JPS5940777Y2 - semiconductor element - Google Patents

Description

【考案の詳細な説明】 本考案は特に並列接続の容易な半導体素子に関する。[Detailed explanation of the idea] The present invention particularly relates to semiconductor devices that can be easily connected in parallel.

大電流容量の電力用半導体装置においては半導体素子は
しばしば並列接続して用いられる。In power semiconductor devices with large current capacity, semiconductor elements are often connected in parallel.

この種の半導体装置においては第１図のように素子容器
１から引出された可撓性導体２の先端の端子３相互間を
別の接続導体４で連結すめ方法が取られている。In this type of semiconductor device, as shown in FIG. 1, a method is adopted in which the terminals 3 at the tips of the flexible conductors 2 drawn out from the element container 1 are connected by another connecting conductor 4.

この場合導体２は可撓性であるから端子３を接続導体４
の位置に合わせて接続が行われる。In this case, since the conductor 2 is flexible, the terminal 3 is connected to the connecting conductor 4.
The connection is made according to the position of the

このような接続導体４は大電流を流すため重量が重く、
この支持のために絶縁碍子等を用いなければならない。Such a connecting conductor 4 is heavy because it carries a large current,
Insulators, etc. must be used for this support.

本考案はこのような別の接続導体を必要とせず、相互に
簡単に接続できる端子を有する半導体素子を提供するこ
とを目的とする。An object of the present invention is to provide a semiconductor device having terminals that can be easily connected to each other without requiring such a separate connection conductor.

本考案による素子は一つの電極から引出された導体が二
つの平形端子を有し、その二つの平形端子は素子容器の
底面から同じ高さにおいて素子容器に対して固定され、
前記両端子の間隔は両端子に結ぶ方向の素子容器の最大
幅より狭くない寸法にされる。In the device according to the present invention, a conductor drawn out from one electrode has two flat terminals, and the two flat terminals are fixed to the device container at the same height from the bottom of the device container,
The distance between the two terminals is set to a size that is not narrower than the maximum width of the element container in the direction in which the two terminals are connected.

以下本考案の実施例につき図を用いて説明する。Embodiments of the present invention will be described below with reference to the drawings.

第２図では電力用トランジスタの工５ンタおよびベース
電極から平帯状の導体１２が基板５と逆の側に引出され
ている。In FIG. 2, a flat conductor 12 is drawn out from the terminal and base electrodes of the power transistor to the side opposite to the substrate 5.

基板５はコレクタ電極を兼ねその一面は取付、放熱のた
めの底面となる。The substrate 5 also serves as a collector electrode, and one surface thereof serves as a bottom surface for mounting and heat radiation.

導体１２はＬ字形をしておりその折れ目部および先端部
がそれぞれ接続用孔６，７を備えた平形端子として形成
されている。The conductor 12 has an L-shape, and its fold and tip are formed as flat terminals with connection holes 6 and 7, respectively.

両端子間の導体８は容器１の底面に対して平行にされる
。The conductor 8 between both terminals is parallel to the bottom surface of the container 1.

このような素子を並列接続しようとする時は素子を並置
して一方の素子の端子孔７に対し他方の素子の端子孔６
を合わせ、ボルトによって結合する。When trying to connect such elements in parallel, the elements are placed side by side and the terminal hole 7 of one element is connected to the terminal hole 6 of the other element.
Align and connect with bolts.

両端子孔の間隔りが導体８の方向の素子容器の最大幅り
と等しければ接続される各素子は密着して隣接し、Ｌよ
り広げれば素子の間に間隙を生じる。If the distance between both terminal holes is equal to the maximum width of the device container in the direction of the conductor 8, the devices to be connected will be closely adjacent to each other, and if the distance is wider than L, a gap will be created between the devices.

第３図は本考案による素子の別の実施例を示すもので、
引出導体が丁字形に形成され、水平部の両端を端子部と
して接続用孔６，７が設げられる。FIG. 3 shows another embodiment of the device according to the present invention.
The lead-out conductor is formed in a T-shape, and connection holes 6 and 7 are provided at both ends of the horizontal portion as terminal portions.

並列接続の場合の接続は第２図に示す実施例の場合と同
様に行われる。In the case of parallel connection, the connections are made in the same way as in the embodiment shown in FIG.

この実施例は第２図の実施例に比しては引出導体の製作
に多少費用を多く要するが、左右対称の形状であるため
取扱いが容易であることと、接続１に引出導体の基部に
かかる力がＬ字形にくらべて小さいことの利点がある。Although this embodiment requires a little more cost to manufacture the lead-out conductor than the embodiment shown in Fig. 2, it is easy to handle because it has a symmetrical shape, and the base of the lead-out conductor is attached to the connection 1. It has the advantage that the applied force is smaller than that of the L-shape.

