JPS6042899A - Method of producing electromagnetic wave shielding multilayer molded part - Google Patents

Method of producing electromagnetic wave shielding multilayer molded part

Info

Publication number
JPS6042899A
JPS6042899A JP15053783A JP15053783A JPS6042899A JP S6042899 A JPS6042899 A JP S6042899A JP 15053783 A JP15053783 A JP 15053783A JP 15053783 A JP15053783 A JP 15053783A JP S6042899 A JPS6042899 A JP S6042899A
Authority
JP
Japan
Prior art keywords
wave shielding
electromagnetic wave
molded product
conductive
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15053783A
Other languages
Japanese (ja)
Inventor
花原 勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Priority to JP15053783A priority Critical patent/JPS6042899A/en
Publication of JPS6042899A publication Critical patent/JPS6042899A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0011Electromagnetic wave shielding material

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は、電磁波遮蔽層を有する多層成形品を差圧成形
法と射出成形法を用いて一体化する電磁波遮蔽性多層成
形品の製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing an electromagnetic shielding multilayer molded article, in which a multilayer molded article having an electromagnetic shielding layer is integrated using a differential pressure molding method and an injection molding method.

従来、事務機器、電子計算機、TVレシーバ−などの電
子機器は、それ自体が電磁波の発生源となり得るもので
あり、また、周囲の電気機器によっても影響を受け、誤
動作やノイズの原因となっている。
Conventionally, electronic devices such as office equipment, computers, and TV receivers can themselves be sources of electromagnetic waves, and are also affected by surrounding electrical devices, causing malfunctions and noise. There is.

さらに、電子機器の筐体には、板金やアルミダイキャス
トなどが使用されていたが、この場合は電磁波による障
害はある程度防止でさた。
Furthermore, the housings of electronic devices used to be made of sheet metal or die-cast aluminum, but in this case interference from electromagnetic waves could be prevented to some extent.

しかしながら近年、成形の答易さ、耐蝕性自由なデずイ
ン、外観の良さ、軽さ、生産コストの底城などのメリッ
トより、プラスチック材料が電子機器の筐体に使用され
る例が増加している。
However, in recent years, plastic materials have been increasingly used for the housings of electronic devices due to their advantages such as ease of molding, flexible design with corrosion resistance, good appearance, light weight, and low production costs. ing.

プラスチック材料は一般に電気絶縁性が高く、電磁波に
対して透明である為に、そのままでは遮蔽効果が期待で
きないので、電子機器の筐体にプラスチック材料を用い
る場合は、遮蔽処理が必要となる。
Since plastic materials generally have high electrical insulation properties and are transparent to electromagnetic waves, no shielding effect can be expected if they are used as is. Therefore, when plastic materials are used for the housing of electronic devices, shielding treatment is required.

特に最近では、電子機器からの電磁波の放射に対して、
厳しく制限が加えられて居り、遮蔽処理に対する要求が
高まっている。
Especially recently, electromagnetic radiation from electronic devices has become
Severe restrictions are being imposed and demands on shielding treatments are increasing.

プラスチックに遮蔽効果を付与する方法として、従来よ
り■アルミ箔や導電テープの貼り合せ、■亜鉛溶射、■
導電性塗料、■シラスチックメッキ、■真空蒸着、■ス
パッタリング、■イオンシレーティング、■導電性フィ
ラー混入プラスチックコンパウンドなど数多(の方法が
検討されている。
Conventional methods for imparting a shielding effect to plastic include ■ laminating aluminum foil or conductive tape, ■ zinc spraying, and ■
A number of methods are being considered, including conductive paint, ■silastic plating, ■vacuum deposition, ■sputtering, ■ion silating, and ■plastic compounds mixed with conductive fillers.

まず、(1) アルミ箔や導電テープの貼り合せによる
遮蔽効果の付与は、作業に熟練を要する上に複雑な形状
に適さないなどの欠・点を有する。
First, (1) Providing a shielding effect by laminating aluminum foil or conductive tape has drawbacks such as requiring skill and being unsuitable for complex shapes.

