JPS6073264U - 発光ダイオ−ドランプ - Google Patents

発光ダイオ−ドランプ

Info

Publication number
JPS6073264U
JPS6073264U JP16403483U JP16403483U JPS6073264U JP S6073264 U JPS6073264 U JP S6073264U JP 16403483 U JP16403483 U JP 16403483U JP 16403483 U JP16403483 U JP 16403483U JP S6073264 U JPS6073264 U JP S6073264U
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
diode lamp
lead wire
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16403483U
Other languages
English (en)
Inventor
柴田　善彦
Original Assignee
舶用電球株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 舶用電球株式会社 filed Critical 舶用電球株式会社
Priority to JP16403483U priority Critical patent/JPS6073264U/ja
Publication of JPS6073264U publication Critical patent/JPS6073264U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85385—Shape, e.g. interlocking features

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の発光ダイオードランプの要部の断面図、
第２図は本考案の一実施例の発光ダイオードランプの断
面図、第３図及び第４図はその発光部の平面図及び第３
図ＩＶ−ＩＶ線截断側面図、第５図は発光ダイオードチ
ップ３とリード線１との接着部の断面図を示す。 １・・・・・・リード線、２・＝・・・・絶縁基台、３
・・・・・・発光ダイオードチップ、４・・・・・・導
電接着剤、５・・・・・・くぼみ。　　゛

Claims (1)

    【実用新案登録請求の範囲】
  1. リード線１を絶縁基台２にインサート成型によりモール
    ドし、その先端部に発光ダイオードチップ３を導電接着
    剤４により接着するものにおいて、リード線１における
    前記チップ３の接着面の一部にくぼみ５を形成したこと
    を特徴とする発光ダイオードランプ。
JP16403483U 1983-10-25 1983-10-25 発光ダイオ−ドランプ Pending JPS6073264U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16403483U JPS6073264U (ja) 1983-10-25 1983-10-25 発光ダイオ−ドランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16403483U JPS6073264U (ja) 1983-10-25 1983-10-25 発光ダイオ−ドランプ

Publications (1)

Publication Number Publication Date
JPS6073264U true JPS6073264U (ja) 1985-05-23

Family

ID=30359741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16403483U Pending JPS6073264U (ja) 1983-10-25 1983-10-25 発光ダイオ−ドランプ

Country Status (1)

Country Link
JP (1) JPS6073264U (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5664484A (en) * 1979-10-30 1981-06-01 Toshiba Corp Led device
JPS582079A (ja) * 1981-06-29 1983-01-07 Nippon Denyo Kk Ｌｅｄランプ及びその製法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5664484A (en) * 1979-10-30 1981-06-01 Toshiba Corp Led device
JPS582079A (ja) * 1981-06-29 1983-01-07 Nippon Denyo Kk Ｌｅｄランプ及びその製法

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