JPS6123351A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS6123351A
JPS6123351A JP14357284A JP14357284A JPS6123351A JP S6123351 A JPS6123351 A JP S6123351A JP 14357284 A JP14357284 A JP 14357284A JP 14357284 A JP14357284 A JP 14357284A JP S6123351 A JPS6123351 A JP S6123351A
Authority
JP
Japan
Prior art keywords
lead frame
island
deformation
shape
island portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14357284A
Other languages
Japanese (ja)
Inventor
Naoharu Senba
仙波　直治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP14357284A priority Critical patent/JPS6123351A/en
Publication of JPS6123351A publication Critical patent/JPS6123351A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent deformation of island portion and obtain a stabilized product by providing four or more supports pins for the island portion of lead frame. CONSTITUTION:Four or more support pins are provided for island portion. For example, six support pins 6-11 are provided to the island region 5 of lead frame. In such a shape, no deformation is generated at the island region 5 and does not give any influence on assembly, yield and quality. Moreover, such deformation is not generated when when a size of island region 5 increases.

Description

【発明の詳細な説明】 （技術分野） 本発明はリードフレームの形状に関し、と〈Ｋ半導体Ｉ
Ｃ基板を搭載するリードフレームに関するものである。Detailed Description of the Invention (Technical Field) The present invention relates to the shape of a lead frame, and
The present invention relates to a lead frame on which a C substrate is mounted.

（従来技術） 従来のこの種のリードフレームは、第１図に示すように
アイランド部の支持ピン数が〜２及び〜３の如く、２ピ
ンのみである。このような形状では、リードフレーム製
作工程、メッキ工程及び取扱い等において、第２図（従
来ペースリボンの断面図Ａ−Ａ勺のアイランド部〜１′
のように変形が発生する。この状態はアイランド部に受
動及び能動素子を搭載し、金属細線で接続する製品に於
いては組立１歩留及び品質に大きな障害となる◎更にア
イランドのサイズが大きくなればなるほど障害は大きく
なる。(Prior Art) As shown in FIG. 1, this type of conventional lead frame has only two support pins in the island portion, such as ~2 and ~3. With such a shape, in the lead frame manufacturing process, plating process, handling, etc.
Deformation occurs as in This condition poses a major obstacle to assembly yield and quality in products in which passive and active elements are mounted on the island and connected using thin metal wires. Furthermore, the larger the island size, the greater the obstacle.

（発明の目的） 本発明は従来リードフレーム形状によるアイランド部の
変形発生を防止し、且つ、アイランドサイズが大きくな
っても同様に変形しないような形状を有するリードフレ
ームの提供を目的としたものである。(Object of the Invention) The present invention aims to provide a lead frame having a shape that prevents deformation of the island portion due to the conventional shape of the lead frame and does not similarly deform even if the island size increases. be.

（発明の構成及び実施例） 本発明はリードフレームのアイランド部の支持ピン数を
４ピン以上保有することを特徴とするリードフレームの
形状に関するものである〇本発明を図面に基づき詳細に
説明すると第３図は本発明の一実施例を示す平面図であ
）第４図は断面図である。リードフレームのアイランド
部〜５にこれを支持する支持ピン〜６・・・１１の６ピ
ンを保有している。このような形状では第４図に示す通
シ、アイランド部〜５に変形は発生せず、従来形状の問
題点である。組立１歩留及び品質に悪影響を与えること
はない０更に、アイランド部〜５のサイズが大きくなっ
ても変形の発生はない。(Structure and Examples of the Invention) The present invention relates to a shape of a lead frame characterized by having four or more support pins in the island portion of the lead frame.The present invention will be explained in detail based on the drawings. 3 is a plan view showing an embodiment of the present invention) FIG. 4 is a sectional view. The island portion ~5 of the lead frame has six support pins ~6...11 that support it. In such a shape, deformation does not occur in the through holes and island portions to 5 shown in FIG. 4, which is a problem with the conventional shape. Assembly 1: Yield and quality are not adversely affected.Furthermore, even if the size of the island portions to 5 is increased, no deformation occurs.