(2) 亜鉛溶射や導電性塗料の塗工は現在量も一般的
に用いられる方法であるが、複雑な形状では膜厚が不均
一になる上に、密着性が不充分で、導電)−の剥落によ
り、火災の危険があるとされる。
(2) Zinc thermal spraying and coating with conductive paint are currently commonly used methods, but in complex shapes, the film thickness becomes uneven, and adhesion is insufficient, making it difficult to conductivity. There is a risk of fire due to flaking.

13+ 7’″ラスチツクメツキは、耐久性、密着性力
良好であるか、ペースとなるプラスチックに制限がある
。さらに、大型品に不向きなどの欠点を有する。
13+7''' rustic plating has good durability and adhesion, and there are restrictions on the plastic that can be used as a paste.Furthermore, it has drawbacks such as being unsuitable for large products.

(4)真空蒸着、スパッタリング、イオンシレーティン
グなどは蒸着技術の応用で、良好な遮蔽効果が得られる
が、装置が高価である上に、高度な技術が必要であるの
で、カマーシャルベースでは殆んど行なわれていない。
(4) Vacuum evaporation, sputtering, ion silating, etc. are applications of evaporation technology that can provide good shielding effects, but the equipment is expensive and requires advanced technology, so they are rarely used on a commercial basis It is not done often.

以上に述べて来た様な、ゾラスチ゛ンク成形品の表面に
導を層を形1iE L、電磁波遮蔽効果を付与する手法
に対して、(5)、導電性フィラーをシラス゛チック中
に分散複合化したit性プラスチ゛ンクの成形品は、導
電層の剥落による電磁波遮蔽効果の低下や、火災の危険
の心配はない。
In contrast to the above-mentioned method of forming a conductive layer on the surface of a solastic molded product to provide an electromagnetic shielding effect, (5) it is a method in which a conductive filler is dispersed and composited in a silastic. Plastic molded products do not have to worry about the conductive layer peeling off, reducing the electromagnetic shielding effect, or causing a fire hazard.

しかしなか、ら、この様な導電性プラスチック成形品は
、導電性フィラーを多量に加えなければ、電磁波の遮蔽
効果が上がらず、添加量を増加するとペースになるプラ
スチックの力学物性を損なったり、不良な外観となり、
更にコスト的にも非常に高価なものとなる、といった欠
点を有していた。
However, in such conductive plastic molded products, the electromagnetic wave shielding effect cannot be improved unless a large amount of conductive filler is added, and increasing the amount added may impair the mechanical properties of the plastic or cause defects. It has a beautiful appearance,
Furthermore, it has the disadvantage of being extremely expensive.

通常、射出成形品は生産性にすぐれ、安価に量産される
ため、多くの製品が開発されている。しかし、成形品が
大型化され、しかも重量軽減にともなう肉薄のものにな
ると、歪、曲がり及びヒケ等の不良現象を招く欠点があ
る。この欠点を解決すべく、成形&の肉厚を厚くし、成
形品の前記不良現象を取り除く低発泡成形品が開発され
ているが、この成形品は、外観が悪くかつ成形時間が長
くかかる問題点がある。また、電磁波遮蔽効果を上げる
ための導電材料を含有する熱可塑性樹脂も、前記の様な
射出成形品では、物性不足、外観不良及び着色性不良等
欠点があった。
Generally, injection molded products have excellent productivity and can be mass-produced at low cost, so many products have been developed. However, as molded products become larger and thinner due to weight reduction, they have the disadvantage of causing defects such as distortion, bending, and sink marks. In order to solve this drawback, a low-foam molded product has been developed that eliminates the above-mentioned defective phenomenon of the molded product by increasing the thickness of the molded wall, but this molded product has problems such as poor appearance and long molding time. There is a point. In addition, thermoplastic resins containing conductive materials for increasing the electromagnetic wave shielding effect also have drawbacks such as insufficient physical properties, poor appearance, and poor colorability in injection molded products as described above.

