
Shibayama Kikai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibayama Kikai Co Ltd filed Critical Shibayama Kikai Co Ltd
Priority to JP56013845A priority Critical patent/JPS57132965A/en
Publication of JPS57132965A publication Critical patent/JPS57132965A/en
Publication of JPS6243832B2 publication Critical patent/JPS6243832B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To conduct grinding, polishing, and washing of semiconductor wafers simultaneously at a high speed by transferring works in one pass through a multi-head grinding machine provided with plane grinding and polishing units, etc. CONSTITUTION:A vacuum chuck is provided on a rotary table 7 to hold works 4, 6, 8, 11, 15, 18, 19, 21. Works 4, fed from an automatic conveying unit 2 by an autoloading unit, are grinded 6 by a plane grinding unit, processed 8, 11 by the second and the third grinding shafts, jet washed 13, polished 15 by a polishing unit 14 at a high speed, washed 18 by a jet washing unit 16, dried 19 by air blows from a compressor 20, and stored in an automatic storing cassette 24. The vacuum chuck is cleaned by 23.
JP56013845A 1981-02-03 1981-02-03 One pass type multi-head plane grinding, polishing, washing automatic machine Granted JPS57132965A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56013845A JPS57132965A (en) 1981-02-03 1981-02-03 One pass type multi-head plane grinding, polishing, washing automatic machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56013845A JPS57132965A (en) 1981-02-03 1981-02-03 One pass type multi-head plane grinding, polishing, washing automatic machine

Publications (2)

Publication Number Publication Date
JPS57132965A true JPS57132965A (en) 1982-08-17
JPS6243832B2 JPS6243832B2 (en) 1987-09-17

Family

ID=11844605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56013845A Granted JPS57132965A (en) 1981-02-03 1981-02-03 One pass type multi-head plane grinding, polishing, washing automatic machine

Country Status (1)

Country Link
JP (1) JPS57132965A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58223561A (en) * 1982-06-16 1983-12-26 Disco Abrasive Sys Ltd Polishing machine
JPS591156A (en) * 1982-06-28 1984-01-06 Tohoku Metal Ind Ltd Automatic lapping machine
JPS5919671A (en) * 1982-07-22 1984-02-01 Disco Abrasive Sys Ltd Polishing device
JPS60119726A (en) * 1983-11-30 1985-06-27 M Setetsuku Kk Wafer processing device
JPS61257749A (en) * 1985-05-08 1986-11-15 Shibayama Kikai Kk Oscillating spindle shaft in automatic surface grinder for semiconductor wafer
JPS6411754A (en) * 1987-07-06 1989-01-17 Mitsubishi Metal Corp Manufacture for mirror surfaced wafer
US6283822B1 (en) 1995-08-21 2001-09-04 Ebara Corporation Polishing apparatus
KR100905094B1 (en) 2007-08-01 2009-06-30 주식회사 에스에프에이 Apparatus for grinding wafer
KR100918069B1 (en) 2007-08-01 2009-09-22 주식회사 에스에프에이 Apparatus for grinding wafer
KR20170084704A (en) * 2016-01-12 2017-07-20 나카무라 토메 세이미쓰고교 가부시키가이샤 Grinding·polishing combined apparatus, and polishing apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5542738A (en) * 1978-09-20 1980-03-26 Toshiba Corp Abrasive grain processing device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5542738A (en) * 1978-09-20 1980-03-26 Toshiba Corp Abrasive grain processing device

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58223561A (en) * 1982-06-16 1983-12-26 Disco Abrasive Sys Ltd Polishing machine
JPS591156A (en) * 1982-06-28 1984-01-06 Tohoku Metal Ind Ltd Automatic lapping machine
JPS5919671A (en) * 1982-07-22 1984-02-01 Disco Abrasive Sys Ltd Polishing device
JPS60119726A (en) * 1983-11-30 1985-06-27 M Setetsuku Kk Wafer processing device
JPS61257749A (en) * 1985-05-08 1986-11-15 Shibayama Kikai Kk Oscillating spindle shaft in automatic surface grinder for semiconductor wafer
JPS6411754A (en) * 1987-07-06 1989-01-17 Mitsubishi Metal Corp Manufacture for mirror surfaced wafer
JPH0661681B2 (en) * 1987-07-06 1994-08-17 三菱マテリアル株式会社 Mirror surface wafer manufacturing method
US6283822B1 (en) 1995-08-21 2001-09-04 Ebara Corporation Polishing apparatus
US6942541B2 (en) 1995-08-21 2005-09-13 Ebara Corporation Polishing apparatus
KR100905094B1 (en) 2007-08-01 2009-06-30 주식회사 에스에프에이 Apparatus for grinding wafer
KR100918069B1 (en) 2007-08-01 2009-09-22 주식회사 에스에프에이 Apparatus for grinding wafer
KR20170084704A (en) * 2016-01-12 2017-07-20 나카무라 토메 세이미쓰고교 가부시키가이샤 Grinding·polishing combined apparatus, and polishing apparatus

Also Published As

Publication number Publication date
JPS6243832B2 (en) 1987-09-17

Similar Documents

Publication Publication Date Title
JPS57132965A (en) One pass type multi-head plane grinding, polishing, washing automatic machine
KR20030062222A (en) Wafer edge grinding system
JPS63207559A (en) Automatic wafer grinding device
JPH1131674A (en) Wafer-cleaning apparatus
JP4089837B2 (en) Spinner device
JP2000331968A (en) Wafer protection tape
CN217019917U (en) High impact strength bearing steel ball forming processing equipment
JPS62124866A (en) Polishing device
JPS63137448A (en) Semiconductor wafer treatment apparatus
JP2001009713A (en) Polishing device
JPS5542748A (en) Workpiece carrying in, carrying out, and turning over device of vertical shaft circular table type surface grinder
JPS5627932A (en) Manufacture of integrated circuit
JPS57211746A (en) Wafer conveying apparatus
CN112123167A (en) Full-automatic production line of single-side polishing machine
JP7292164B2 (en) processing equipment
JPH09174429A (en) Wafer polishing device
CN214186662U (en) Full-automatic production line of single-side polishing machine
CN113523933B (en) Integrated device for polishing and polishing wafer
JPH11204462A (en) Dicing apparatus
JPH0677188A (en) Chamfering apparatus of semiconductor wafer
JP2003303797A (en) Polishing equipment
JPS57156158A (en) Surface grinder
JPH08213352A (en) Wafer cleaning equipment
JPS57132966A (en) Polishing unit of one pass type multi-head plane grinding, polishing automatic machine
JPH0523291Y2 (en)