JPS5842940U - 混成集積回路装置 - Google Patents
混成集積回路装置Info
- Publication number
- JPS5842940U JPS5842940U JP1981138160U JP13816081U JPS5842940U JP S5842940 U JPS5842940 U JP S5842940U JP 1981138160 U JP1981138160 U JP 1981138160U JP 13816081 U JP13816081 U JP 13816081U JP S5842940 U JPS5842940 U JP S5842940U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- circuit device
- integrated circuit
- hybrid integrated
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/3205—Shape
- H01L2224/32057—Shape in side view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15182—Fan-in arrangement of the internal vias
- H01L2924/15183—Fan-in arrangement of the internal vias in a single layer of the multilayer substrate
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図aおよびbは従来の混成集積回路装置の平面図お
よびA−A線断面図、第2図は本考案による混成集積回
路装置の一実施例を示し、同図aは回路基板の平面図、
同図すは全体の平面図、同図CはB−B線断面図、第3
図は他の★雄側を示し、同図aは回路基板の平面図、同
図すは全体の平面図、同図Cはc−c線断面図である。 7・・・・・・回路基板、8・・・・・・半導体素子、
9・・・・・・ポンディングパッド、10・・・・・・
配線用導体、11・・・・・・絶縁性接着剤。
よびA−A線断面図、第2図は本考案による混成集積回
路装置の一実施例を示し、同図aは回路基板の平面図、
同図すは全体の平面図、同図CはB−B線断面図、第3
図は他の★雄側を示し、同図aは回路基板の平面図、同
図すは全体の平面図、同図Cはc−c線断面図である。 7・・・・・・回路基板、8・・・・・・半導体素子、
9・・・・・・ポンディングパッド、10・・・・・・
配線用導体、11・・・・・・絶縁性接着剤。
Claims (1)
- 半導体素子がグイボンドされる回路基板を備え、回路基
板のグイボンド部分の周囲に、複数のボン−ディングパ
ッドが形成され、回路基板のグイボンド部分を横切る配
線用導体が形成され、配線用導体を含むグイボンド部分
に絶縁性接着剤により半導体素子がグイボンドされたこ
とを特徴とする混−成葉積回路装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981138160U JPS5842940U (ja) | 1981-09-16 | 1981-09-16 | 混成集積回路装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981138160U JPS5842940U (ja) | 1981-09-16 | 1981-09-16 | 混成集積回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5842940U true JPS5842940U (ja) | 1983-03-23 |
JPH0246054Y2 JPH0246054Y2 (ja) | 1990-12-05 |
Family
ID=29931394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981138160U Granted JPS5842940U (ja) | 1981-09-16 | 1981-09-16 | 混成集積回路装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5842940U (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58207655A (ja) * | 1982-05-28 | 1983-12-03 | Hitachi Ltd | 半導体装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5444773A (en) * | 1977-09-16 | 1979-04-09 | Nippon Cetu Kk | Method of mounting electronic parts to printed board |
JPS5797634A (en) * | 1980-12-11 | 1982-06-17 | Canon Inc | Hybrid integrated circuit |
-
1981
- 1981-09-16 JP JP1981138160U patent/JPS5842940U/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5444773A (en) * | 1977-09-16 | 1979-04-09 | Nippon Cetu Kk | Method of mounting electronic parts to printed board |
JPS5797634A (en) * | 1980-12-11 | 1982-06-17 | Canon Inc | Hybrid integrated circuit |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58207655A (ja) * | 1982-05-28 | 1983-12-03 | Hitachi Ltd | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0246054Y2 (ja) | 1990-12-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5827935U (ja) | 混成集積回路装置 | |
JPS5842940U (ja) | 混成集積回路装置 | |
JPS6117751U (ja) | テ−プキヤリア半導体装置 | |
JPS60163751U (ja) | 半導体装置 | |
JPS6232550U (ja) | ||
JPS63187330U (ja) | ||
JPS6413144U (ja) | ||
JPS59121849U (ja) | 混成集積回路装置 | |
JPS58109254U (ja) | フエ−スダウン接続形チツプ用チツプキヤリヤ− | |
JPS58184840U (ja) | 半導体装置 | |
JPS58142941U (ja) | Icパツケ−ジ | |
JPS5958941U (ja) | 半導体装置 | |
JPS5978653U (ja) | 混成集積回路装置 | |
JPS6115753U (ja) | 半導体装置 | |
JPS6416636U (ja) | ||
JPS60194372U (ja) | 混成集積回路 | |
JPS609226U (ja) | 半導体の実装用パツケ−ジ | |
JPS59171350U (ja) | 半導体素子の実装構造 | |
JPS59180427U (ja) | ハイブリツド集積回路装置 | |
JPS6094836U (ja) | 半導体装置 | |
JPS5851442U (ja) | 混成集積回路装置 | |
JPS59112954U (ja) | 絶縁物封止半導体装置 | |
JPS59104535U (ja) | 半導体装置 | |
JPS6151737U (ja) | ||
JPS59131158U (ja) | チツプキヤリヤ− |