本発明は、かかる欠点を解決したものであり、導電性フ
ィラーを含有した熱可塑性樹脂と熱可塑性樹脂とを射出
成形及び差圧成形により一体化した成形品を得ることに
より、電気抵抗値のノ々う゛ンlキがなく、しかも表面
平滑性、着色性、二次加工性、強度にすぐれ、かつ、成
形品の歪、曲がり及びヒケのない電磁波遮蔽性多層成形
品の製造方法を提供するものである。すなわち、本発明
bs、熱可塑性樹脂に対して、1〜40容を俤の導電性
フィラーを含有させた導電熱可塑性樹脂シートを差圧成
形法にて成形品を得、該成形品の片面またヲ1両面に熱
可塑性樹脂を射出成形して一体となすことを特徴とする
The present invention solves these drawbacks, and by obtaining a molded product in which a thermoplastic resin containing a conductive filler and a thermoplastic resin are integrated by injection molding and differential pressure molding, the electrical resistance value can be improved. To provide a method for manufacturing an electromagnetic wave shielding multilayer molded product that has no blemishes, has excellent surface smoothness, colorability, secondary processability, and strength, and is free from distortion, bending, and sink marks of the molded product. It is. That is, according to the present invention, a conductive thermoplastic resin sheet containing 1 to 40 volumes of conductive filler is obtained by differential pressure molding to obtain a molded article, and one side of the molded article or (1) It is characterized by being integrally formed by injection molding thermoplastic resin on both sides.

本発明に用いられる導電熱可塑性樹脂のペースとなる樹
脂としては、硬質塩化ビニル樹脂、アクリル変性硬質塩
化ビニル樹脂、耐衝撃スチレン樹脂、AB8樹脂、エチ
レン樹脂、プロぎレン樹脂、ポリカーボネート樹脂、ス
チレン変性PPO樹脂及びポリアミド樹脂が用いられ、
これらにスチレン樹脂、エチレン−酢酸ビニル共重合樹
脂、エチレン−エチルアクリレート共重合樹脂、エチレ
ン−1−ブテンランダム共重合樹脂、ブタジェンが20
〜80重量係であるスチレン−シタジエンブロック共重
合体を混合することができる。
Resins that serve as the base of the conductive thermoplastic resin used in the present invention include hard vinyl chloride resin, acrylic-modified hard vinyl chloride resin, impact-resistant styrene resin, AB8 resin, ethylene resin, progylene resin, polycarbonate resin, and styrene-modified resin. PPO resin and polyamide resin are used,
These include styrene resin, ethylene-vinyl acetate copolymer resin, ethylene-ethyl acrylate copolymer resin, ethylene-1-butene random copolymer resin, and butadiene.
A styrene-citadiene block copolymer having a weight ratio of ~80% can be mixed.

更に、本発明の導電熱可塑性樹脂の性能を改良する為に
、酸化防止剤、安定剤、内部滑剤、外部滑剤、可塑剤、
などの加工助剤を温州する事もできる。
Furthermore, in order to improve the performance of the conductive thermoplastic resin of the present invention, antioxidants, stabilizers, internal lubricants, external lubricants, plasticizers,
It is also possible to weld processing aids such as.

次に、本発明に用いられる、導電性フィラーとし、ては
、カーボンブラック、グラファイト、金属化ガラス繊維
、金属繊維、金属フレーク、金属リボン、金属ウール、
金属粉、カーが7繊維、金属化カーボン繊維、銅グラフ
ト、アクリル繊維の内の一種又は2種以上が用いられる
Next, examples of the conductive filler used in the present invention include carbon black, graphite, metallized glass fiber, metal fiber, metal flake, metal ribbon, metal wool,
One or more of metal powder, carbon fiber, metallized carbon fiber, copper graft, and acrylic fiber are used.

導電性フィラーの添加量は、1〜40″容量チ、好まし
くは10〜60容量係であり、1容″kIt係未満では
電磁波遮蔽効果が殆んど得られず、40容isを超える
と押出成形が困離となり、力学的物性も劣るものと年る
The amount of conductive filler added is 1 to 40" volume, preferably 10 to 60 volume. If it is less than 1 volume, the electromagnetic wave shielding effect will hardly be obtained, and if it exceeds 40 volume, extrusion will be difficult. Molding becomes difficult, and the mechanical properties are also inferior.

また、本発明の表面層、すなわち、e縁層に搗。Further, the surface layer of the present invention, that is, the edge layer is coated.