（発明の効果） 本発明によればリードフレームのアイランド部の支持ピ
ンを４ピン以上にすることによりアイランド部の変形を
防止出来る。これに伴い、従来のリードフレームの形状
にあったアイランドの変形による組立９歩留及び品質に
悪影曽を与えず、安定した製品の提供を可能にするもの
である０(Effects of the Invention) According to the present invention, deformation of the island portion of the lead frame can be prevented by using four or more support pins for the island portion. Along with this, it is possible to provide stable products without negatively impacting assembly yield and quality due to deformation of the island that conforms to the shape of the conventional lead frame.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のリードフレーム形状を示す平面図であり
、第２図はその断面図である。第３図は本発明による一
実施例を示す平面図であシ、第４図はその断面図である
。 １・・・・・・アイランド部、１′・・・・・・変形し
たアイランド部、２．３・・・・・・支持ピン、４・・
・・・・引出し線、５・・・・・・アイランド部、６〜
１１・・・・・・支持ピン、１２・・・・・・引出し線
。 ＬＴ） 因　　　　　　　口 楡　　　　　　　戚 （′ｙ′）　　　　　　　　　　　陽 酸　　　　　　　痴FIG. 1 is a plan view showing the shape of a conventional lead frame, and FIG. 2 is a sectional view thereof. FIG. 3 is a plan view showing one embodiment of the present invention, and FIG. 4 is a sectional view thereof. 1...Island part, 1'...Deformed island part, 2.3...Support pin, 4...
...Leader line, 5...Island part, 6~
11...Support pin, 12...Leader line. LT) 因 口楡 類（'y′） yang acid し

Claims (1)

【特許請求の範囲】[Claims] アイランド部の支持ピン数を４ピン以上保有することを
特徴とするリードフレーム。A lead frame characterized by having four or more support pins in the island portion.
JP14357284A 1984-07-11 1984-07-11 Lead frame Pending JPS6123351A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14357284A JPS6123351A (en) 1984-07-11 1984-07-11 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14357284A JPS6123351A (en) 1984-07-11 1984-07-11 Lead frame

Publications (1)

Publication Number Publication Date
JPS6123351A true JPS6123351A (en) 1986-01-31

Family

ID=15341863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14357284A Pending JPS6123351A (en) 1984-07-11 1984-07-11 Lead frame

Country Status (1)

Country Link
JP (1) JPS6123351A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62105455A (en) * 1985-11-01 1987-05-15 Hitachi Ltd Lead frame for semiconductor device
JPH04750A (en) * 1990-04-18 1992-01-06 Toshiba Corp Lead frame for semiconductor device
US5150194A (en) * 1991-04-24 1992-09-22 Micron Technology, Inc. Anti-bow zip lead frame design
EP0550013A2 (en) * 1991-12-27 1993-07-07 Fujitsu Limited Semiconductor device and method of producing the same
US5283466A (en) * 1990-09-27 1994-02-01 Kabushiki Kaisha Toshiba Lead frame for semiconductor device of the resin encapsulation type
WO1996002943A1 (en) * 1994-07-19 1996-02-01 Analog Devices, Inc. Thermally enhanced leadframe
US8447480B2 (en) 2008-01-31 2013-05-21 Honda Motor Co., Ltd. Transmission control method for continuously variable transmission

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
JPS5632460B2 (en) * 1978-12-06 1981-07-28

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
JPS5632460B2 (en) * 1978-12-06 1981-07-28

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62105455A (en) * 1985-11-01 1987-05-15 Hitachi Ltd Lead frame for semiconductor device
JPH04750A (en) * 1990-04-18 1992-01-06 Toshiba Corp Lead frame for semiconductor device
US5162895A (en) * 1990-04-18 1992-11-10 Kabushiki Kaisha Toshiba Lead frame for semiconductor device that prevents island torsion
US5283466A (en) * 1990-09-27 1994-02-01 Kabushiki Kaisha Toshiba Lead frame for semiconductor device of the resin encapsulation type
US5150194A (en) * 1991-04-24 1992-09-22 Micron Technology, Inc. Anti-bow zip lead frame design
EP0550013A2 (en) * 1991-12-27 1993-07-07 Fujitsu Limited Semiconductor device and method of producing the same
EP0550013B1 (en) * 1991-12-27 2000-07-26 Fujitsu Limited Semiconductor device and method of producing the same
WO1996002943A1 (en) * 1994-07-19 1996-02-01 Analog Devices, Inc. Thermally enhanced leadframe
US8447480B2 (en) 2008-01-31 2013-05-21 Honda Motor Co., Ltd. Transmission control method for continuously variable transmission

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