第４図はさらに別の実施例であって、ダイオードの電極
からの引出導体１２がＹ字形に形成され、その画先端に
端子部６，７が設げられている。FIG. 4 shows yet another embodiment, in which a lead conductor 12 from a diode electrode is formed in a Y-shape, and terminal portions 6 and 7 are provided at the leading edge of the image.

この形状は第３図の実施例と同じく左箇対称であろち共
に、接続用孔の下部に余裕空間を生じ接続作業が楽にな
る利点がある。This shape is symmetrical to the left as in the embodiment shown in FIG. 3, and has the advantage of creating an extra space below the connection hole, making the connection work easier.

本考案による半導体素子は並列接続以外の接続において
も勿論使用できる。Of course, the semiconductor device according to the present invention can be used in connections other than parallel connections.

端子を一つだけ使う場合には第１図のＬ字形引出導体の
ものが使いやすい、サイリスタにこの考案を適用すれば
引出導体の一方の端子をカソード（又はアノード）の主
端子、他方を補助端子として用いることもできる。When using only one terminal, it is easy to use the L-shaped lead-out conductor shown in Figure 1. If this idea is applied to a thyristor, one terminal of the lead-out conductor can be used as the main terminal for the cathode (or anode), and the other as the auxiliary terminal. It can also be used as a terminal.

また分岐回路の場合にも両端子を使用することができる
。Also, both terminals can be used in the case of a branch circuit.

以上のように本考案によれば並列接続する場合に別の接
続導体を用意することなく、引出導体自体を利用して接
続可能な半導体素子を得ることができ、組立容易で経済
上の効果が大きい。As described above, according to the present invention, it is possible to obtain a semiconductor element that can be connected using the lead conductor itself without preparing a separate connection conductor when making parallel connections, and it is easy to assemble and has economical effects. big.

特に図示のような直方体の外形を有する樹脂封止形電力
用半導体素子に適用した場合には、並列接続１に緊密で
整然とした配列ができ、外観良好できわめて取扱の容易
な大電流用半導体装置を構成することが可能となる。In particular, when applied to a resin-encapsulated power semiconductor element having a rectangular parallelepiped external shape as shown in the figure, the high-current semiconductor device can be tightly and orderly arranged in parallel connection 1, has a good appearance, and is extremely easy to handle. It becomes possible to configure.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の半導体素子の接続状態を示す正面図であ
り、第２図〜第４図はそれぞれ本考案の異なる実施例で
ある半導体素子の接続状態を示す斜視図である。 １・・・・・・容器、６，７・・・・・・端子の接続用
孔、Ｄ・・・・・・端子の間隔、Ｌ・・・・・・容器の
Ｄと同方向の最大幅。FIG. 1 is a front view showing the connection state of a conventional semiconductor element, and FIGS. 2 to 4 are perspective views showing the connection state of semiconductor elements according to different embodiments of the present invention. 1... Container, 6, 7... Terminal connection hole, D... Terminal spacing, L... Maximum position in the same direction as D of the container. Significantly.

Claims (1)

【実用新案登録請求の範囲】 υ 一つの電極から引出された導体が二つの平形端子を
有し、該両端子は素子容器の底面から同じ高さにおいて
素子容器に対して固定され、前記両端子の間隔は両端子
を結ぶ方向の前記素子容器の最大幅より狭くないことを
特徴とする半導体素子。 ２）実用新案登録請求の範囲第１項記載の素子において
、引出導体がＬ字形平常として形成され、該り字の折れ
目部および先端部に端子が設けられることを特徴とする
半導体素子。 ３）実用新案登録請求の範囲第１項記載の素子において
、引出導体が７字形の平帯として形成され、該７字の両
先端部分に端子が設けられることを特徴とする半導体素
子。 ４）実用新案登録請求の範囲第１項記載の素子において
、引出導体が７字形の平帯として形成され、該７字の両
先端部分に端子が設けられることを特徴とする半導体素
子。[Claims for Utility Model Registration] υ A conductor drawn out from one electrode has two flat terminals, both terminals are fixed to the device container at the same height from the bottom of the device container, and both terminals are fixed to the device container at the same height from the bottom of the device container. A semiconductor device characterized in that an interval between the two terminals is not narrower than the maximum width of the device container in the direction connecting both terminals. 2) Utility Model Registration A semiconductor device according to claim 1, characterized in that the lead-out conductor is formed in an L-shape, and terminals are provided at the folds and tips of the L-shape. 3) Utility Model Registration A semiconductor device according to claim 1, characterized in that the lead-out conductor is formed as a flat band in the shape of a 7, and terminals are provided at both ends of the 7. 4) Utility Model Registration A semiconductor device according to claim 1, characterized in that the lead-out conductor is formed as a flat band in the shape of a 7, and terminals are provided at both ends of the 7.