いられる熱可塑性樹脂は、成形4品の密着性の問題から
、前記導電熱可塑性樹脂と同様なものが好ましく、異種
の樹脂を使用する場合は、接着に富んだ樹脂を混合する
必要がある。
The thermoplastic resin used is preferably the same as the above-mentioned conductive thermoplastic resin from the viewpoint of adhesion between the four molded products, and when using different types of resins, it is necessary to mix resins with high adhesion.

本発明に用いる差圧成形法とは、通常の真空成形、圧空
成形、真空/圧空成形のほか、エアースリップ成形、プ
ラグアシスト成形及び接触加熱圧空成形等の成形機であ
り、また射出成形としては、インラインスクリュ一方式
の成形機が一般的である。
The differential pressure molding method used in the present invention includes ordinary vacuum forming, pressure forming, vacuum/pressure forming, and other molding machines such as air slip molding, plug assist molding, and contact heating and pressure forming. , in-line screw one-type molding machines are common.

次に、本発明の多層成形品の電磁波遮蔽性を有する成形
品は、熱可塑性樹脂と導電性フィラーをバンバリーミキ
サ−1加圧ニーダ−、コニーダー、押出機等の混線機、
押出機にて混合、ペレット化した導電熱可塑性樹脂を押
出機に供給して単層シートラ押出すか、前記導電熱可塑
性樹脂を中心にその表層に、接着剤層を介すか介さない
で熱可塑性樹脂を共押出しする複合シートを差圧成形法
で成形することにより、作成される。シートの肉厚は、
0.6〜6.0へ好ましくは0.6〜4.0%程度であ
り、0.3%未満では、差圧成形品のコーナ一部が偏肉
しやすくかつ射出成形金型に装填後射出成形することに
よって変形が起り成形が困難になる。
Next, the multilayer molded product of the present invention having electromagnetic wave shielding properties is obtained by mixing the thermoplastic resin and the conductive filler with a mixer such as a Banbury mixer-1 pressure kneader, co-kneader, or extruder.
Either the conductive thermoplastic resin mixed and pelletized in an extruder is fed to the extruder and extruded into a single layer sheet, or the thermoplastic resin is added to the surface layer of the conductive thermoplastic resin with or without an adhesive layer. It is created by coextruding a composite sheet using differential pressure molding. The thickness of the sheet is
0.6 to 6.0, preferably about 0.6 to 4.0%; if it is less than 0.3%, part of the corner of the differential pressure molded product tends to have uneven thickness, and after being loaded into the injection mold. Injection molding causes deformation and makes molding difficult.

また6、0%を越えると差圧成形時間が長くなったり、
偏肉が大さくなって成形が困難となる。さらに複合シー
トの場合は、導電熱可塑性樹脂の占めるシート肉厚は、
全体の肉厚の5〜70%好ましくは10〜50チであり
、肉厚が5係未満では、押出時の製膜が困難となり、し
かも電磁波遮蔽効果が殆んど得られなくなる。また70
係を越えると、差圧成形が困難となる。
Also, if it exceeds 6.0%, the differential pressure molding time will become longer,
The uneven thickness becomes large and molding becomes difficult. Furthermore, in the case of composite sheets, the sheet wall thickness occupied by the conductive thermoplastic resin is
It is 5 to 70% of the total thickness, preferably 10 to 50 inches; if the thickness is less than 5 inches, it becomes difficult to form a film during extrusion, and moreover, the electromagnetic wave shielding effect is hardly obtained. 70 again
If this limit is exceeded, differential pressure molding becomes difficult.

このようにして得られた電磁波遮蔽性を有する成形品は
、射出成形品金型のキャビティまたはコアーに取付けら
れ、絶縁層に相当する熱可塑性樹脂を射出し、前記成形
品の表面及び内面を被覆し一体化する。
The thus obtained molded product having electromagnetic wave shielding properties is attached to the cavity or core of an injection mold, and a thermoplastic resin corresponding to an insulating layer is injected to cover the surface and inner surface of the molded product. and become one.

