JPS61144655U - - Google Patents
Info
- Publication number
- JPS61144655U JPS61144655U JP1985028544U JP2854485U JPS61144655U JP S61144655 U JPS61144655 U JP S61144655U JP 1985028544 U JP1985028544 U JP 1985028544U JP 2854485 U JP2854485 U JP 2854485U JP S61144655 U JPS61144655 U JP S61144655U
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- lead
- power supply
- semiconductor circuit
- conductive thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案による半導体回路装置の一実施
例を示す平面図、第２図は従来の半導体回路装置
の構成例を示す平面図である。
２ｇ，２ｘは接地端子、２ｓ，２ｚは電源端子
、６はリード部材、１１は半導体回路素子、１３
は載置部材、１４，１５は支持部材（サポートバ
ー）、１５Ｚは電源用リード、１６は接地用リー
ドである。
FIG. 1 is a plan view showing an embodiment of a semiconductor circuit device according to the present invention, and FIG. 2 is a plan view showing an example of the configuration of a conventional semiconductor circuit device. 2g and 2x are ground terminals, 2s and 2z are power terminals, 6 is a lead member, 11 is a semiconductor circuit element, 13
14 and 15 are supporting members (support bars), 15Z is a power supply lead, and 16 is a grounding lead.
Claims (1)
薄板材で形成され上記半導体回路素子が載置され
る載置部材と、該載置部材から延在された１対の
支持部材と、上記載置部材の周囲に配設され上記
複数の端子とそれぞれ導電性細線によつて接続さ
れる複数のリード部材とが容器内に収容されて成
る半導体回路装置において、 上記半導体回路素子上に複数の電源端子及び複
数の接地端子を設け、 上記１対の支持部材の一方を幅広に形成すると
共に、該一方の支持部材の端部に分岐を設けて電
源用リードとなし、 上記複数のリード部材のうち相隣れる２本のリ
ード部材を上記容器内で連接させて接地用リード
となし、 上記複数の電源端子及び上記電源用リード並び
に上記複数の接地端子及び上記接地用リードをそ
れぞれ上記導電性細線によつて接続して成る半導
体回路装置。[Claims for Utility Model Registration] A semiconductor circuit element having a plurality of terminals, a mounting member formed of a conductive thin plate material on which the semiconductor circuit element is mounted, and a pair of terminals extending from the mounting member. and a plurality of lead members disposed around the mounting member and connected to the plurality of terminals by conductive thin wires, respectively, are housed in a container, the semiconductor circuit device comprising: A plurality of power supply terminals and a plurality of ground terminals are provided on the circuit element, one of the pair of support members is formed wide, and a branch is provided at the end of the one support member to serve as a power supply lead, Two adjacent lead members of the plurality of lead members are connected in the container to form a grounding lead, and the plurality of power supply terminals and the power supply lead, the plurality of grounding terminals and the grounding lead. A semiconductor circuit device comprising: connected to each other by the above-mentioned conductive thin wires.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985028544U JPS61144655U (en) | 1985-02-28 | 1985-02-28 | |
| EP86901518A EP0214307B1 (en) | 1985-02-28 | 1986-02-28 | Semiconducteur circuit device |
| DE8686901518T DE3680265D1 (en) | 1985-02-28 | 1986-02-28 | SEMICONDUCTOR CIRCUIT ARRANGEMENT. |
| KR1019860700725A KR940006585B1 (en) | 1985-02-28 | 1986-02-28 | Semicondocteur circuit device |
| PCT/JP1986/000106 WO1986005322A1 (en) | 1985-02-28 | 1986-02-28 | Semiconducteur circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985028544U JPS61144655U (en) | 1985-02-28 | 1985-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61144655U true JPS61144655U (en) | 1986-09-06 |
Family
ID=30526520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985028544U Pending JPS61144655U (en) | 1985-02-28 | 1985-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61144655U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5571030A (en) * | 1978-11-24 | 1980-05-28 | Hitachi Ltd | Mounting system for semiconductor device |
| JPS5814544A (en) * | 1981-07-17 | 1983-01-27 | Nec Corp | Vessel for monolithic ic |
| JPS6034049A (en) * | 1983-08-05 | 1985-02-21 | Nec Corp | Built-in capacitor type semiconductor device and manufacture thereof |
-
1985
- 1985-02-28 JP JP1985028544U patent/JPS61144655U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5571030A (en) * | 1978-11-24 | 1980-05-28 | Hitachi Ltd | Mounting system for semiconductor device |
| JPS5814544A (en) * | 1981-07-17 | 1983-01-27 | Nec Corp | Vessel for monolithic ic |
| JPS6034049A (en) * | 1983-08-05 | 1985-02-21 | Nec Corp | Built-in capacitor type semiconductor device and manufacture thereof |
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