JP2584612B2 - Etching frame plating method - Google Patents
Etching frame plating methodInfo
- Publication number
- JP2584612B2 JP2584612B2 JP60208256A JP20825685A JP2584612B2 JP 2584612 B2 JP2584612 B2 JP 2584612B2 JP 60208256 A JP60208256 A JP 60208256A JP 20825685 A JP20825685 A JP 20825685A JP 2584612 B2 JP2584612 B2 JP 2584612B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- plating
- jig
- frame
- sheet material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005530 etching Methods 0.000 title claims description 24
- 238000007747 plating Methods 0.000 title claims description 24
- 238000000034 method Methods 0.000 title claims description 12
- 239000000463 material Substances 0.000 claims description 14
- 238000007796 conventional method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、エッチング加工によって形成されたIC部品
等のフレームの所望箇所に銀、金、ニッケル等のメッキ
を施す方法に関する。Description: TECHNICAL FIELD The present invention relates to a method of plating a desired portion of a frame of an IC component or the like formed by etching with silver, gold, nickel, or the like.
（従来の技術） 従来、上記メッキ処理工程においては、第３図に示す
ように、適当個数（６〜16個）の部品を得るエッチング
フレーム２の単体を、治具５に位置決め孔11およびピン
12を介して位置決め装填し、多数のエッチングフレーム
２を装填した治具５の下方からメッキ液を吹付け供給し
て、治具５に形成した孔８を通して各エッチングフレー
ム２の所定箇所、例えばチップ搭載用アイランドなどに
銀メッキを施している。(Prior Art) Conventionally, in the above plating process, as shown in FIG. 3, a single piece of an etching frame 2 for obtaining an appropriate number (6 to 16) of parts is placed in a jig 5 by positioning holes 11 and pins.
A plating solution is sprayed and supplied from below the jig 5 loaded with a large number of etching frames 2 through the holes 8 formed in the jig 5, for example, a chip, for example, a chip. Silver plating is applied to the mounting island.
（発明が解決しようとする問題点） しかし、上記従来方法では、エッチングフレーム２ご
とに手作業で治具５に装填していたために、作業性が悪
く、生産性の低いものとなっていた。例えば、フレーム
をパンチング加工によって得る場合は、帯状のフレーム
素材を巻き取りながらパンチング加工を行い、メッキも
その帯状のフレームをさらに巻き取りながら連続的に行
うことができるのでそのような問題はない。エッチング
フレームの場合にはシート材料より得られ複数本に分割
されてしまうので、上記の問題が発生するものである。(Problems to be Solved by the Invention) However, in the above-mentioned conventional method, the workability is poor and the productivity is low because the jig 5 is manually loaded for each etching frame 2. For example, when a frame is obtained by punching, there is no such a problem because punching can be performed while winding a strip-shaped frame material, and plating can be continuously performed while further winding the strip-shaped frame. In the case of an etching frame, the above problem occurs because it is obtained from a sheet material and divided into a plurality of pieces.
又、従来の方法では、フレーム装填処理中にインナー
リードを変形させてしまい、ワイヤボンディング不良の
一因となることもあった。又、エッチングフレームが積
層して供給される場合には、２枚重ねの装填が行われる
おそれもあった。Further, in the conventional method, the inner lead may be deformed during the frame loading process, which may cause a wire bonding failure. Further, when the etching frames are supplied in a stacked state, there is a possibility that two sheets are loaded.
（問題点を解決するための手段） 本発明は、上記従来欠点を解消するために、並列状態
に配置される複数個のエッチングフレームを一連に連結
したシート材をメッキ用治具に位置決めピンを介して位
置決め装填して、前記位置決めピンを電極として前記エ
ッチングフレームの所望箇所に前記治具に形成された孔
を介してメッキを施すようにした。(Means for Solving the Problems) In order to solve the above-mentioned conventional drawbacks, the present invention uses a sheet material in which a plurality of etching frames arranged in parallel are connected in series to form a positioning jig for a plating jig. The positioning pin is used as an electrode to perform plating on a desired portion of the etching frame through a hole formed in the jig.
