JPS6079758U - 多色発光半導体装置 - Google Patents

多色発光半導体装置

Info

Publication number
JPS6079758U
JPS6079758U JP1983170060U JP17006083U JPS6079758U JP S6079758 U JPS6079758 U JP S6079758U JP 1983170060 U JP1983170060 U JP 1983170060U JP 17006083 U JP17006083 U JP 17006083U JP S6079758 U JPS6079758 U JP S6079758U
Authority
JP
Japan
Prior art keywords
light emitting
emitting semiconductor
semiconductor device
lead terminals
multicolor light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983170060U
Other languages
English (en)
Inventor
根来　立彦
進 武田
Original Assignee
スタンレー電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by スタンレー電気株式会社 filed Critical スタンレー電気株式会社
Priority to JP1983170060U priority Critical patent/JPS6079758U/ja
Publication of JPS6079758U publication Critical patent/JPS6079758U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の二色発光半導体装置の側面図、鯖２図は
第１図の装置の結線回路図、第３図乃至第７図はいずれ
もこの考案に係わるもので、第３図は２連のリードフレ
ームを重ねて発光チップをグイボンドおよびワイヤボン
ドし、レンズ部をモールドした状態を示す部分側面図、
第４図は同じく平面図、第５図は４色発光半導体装置の
側面図、第６図は同じく平面図、第７図は第５図の装置
の電気結線を示す回路図である。 １０．１１，１２．１３・・・・・・リード端子、１０
ａ、ｌｌａ、１２ａ＊　　１３ａ・・・・・・上端部、
１０ｂ、ｌｌｂ、１２ｂ、１３ｂ・・・・・・下側台部
、１０Ｃ？　　１１　Ｃ？　　１２Ｃ？　　１３Ｃ・・
・・・・上側台部、１０ｄ、　　１１　ｄｉ　　１２　
ｄ、　　１３　ｄ−−−−−−斜面、１０ｅ。 １１ｅ、１２ｅ、１３ｅ・・・・・・段差部、１４，１
５、　１６．　１７・・・・・・発光チップ、１４ａ、
１５ａｔ　　１６ａ、　　１７ａ・・・・・・表面電極
、１８，１９゜２０．２１・・・・・・金細線、２２・
・・・・・レンズ部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 互に発光色の異なる４個以上の発光半導体チツ、プを、
    これらと同数の各リード端子の上端部に設けた段差部の
    下側台部にそれぞれ１個づつグイボンドし、前記発光半
    導体チップの表面電極を、前記４個以上の発光半導体チ
    ップの電極間の接続が、ループをなすように、順次隣接
    するリード端子の前記段差部の上側台部に、ワイヤボン
    ドするとともに、前記発光半導体チップを、前記リード
    端子の上端部とともに、透明樹脂で一体モールドして、
    レンズ部を形成したことを特徴とする多色発光半導体装
    置。
JP1983170060U 1983-11-04 1983-11-04 多色発光半導体装置 Pending JPS6079758U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983170060U JPS6079758U (ja) 1983-11-04 1983-11-04 多色発光半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983170060U JPS6079758U (ja) 1983-11-04 1983-11-04 多色発光半導体装置

Publications (1)

Publication Number Publication Date
JPS6079758U true JPS6079758U (ja) 1985-06-03

Family

ID=30371349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983170060U Pending JPS6079758U (ja) 1983-11-04 1983-11-04 多色発光半導体装置

Country Status (1)

Country Link
JP (1) JPS6079758U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0267769A (ja) * 1988-09-02 1990-03-07 Dowa Mining Co Ltd Ｌｅｄ発光装置並びに該装置に用いる発光ブロックの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0267769A (ja) * 1988-09-02 1990-03-07 Dowa Mining Co Ltd Ｌｅｄ発光装置並びに該装置に用いる発光ブロックの製造方法

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