この様な製造方法で得られた、本発明の電磁波遮蔽性多
層成形品全体の肉厚は、2%〜8〜、好ましくは、3%
〜6X程度であり、肉厚が2〜未満では、成形品に、歪
、曲がりを生じたり、力学物性が不足し、一方肉厚が8
〜を超えると、成形品重量が重く、コスト的にも劣るも
のとなる。
The thickness of the entire electromagnetic wave shielding multilayer molded product of the present invention obtained by such a manufacturing method is 2% to 8%, preferably 3%.
~6X, and if the wall thickness is less than 2X, the molded product may become distorted, bent, or have insufficient mechanical properties;
If it exceeds ~, the weight of the molded product will be heavy and it will be inferior in terms of cost.

以下本発明を実施例により詳細に説明する。The present invention will be explained in detail below using examples.

実施例1〜3 耐衝撃性スチレン樹脂(電気化学工業■轡、商品名デン
カスチロールHI ’−8−2) 、エチレン−1−ブ
テンランダム共重合樹脂(三井石油化学工業■製、商品
名タフマーA−4085)、カーボンブラック(キャギ
ット社製、商品名パルカンxc −72)及びカーギン
ファイバー(東し■製、商品名トレカチョップドファイ
バーT−008A)を用い表に示す様な組成で配合し、
2.51パン/ぐリーミキサーで混練した後、粉砕機で
粉砕粒とした。
Examples 1 to 3 Impact-resistant styrene resin (manufactured by Denki Kagaku Kogyo ■, trade name: Denka Styrol HI'-8-2), ethylene-1-butene random copolymer resin (manufactured by Mitsui Petrochemical Industries, trade name: Tafmer A) -4085), carbon black (manufactured by Cagit Co., Ltd., trade name Palkan
2.51 After kneading with a pan/grill mixer, the mixture was made into pulverized grains with a pulverizer.

次に粉砕粒な408%φ押出機に供給し、160〜24
0℃で厚さ2%の単層シートを押出した。
Next, the crushed particles are fed to a 408%φ extruder, and
Monolayer sheets with a thickness of 2% were extruded at 0°C.

このシートを加熱真空成形機によりシート表面温度15
0℃、760111Hg、40秒で1001+1X10
0龍×50龍の筺体な成形した。
This sheet is heated to a sheet surface temperature of 15% using a heating vacuum forming machine.
0℃, 760111Hg, 1001+1X10 in 40 seconds
It was molded into a casing of 0 dragons x 50 dragons.

この筐体は、さらに射出成形金型コアーに取付けられ、
15オンス射出成形機により、温度120〜220℃、
射出圧力50 #I/cm”、成形時間40秒及び金型
温度40℃で耐衝撃性スチレン樹脂(′tM、気化学工
業■製、商品名デンカスチロールHI −8−2)を表
面に成形、一体化し、全体肉厚4%の多層成形品を得た
This housing is further attached to the injection mold core,
Temperature: 120-220℃ by 15oz injection molding machine,
At an injection pressure of 50 #I/cm'', a molding time of 40 seconds, and a mold temperature of 40°C, impact-resistant styrene resin ('tM, manufactured by Kikagaku Kogyo ■, trade name Denka Styrol HI-8-2) was molded on the surface. This was integrated to obtain a multilayer molded product with an overall wall thickness of 4%.

この多層成形品の物性は表に示す通り、電磁波遮蔽効果
、力学的物性及び外観共すぐれていた。
As shown in the table, the physical properties of this multilayer molded product were excellent in terms of electromagnetic shielding effect, mechanical properties, and appearance.

実施例4〜6 アクリロニトリルースチレンーゾタゾエン共重■製、商
品名アイシンメタルファイバー)ヲ用り、’+−た以外
は、全て実施例1と同様の操作を行い、全体肉厚4〜5
%の多層成形品を得た。この多層成形品の物性は、表に
示す通り、電磁波遮蔽効果、力学的物性及び外観共すぐ
れていた。
Examples 4 to 6 The same operations as in Example 1 were performed except for using acrylonitrile-styrene-zotazoene copolymer (product name: Aisin Metal Fiber), and the overall thickness was 4 to 4. 5
% multilayer molded product was obtained. As shown in the table, the physical properties of this multilayer molded product were excellent in terms of electromagnetic shielding effect, mechanical properties, and appearance.