（作用） 上記方法によると、エッチング処理によって形成され
た１枚のシート材には一般に約10〜20個のエッチングフ
レームが備えられており、部品数では60〜320個分を一
単位としてメッキ処理を行うことになる。(Action) According to the above method, one sheet material formed by the etching process is generally provided with about 10 to 20 etching frames, and the plating process is performed with a unit of 60 to 320 parts. Will be done.
また、シート材がメッキ用治具に設けられた位置決め
ピンにより位置決めされた安定状態で、治具に設けられ
た孔を介してエッチングフレームの所定の位置に精度良
くメッキが行われるとともに、位置決めピンは電極に兼
用されることで治具の構成が簡単とでき、作業も容易に
行える。Further, in a stable state in which the sheet material is positioned by the positioning pins provided on the plating jig, plating is accurately performed on a predetermined position of the etching frame through the holes provided on the jig, and the positioning pins are provided. Since the electrode is also used as the electrode, the configuration of the jig can be simplified and the work can be easily performed.
（実施例） 第１図に本発明方法におけるフレーム装填状態が示さ
れている。(Embodiment) FIG. 1 shows a frame loaded state in the method of the present invention.
エッチング加工によって形成された１枚のシート材１
には、多数個（10〜20個）のエッチングフレーム２が隣
接する２つのブロックにおいてそれぞれ並列状態に配置
され、それぞれのエッチングフレーム２はブリッジ部３
それぞれを介して一連に連結されている。One sheet material 1 formed by etching
Has a large number (10 to 20) of etching frames 2 arranged in parallel in two adjacent blocks, and each of the etching frames 2 is connected to a bridge portion 3.
They are connected in series through each.
シート材１の周辺部の適所には一対の位置決め孔4,4
が形成されており、この孔４、４をスポットメッキ用マ
スクとしての治具５の位置決めピン６、６に合致させて
治具上に密着装填する。A pair of positioning holes 4 and 4 are provided at appropriate places around the sheet material 1.
The holes 4, 4 are aligned with the positioning pins 6, 6 of the jig 5 as a spot plating mask, and are closely mounted on the jig.
治具５は金属芯材７で補強されたゴムプレートとして
構成されたものであって、各エッチングフレーム２のメ
ッキ箇所、例えばチップ搭載用アイランドに対応する孔
８が形成されている。The jig 5 is configured as a rubber plate reinforced with a metal core 7, and has a hole 8 corresponding to a plating portion of each etching frame 2, for example, a chip mounting island.
このようにシート材１を位置決め装填した治具５は、
第２図に示すように、メッキ液供給管９の上に配備さ
れ、ノズル群10から吹出すメッキ液が治具５の各孔８を
通してエッチングフレーム２の所望メッキ箇所に供給さ
れる。この場合、前記位置決めピン6,6は陰極電極とし
て働く。The jig 5 in which the sheet material 1 is positioned and loaded as described above,
As shown in FIG. 2, a plating solution provided on a plating solution supply pipe 9 and blown out from a nozzle group 10 is supplied to a desired plating portion of the etching frame 2 through each hole 8 of the jig 5. In this case, the positioning pins 6, 6 serve as cathode electrodes.
（発明の効果） 以上説明したように、本発明方法によれば、シート材
料により複数本に分割されて得られるエッチングフレー
ムそれぞれにメッキを行うことなく、それらを一体とし
た状態で一度にメッキが行えるので、エッチングフレー
ムのメッキにおける作業性が飛躍的に向上した。又、部
品数に対するハンドリング回数が大きく減少するため
に、フレームを変形させる可能性も減少し品質の保全に
有効である。又、大きいシート材を取扱うために、２枚
重ね装填のおそれがほとんどなくなった。(Effects of the Invention) As described above, according to the method of the present invention, plating is not performed on each of the etching frames obtained by being divided into a plurality of sheets by the sheet material. As a result, workability in plating the etching frame has been dramatically improved. Further, since the number of times of handling with respect to the number of parts is greatly reduced, the possibility of deforming the frame is also reduced, which is effective for quality maintenance. Further, since a large sheet material is handled, there is almost no risk of stacking two sheets.
