JPS6130252U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS6130252U JPS6130252U JP1984113184U JP11318484U JPS6130252U JP S6130252 U JPS6130252 U JP S6130252U JP 1984113184 U JP1984113184 U JP 1984113184U JP 11318484 U JP11318484 U JP 11318484U JP S6130252 U JPS6130252 U JP S6130252U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- heat sink
- solder
- semiconductor device
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
- H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/26175—Flow barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
【図面の簡単な説明】
第1図Aイ,口は本考案の半導体装置の一実施例を説明
する断面図および上面図、第1図Bは本考案の他の実施
例を説明する上面図、第2図および第3図は従来の半導
体装置を説明する断面図である。 11は固着基板、12はヒートシンク、13はパワー半
導体素子、14は半田層、15は凹部である。
する断面図および上面図、第1図Bは本考案の他の実施
例を説明する上面図、第2図および第3図は従来の半導
体装置を説明する断面図である。 11は固着基板、12はヒートシンク、13はパワー半
導体素子、14は半田層、15は凹部である。
Claims (1)
- 固着基板上に熱伝導性良好なヒートシンクを介して共ワ
ー半導体素子を半田で固着する半導体装置に於いて、前
記ヒートシンクのパワー半導体素子の四角に対応する部
分に対角線上に延在された細長い凹部を設け半田の厚み
を他より厚く形成することを特徴とする半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984113184U JPS6130252U (ja) | 1984-07-25 | 1984-07-25 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984113184U JPS6130252U (ja) | 1984-07-25 | 1984-07-25 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6130252U true JPS6130252U (ja) | 1986-02-24 |
Family
ID=30672218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984113184U Pending JPS6130252U (ja) | 1984-07-25 | 1984-07-25 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6130252U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007150040A (ja) * | 2005-11-29 | 2007-06-14 | Mitsubishi Electric Corp | 半導体装置 |
-
1984
- 1984-07-25 JP JP1984113184U patent/JPS6130252U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007150040A (ja) * | 2005-11-29 | 2007-06-14 | Mitsubishi Electric Corp | 半導体装置 |
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