実施例7 実施例1の電磁波遮蔽層の代わりに′屯磁波遮蔽層と表
皮層とからなる三層シートを用いた以外は、実施例1と
同様な操作を行い、全体肉厚5%の成形品を得た。この
多層成形品の物性は、表に示す通り、電磁波遮蔽効果、
力学的物性及d外観共すぐれていた。
Example 7 The same operation as in Example 1 was performed except that a three-layer sheet consisting of a magnetic wave shielding layer and a skin layer was used instead of the electromagnetic wave shielding layer of Example 1, and a molding with an overall thickness of 5% was performed. I got the item. As shown in the table, the physical properties of this multilayer molded product include electromagnetic shielding effect,
Both mechanical properties and appearance were excellent.

比較例1〜2 導電性フィラーの添加量が、請求の範囲以外としに以外
は、実施例1と同様の操作を行った。多層成形品の物性
は表に示す通り、電磁波遮蔽効果−力学的物性のいづれ
かが劣っていた。
Comparative Examples 1 and 2 The same operation as in Example 1 was performed except that the amount of conductive filler added was outside the claimed range. As shown in the table, the physical properties of the multilayer molded product were poor in either the electromagnetic wave shielding effect or the mechanical properties.

比較例3〜4 実施例の電磁波遮蔽層の単層及び複合層のみの成形品を
得た。この成形品の物性は表に示す通り、力学的物性、
外観が劣っている。
Comparative Examples 3 to 4 Molded products having only a single layer and a composite layer of the electromagnetic shielding layer of Examples were obtained. As shown in the table, the physical properties of this molded product are mechanical properties,
Poor appearance.

表中の略語は、次の通りである。The abbreviations in the table are as follows.

l) HI−PS :耐衝撃スチレン樹脂、[電気化学
工業■製、商品名デンカスチロール、 HI−8−2J
2)AB8:アクリロニトリルースチレンーゾタシエン
共重合樹脂「電気化学工業■製、商品名デンカABS、
GR−2QOOJ 3)タフマー:エチレン−1−−fテンランダム共重合
樹脂、[三井石油化学工業■製、商品名、タフマーA−
4085J 4)カーポンプラック:キャボット社製、商品名、パル
カンxc −72 5)カーボンファイバー二乗し■製、商品名トレカチョ
ップドファイバーT−008A 6)真鍮ファイバーニア゛イシン精機特製、商品名アイ
シンメタルファイバー 実施例及び比較例に示す成形島物性は、下記の方式によ
り測定を行なった。
l) HI-PS: Impact-resistant styrene resin, [manufactured by Denki Kagaku Kogyo ■, trade name Dencastyrol, HI-8-2J]
2) AB8: Acrylonitrile-ru-styrene-zotashiene copolymer resin “manufactured by Denki Kagaku Kogyo ■, trade name Denka ABS,
GR-2QOOJ 3) Tafmer: Ethylene-1-f ten random copolymer resin, [manufactured by Mitsui Petrochemical Industries ■, trade name, Tafmer A-
4085J 4) Car pump rack: Manufactured by Cabot, trade name, Palkan The physical properties of the molded islands shown in Examples and Comparative Examples were measured by the following method.

(11電磁波遮蔽効果:デンカ法により、図面に示−r
vL磁波遮蔽効果測定装置を使用し、トラッキングジェ
ネレータにて励起した高周波電圧な発信アンテナに印加
し、試料を介して受信した受信電圧と発信電圧との比を
スペクトラムアナライザーにて測定した。
(11 Electromagnetic wave shielding effect: As shown in the drawing by the Denka method.
Using a vL magnetic wave shielding effect measurement device, a high frequency voltage excited by a tracking generator was applied to a transmitting antenna, and the ratio of the received voltage received through the sample to the transmitted voltage was measured with a spectrum analyzer.