さらに本発明方法によれば、シート材がメッキ用治具
に設けられた位置決めピンにより位置決めされた安定状
態で、治具に設けられた孔を介してエッチングフレーム
の所定の位置に精度良くメッキが行われ、しかも、その
位置決めピンは電極に兼用されるので治具の構成が簡単
であるとともに、作業も容易に行える。Further, according to the method of the present invention, in a stable state in which the sheet material is positioned by the positioning pins provided on the plating jig, plating is accurately performed on a predetermined position of the etching frame through the holes provided on the jig. Since the positioning pins are used also for the electrodes, the configuration of the jig is simple and the work can be easily performed.
第１図は、本発明方法におけるシート材装填状態を示す
斜視図、第２図はメッキ処理時の要部断面図、第３図は
従来方法でのフレーム装填状態を示す斜視図である。 １……シート材 ２……エッチングフレーム ５……治具FIG. 1 is a perspective view showing a sheet material loaded state in the method of the present invention, FIG. 2 is a cross-sectional view of a main part at the time of plating, and FIG. 3 is a perspective view showing a frame loaded state in a conventional method. 1 ... sheet material 2 ... etching frame 5 ... jig
フロントページの続き (56)参考文献 特開 昭49−91044（ＪＰ，Ａ) 特開 昭53−106572（ＪＰ，Ａ) 特開 昭57−187945（ＪＰ，Ａ) 実願 昭55−73590号（実開 昭56− 173667号）の願書に添付した明細書及び 図面の内容を撮影したマイクロフィルム （ＪＰ，Ｕ)Continuation of front page (56) References JP-A-49-91044 (JP, A) JP-A-53-106572 (JP, A) JP-A-57-187945 (JP, A) Japanese Utility Model Application No. 55-73590 ( Microfilm (JP, U) photographing the contents of the specification and drawings attached to the application form
Claims (1)
フレームを一連に連結したシート材をメッキ用治具に位
置決めピンを介して位置決め装填して、前記位置決めピ
ンを電極として前記エッチングフレームの所望箇所に前
記治具に形成された孔を介してメッキを施すことを特徴
とするエッチングフレームのメッキ方法。1. A sheet material, in which a plurality of etching frames arranged in parallel are connected in series, is positioned and mounted on a plating jig via positioning pins, and a desired position of the etching frame is determined using the positioning pins as electrodes. A plating method for an etching frame, wherein plating is performed on a portion through a hole formed in the jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60208256A JP2584612B2 (en) | 1985-09-19 | 1985-09-19 | Etching frame plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60208256A JP2584612B2 (en) | 1985-09-19 | 1985-09-19 | Etching frame plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6267193A JPS6267193A (en) | 1987-03-26 |
| JP2584612B2 true JP2584612B2 (en) | 1997-02-26 |
Family
ID=16553229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60208256A Expired - Lifetime JP2584612B2 (en) | 1985-09-19 | 1985-09-19 | Etching frame plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2584612B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020081939A (en) * | 2001-04-20 | 2002-10-30 | 현대자동차주식회사 | Etching method of tube for test a forming |
| CN108385152B (en) * | 2018-04-04 | 2020-08-21 | 北京理工大学珠海学院 | Automatic change hanger machine for system lock |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4313705Y1 (en) * | 1967-08-31 | 1968-06-11 | ||
| JPS56127792A (en) * | 1980-03-10 | 1981-10-06 | Furukawa Kinzoku Kogyo Kk | Production of partly coated composite bar |
| JPH0671058B2 (en) * | 1985-06-05 | 1994-09-07 | 日立電線株式会社 | Manufacturing method of lead frame having minute spot-like plated portion |
-
1985
- 1985-09-19 JP JP60208256A patent/JP2584612B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6267193A (en) | 1987-03-26 |
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