(2) 引張強度: JIS K −6871準拠法(
3) 曲げ弾性率: ASTM鵞−790準拠法(4)
 アイゾツト衝撃強度: JIS K −6871準拠
法(5) 落錘衝撃強度: JIS −K −7211
準拠法、荷重2に9
(2) Tensile strength: JIS K-6871 compliant method (
3) Flexural modulus: ASTM E-790 compliant method (4)
Izotsu impact strength: JIS K-6871 compliant method (5) Falling weight impact strength: JIS-K-7211
Applicable law, load 2 to 9

【図面の簡単な説明】[Brief explanation of the drawing]

図面は、本発明のプラスチック成形体の電磁波遮蔽効果
の測定装置の概略図である。 符号 1・・・シールド4ぐツクス、2・・・プラスチック成
形品、3・・・発信アンテナ、4・・・受信アンテナ、
5・・・スペクトラムアナライザー、6・・・トラッキ
ングジェネレーター 特許出願人 電気化学工業2株式会社 手続補正書 昭和58勺Ojゲ1月26日 特許庁長官若杉和夫殿 1、事件の表示 3、補正をする者 事件との関係 特許出願人 住所 東京都千代田区有楽町1丁目4番1号明細書の発
明の詳細な説明の欄 5、補正の内容 1)、明細薔第9貢第7行、第10頁第6行及び第10
頁第6行目の「HニーS−2」を「HニーS−3」と訂
正する。
The drawing is a schematic diagram of an apparatus for measuring the electromagnetic wave shielding effect of a plastic molded article according to the present invention. Code 1... Shield 4 gears, 2... Plastic molded product, 3... Transmitting antenna, 4... Receiving antenna,
5... Spectrum analyzer, 6... Tracking generator Patent applicant: Denki Kagaku Kogyo 2 Co., Ltd. Procedural amendment document January 26, 1982, Mr. Kazuo Wakasugi, Commissioner of the Japan Patent Office 1, Indication of case 3, Make amendments Relationship with the case Patent applicant address 1-4-1 Yurakucho, Chiyoda-ku, Tokyo Column 5 of the detailed explanation of the invention in the specification, content of amendment 1), Part 9, line 7, page 10 of the specification 6th row and 10th row
"H Knee S-2" on the 6th line of the page is corrected to "H Knee S-3".

Claims (1)

【特許請求の範囲】[Claims] 熱可塑性樹脂に対して、1〜40容量係の導電性フィシ
−を含有させた導電熱可塑性樹脂シートを差圧成形法に
て成形品を得、該成形品の片面または両面に熱可塑性樹
脂を射出成形して一体となすことを特徴とする電磁波遮
蔽性多層成形品の製造方法。
A conductive thermoplastic resin sheet containing 1 to 40 volumetric conductive fissies is obtained by differential pressure molding to obtain a molded article, and one or both sides of the molded article are coated with thermoplastic resin. A method for producing an electromagnetic wave shielding multilayer molded product, which is made into one piece by injection molding.
JP15053783A 1983-08-18 1983-08-18 Method of producing electromagnetic wave shielding multilayer molded part Pending JPS6042899A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15053783A JPS6042899A (en) 1983-08-18 1983-08-18 Method of producing electromagnetic wave shielding multilayer molded part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15053783A JPS6042899A (en) 1983-08-18 1983-08-18 Method of producing electromagnetic wave shielding multilayer molded part

Publications (1)

Publication Number Publication Date
JPS6042899A true JPS6042899A (en) 1985-03-07

Family

ID=15499033

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15053783A Pending JPS6042899A (en) 1983-08-18 1983-08-18 Method of producing electromagnetic wave shielding multilayer molded part

Country Status (1)

Country Link
JP (1) JPS6042899A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62216300A (en) * 1986-03-17 1987-09-22 株式会社イナックス Manufacture of conductive nonwoven fabric composite molded board
JPH01114405A (en) * 1987-10-28 1989-05-08 Taigaasu Polymer Kk Electromagnetic wave shielding case and its production

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62216300A (en) * 1986-03-17 1987-09-22 株式会社イナックス Manufacture of conductive nonwoven fabric composite molded board
JPH0213960B2 (en) * 1986-03-17 1990-04-05 Inax Corp
JPH01114405A (en) * 1987-10-28 1989-05-08 Taigaasu Polymer Kk Electromagnetic wave shielding case and its production

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